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11511 results about "Wire rod" patented technology

Multi-layer braided structures for occluding vascular defects

ActiveUS20070265656A1Rapid hemostasisHigh metal densityStentsHeart valvesBody organsWire rod
A collapsible medical device and associated methods of occluding an abnormal opening in, for example, a body organ, wherein the medical device is shaped from plural layers of a heat-treatable metal fabric. Each of the fabric layers is formed from a plurality of metal strands and the assembly is heat-treated within a mold in order to substantially set a desired shape of the device. By incorporating plural layers in the thus-formed medical device, the ability of the device to rapidly occlude an abnormal opening in a body organ is significantly improved.
Owner:ST JUDE MEDICAL CARDILOGY DIV INC

Biocompatible wires and methods of using same to fill bone void

InactiveUS20050015148A1Reduce compression fractureInternal osteosythesisSpinal implantsWire rodBone structure
Devices, kits, and methods are provided for reducing a bone fracture, e.g., a vertebral compression fracture, is provided. The device comprises a plurality of resilient wires composed of a biocompatible material, such as a biocompatible polymer (e.g., polymethylmethacrylate (PMMA)). The wires can be introduced into the cavity of the bone structure to form a web-like arrangement therein. The web-like arrangement can be stabilized by applying uncured bone cement onto the arrangement to connect the wires at their contacts point. The bone cavity can then be filled with a bone growth enhancing medium.
Owner:BOSTON SCI SCIMED INC

Halo Wire Fluid Seal Device for Prosthetic Mitral Valves

InactiveUS20140379076A1Heart valvesWire rodProsthesis
This invention relates to a self-expanding pre-configured compressible transcatheter prosthetic cardiovascular valve that comprises an atrial halo fluid sealing device mounted on a self-expanding inner wire frame having a leaflet structure comprised of articulating leaflets that define a valve function, said inner wire frame is disposed within a self-expanding annular tissue-covered outer wire frame, said outer wire frame having an articulating collar, forming a multi-component prosthetic valve assembly for anchoring within the mitral valve or triscuspid valve of the heart, and methods for deploying such a valve for treatment of a patient in need thereof
Owner:TENDYNE HLDG

Adjustable width product display system

An adjustable width product display system which includes spaced-apart front and back display supports formed of an engineering plastic material, suitable for food freezer environments. Formed wire side elements, provided with transversely extending mounting portions, are slideably received in transversely disposed recesses in the plastic display supports. Each display support includes a pair of closely adjacent, parallel recesses for receiving the mounting portions in overlapping relation, providing a wide range of width adjustment to accommodate packages of different size. A wire frame, comprising a pair of elongated wire elements extending from front to back of the display system joins the two display supports in spaced relation. These wire elements also function as an underneath support for product packages confined between the side elements. Laterally adjacent elements can be connected in series by intermediate wire side supports provided with transverse mounting elements extending in opposite directions and engagable in plastic display supports on both sides. Product pusher means are easily incorporated into the product display system either in the form of a preassembled pusher device, or the use of a spring-driven pusher sled mounted on the wire elements connecting the front and back display supports. The system, is ideally suited for food freezer environment, because plastic materials are minimally present in the structure and thus can be of a suitable engineering grade material. Additionally, the open wire structure accommodates free circulation of air in a freezer compartment to help maintain the desired environment throughout the compartment.
Owner:TRION IND

Welding training systems and devices

A welding tool includes a first handle and a second handle. The welding tool also includes a torch nozzle holder configured to hold a nozzle of a welding torch therein, and to block the nozzle from extending therethrough. The welding tool includes a blade assembly positioned a predetermined distance from the torch nozzle holder. The blade assembly is configured to cut welding wire extending through the blade assembly to calibrate wire stickout from the welding torch to the predetermined distance.
Owner:ILLINOIS TOOL WORKS INC

Method for reducing stent weld profiles and a stent having reduced weld

A method for making an implantable stent includes the steps of (i) providing a plurality of elongate stent wires; (ii) forming said wires into a hollow tubular structure having opposed first and second open ends; (iii) terminating said wires at the second end; (iv) aligning the wires at the second end into a plurality of mated adjacent wires to define a plurality of abutting regions; (v) welding the mated adjacent wires to one and the other at the abutting regions to define a plurality of welds; and optionally (vi) chemically or electro-chemically removing a portion of the welds. The method may further include the steps of (a) extending at least one of the mated stent wires to provide an extended stent wire; (b) looping the extended stent wire so the extended end abuts a proximal pair of stent wires; and (c) welding the extended and looped wire to the proximal pair of wires. The step of looping may include the forming of the wire into a equilaterally arched loop having an apex, but not having other sharp bends.
Owner:BOSTON SCI SCIMED INC

Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus

A wire loop comprises a wire connecting a first bonding point and a second bonding point therethrough, wherein the wire has a crushed part formed therein by crushing the part of the wire and a top of a ball bonded to the first bonding point with a capillary. The wire loop is formed by a wire bonding method which includes: bonding the wire to the first bonding point; moving the capillary horizontally and vertically while carrying out loop control; bonding the wire to the vicinity of the top of the ball bonded to the first bonding point; and thereafter, moving the capillary horizontally and vertically to the second bonding point while delivering the wire and carrying out loop control, and then bonding the wire to the second bonding point.
Owner:KAIJOO KK

Wire for removing foreign matter in blood vessel and medical device using the wire

Disclosed herein is a wire for removing foreign matter such as an embolus in a blood vessel. The wire includes a flexible elongated wire body and first and second holding portions provided at the front end of the wire body in spaced relationship with each other. The first and second holding portions are movable relative to each other in a longitudinal direction of the wire body. In operation, the first and second holding portions are moved relative to each other to reduce the distance between the first and second holding portions, thereby holding the foreign matter therebetween. Accordingly, the foreign matter in the blood vessel can be caught and removed reliably irrespective of the size of the foreign matter.
Owner:TERUMO KK

Spring feed shelf display with lateral adjustment

A product display for displaying and supporting a product or plurality of products. The product display includes a base having a longitudinal axis, a pusher slidable along the longitudinal axis of the base, a first side wire laterally adjustable relative to the base assembly, and second side wire laterally adjustable relative to the base assembly. The product display may also include a stop member coupled to the base to limit laterally-outward adjustment of both the first side wire and the second side wire. Further, the first side wire may be substantially identical.
Owner:CHICAGO DISPLAY MARKETING

Adjustable fixation clamp and method

An adjustable fixation clamp having first and second clamp assemblies positioned about a shaft. The clamp assemblies may each have a pair of vise plates. Each pair of vise plates may define at least two receiving portions and insertion portions intersecting the receiving portions. The receiving portions of one clamp assembly may receive at least two fixation components such as screws, pins or wires. The receiving portions of the other clamp assembly may receive at least one connector such as a rod, bar and / or ring. A biasing structure may be positioned between the first and second clamp assemblies and may allow for the fixation components to be snapped into the receiving portions through the insertion portions. Two or more adjustable fixation clamps may be used to form an external fixation system. At least two screws, pins or wires may be inserted into bone and one of the clamp assemblies may be attached thereto. A guide may be used for insertion of screws, pins or wires into bone. The other clamp assembly may be connected to a rod, bar or ring. Thereafter, the clamp assemblies may be oriented relative to each other and locked in place.
Owner:DEPUY SYNTHES PROD INC

Interface device and method for interfacing instruments to medical procedure simulation systems

An interface device and method for interfacing instruments to a medical procedure simulation system serve to interface peripherals in the form of mock medical instruments to the medical procedure simulation system computer to enable simulation of medical procedures. The interface device includes a housing having a mock bodily region of interest to facilitate insertion of a mock instrument, such as an endoscope tube, into the interface device. The mock bodily region of interest may be pivotable to simulate various patient orientations. The instrument is engaged by a capture mechanism in order to measure rotational and translational motion of the instrument. An actuator is disposed within the interface device to provide force feedback to the instrument. The measured motion is provided to the computer system to reflect instrument motion on the display during the simulation. Alternatively, the interface device may be configured to accommodate instrument assemblies having a plurality of nested instruments (e.g., sheath, catheter and wire), whereby the interface device individually grasps, measures manipulation of and provides force feedback to the nested instruments. In addition, the interface device may be configured to simultaneously accommodate a plurality of independently inserted instruments.
Owner:IMMERSION MEDICAL

Medical treatment system and suturing method

A medical treatment system including an endoscope, a treatment tool that is inserted in a channel of the endoscope, and a holder that holds the treatment tool in a manner that enables a user who operates the endoscope to move the treatment tool forward and backward and rotate the treatment tool, with the treatment tool having a treatment portion that performs treatment on a living body; a wire for operating the treatment portion whose distal end is connected to the treatment portion; a sheath portion that has a first sheath that is formed with a coil and in which the wire is inserted in a manner capable of moving forward and backward in the axial direction, and a second sheath that is formed with a coil of a plurality of layers and provided on the outside of the first sheath; and an operating portion to which the base end of the wire is connected and enables forward / backward and rotation operation of the wire; and with the holder holding the operating portion so as to be in a predetermined positional relation with respect to the endoscope.
Owner:OLYMPUS MEDICAL SYST CORP

Flexible LED cable light

A flexible LED cable light has a flat insulation body, at least two wires embedded in parallel in the insulation body, multiple LEDs connected in parallel electrically to the two wires and a protective layer covering the insulation body. Each wire has high flexibility, good conductivity and large current-resistant that is suitable to decorate over long distances. Furthermore, segments of the cable light can also be connected to another segment by a connector so the present invention is waterproof, inexpensive, cuttable, joinable, etc.
Owner:CASHWARE TECH

High density integrated circuit apparatus, test probe and methods of use thereof

InactiveUS20050062492A1High performance functional testingHigh-temperature burnElectrical measurement instrument detailsManufacture of electrical instrumentsConvertersContact pad
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
Owner:GLOBALFOUNDRIES INC

Flexible display device with wire having reinforced portion and manufacturing method for the same

There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and / or utilize the side surface of an assembled flexible display.
Owner:LG DISPLAY CO LTD

Angled flying lead wire bonding process

A method is described having the steps of providing a surface having a plurality of wire bondable locations, wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.
Owner:GLOBALFOUNDRIES INC

Embolic filter frame having looped support strut elements

An improved embolic filter frame having looped support struts. The frame configuration provides enhanced longitudinal compliance, improved sealing against a vessel wall, low profile delivery, and a short deployed length. The looped support struts have a high degree of “radial” stiffness with a low degree of “longitudinal” stiffness. In the deployed state, the frame exerts a relatively high stress onto a vessel wall to maintain an effective seal, yet remains compliant in the longitudinal direction. Minor displacements of the support wire or catheter are therefore not translated to the filter. The looped support struts elongate when tensioned and assume a compressed and essentially linear form. While constrained in this linear state by a delivery catheter, the support struts exert minimal stress onto the delivery system. The overall delivery profile and stiffness are therefore reduced. When the delivery catheter constraint is removed during deployment, the struts “snap open” and assume a looped configuration which exert a high degree of force onto the vessel wall, creating an enhanced filter to vessel wall seal. In addition, the looped struts and the central collar connecting the support struts to the support wire, are positioned essentially within the plane of the filter opening. The overall deployed length of the embolic filter is therefore reduced.
Owner:WL GORE & ASSOC INC

High density integrated circuit apparatus, test probe and methods of use thereof

InactiveUS20080048697A1High performance functional testingHigh temperature burn in applicationsElectrical measurement instrument detailsManufacture of electrical instrumentsElastomerContact pad
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
Owner:GLOBALFOUNDRIES INC

High density integrated circuit apparatus, test probe and methods of use thereof

InactiveUS20080047741A1High performance functional testingHigh temperature burn in applicationsElectrical measurement instrument detailsElectrical testingElastomerContact pad
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
Owner:GLOBALFOUNDRIES INC

High density integrated circuit apparatus, test probe and methods of use thereof

InactiveUS20080048690A1High performance functional testingHigh temperature burn in applicationsElectrical measurement instrument detailsManufacture of electrical instrumentsElastomerContact pad
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
Owner:GLOBALFOUNDRIES INC
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