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172 results about "Dense array" patented technology
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A dense array allows programmers to efficiently declare an array when the initial values of the array is known beforehand. Dense arrays are supported in all major browsers.
Methods and apparatus for measuring analytes using large scale FET arrays
ActiveUS7948015B2Reduce porosityHigh densityTransistorMicrobiological testing/measurementCMOSOrganismal Process
Methods and apparatus relating to very large scale FET arrays for analyte measurements. ChemFET (e.g., ISFET) arrays may be fabricated using conventional CMOS processing techniques based on improved FET pixel and array designs that increase measurement sensitivity and accuracy, and at the same time facilitate significantly small pixel sizes and dense arrays. Improved array control techniques provide for rapid data acquisition from large and dense arrays. Such arrays may be employed to detect a presence and / or concentration changes of various analyte types in a wide variety of chemical and / or biological processes. In one example, chemFET arrays facilitate DNA sequencing techniques based on monitoring changes in hydrogen ion concentration (pH), changes in other analyte concentration, and / or binding events associated with chemical processes relating to DNA synthesis.
Owner:LIFE TECH CORP
Multi-headed decoder structure utilizing memory array line driver with dual purpose driver device
A memory array decoder organization readily interfaces to array lines having extremely dense pitch, and in particular interfaces to extremely dense array lines of a three-dimensional memory array. In an exemplary embodiment, a multi-headed decoder includes a group of array line driver circuits associated with a single decode node. Each array line driver circuit couples its associated array line through a first device to an associated upper bias node which is generated to convey either a selected bias condition or an unselected bias condition thereon appropriate for the array line. Each array line driver circuit also couples its associated array line through a second device to an associated lower bias node which is generated to convey an unselected bias condition appropriate for the array line. The array line driver circuits for several different decode nodes may be physically arranged in one or more banks.
Owner:SANDISK TECH LLC
Method, system, program, and data structure for a dense array storing character strings
InactiveUS6470347B1Reduce in quantityLess storage spaceData processing applicationsDigital data information retrievalArray data structureTheoretical computer science
Disclosed is a system, method, and program for generating a data structure in computer memory for storing strings, such as words in a dictionary. Each string includes at least one character from a set of characters. An arrangement of nodes is determined to store the characters such that the arrangement of the nodes is capable of defining a tree structure. An array data structure is generated to store the nodes. The array includes a row for each node and a column for each character in the set of characters. A non-empty cell identifies a node for the character indicated in the column of the cell that has descendant nodes in the row indicated in the cell content for the node. The array data structure is processed to eliminate at least one row in the array data structure to reduce a number of bytes needed to represent the array data structure. In this way, the array data structure following the processing requires less bytes of storage space then before the processing.
Owner:IBM CORP
Methods and apparatus for pathogen detection and analysis
Methods and apparatus for implementing microfluidic analysis devices are provided. A monolithic elastomer membrane associated with an integrated pneumatic manifold allows the placement and actuation of dense arrays of a variety of fluid control structures, such as structures for isolating, routing, merging, splitting, and storing volumes of fluid. The fluid control structures can be used to implement a pathogen detection and analysis system including integrated immunoaffinity capture and analysis, such as polymerase chain reaction (PCR) and capillary electrophoresis (CE) analysis. An analyte solution can be input into the device and pumped through a series of immunoaffinity capture matrices in microfabricated chambers having antibodies targeted to the various classes of microbiological organisms such as bacteria, viruses and bacterial spores. The immunoaffinity chambers can capture, purify, and concentrate the target for further analysis steps.
Owner:RGT UNIV OF CALIFORNIA
Methods and apparatus for measuring analytes using large scale fet arrays
ActiveUS20110217697A1Constant voltageFacilitate rapid acquisition of dataWeather/light/corrosion resistanceMicrobiological testing/measurementCMOSOrganismal Process
Methods and apparatus relating to very large scale FET arrays for analyte measurements. ChemFET (e.g., ISFET) arrays may be fabricated using conventional CMOS processing techniques based on improved FET pixel and array designs that increase measurement sensitivity and accuracy, and at the same time facilitate significantly small pixel sizes and dense arrays. Improved array control techniques provide for rapid data acquisition from large and dense arrays. Such arrays may be employed to detect a presence and / or concentration changes of various analyte types in a wide variety of chemical and / or biological processes. In one example, chemFET arrays facilitate DNA sequencing techniques based on monitoring changes in the concentration of inorganic pyrophosphate (PPi), hydrogen ions, and nucleotide triphosphates.
Owner:LIFE TECH CORP
Method for manufacturing high density non-volatile magnetic memory
ActiveUS20130244344A1Reduce programming currentReduced dimensionNanomagnetismNanoinformaticsFeature DimensionLithographic artist
Methods of fabricating MTJ arrays using two orthogonal line patterning steps are described. Embodiments are described that use a self-aligned double patterning method for one or both orthogonal line patterning steps to achieve dense arrays of MTJs with feature dimensions one half of the minimum photo lithography feature size (F). In one set of embodiments, the materials and thicknesses of the stack of layers that provide the masking function are selected so that after the initial set of mask pads have been patterned, a sequence of etching steps progressively transfers the mask pad shape through the multiple mask layer and down through all of the MTJ cell layers to the form the complete MTJ pillars. In another set of embodiments, the MTJ / BE stack is patterned into parallel lines before the top electrode layer is deposited.
Owner:AVALANCHE TECH
High density integrated circuit apparatus, test probe and methods of use thereof
InactiveUS20070271781A9High performance functional testingHigh-temperature burnElectrically conductive connectionsElectronic circuit testingElastomerElectricity
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed ion the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
Owner:GLOBALFOUNDRIES INC
High density integrated circuit apparatus, test probe and methods of use thereof
InactiveUS20080106291A1High performance functional testingHigh temperature burn in applicationsElectronic circuit testingElectrical measurement instrument detailsElastomerElectricity
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer forms or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer. The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
Owner:GLOBALFOUNDRIES INC
High density integrated circuit apparatus, test probe and methods of use thereof
InactiveUS20080048697A1High performance functional testingHigh temperature burn in applicationsElectrical measurement instrument detailsManufacture of electrical instrumentsElastomerContact pad
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
Owner:GLOBALFOUNDRIES INC
High density integrated circuit apparatus, test probe and methods of use thereof
InactiveUS20080047741A1High performance functional testingHigh temperature burn in applicationsElectrical measurement instrument detailsElectrical testingElastomerContact pad
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
Owner:GLOBALFOUNDRIES INC
High density integrated circuit apparatus, test probe and methods of use thereof
InactiveUS20080048690A1High performance functional testingHigh temperature burn in applicationsElectrical measurement instrument detailsManufacture of electrical instrumentsElastomerContact pad
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
Owner:GLOBALFOUNDRIES INC
High density integrated circuit apparatus, test probe and methods of use thereof
InactiveUS20080048691A1High performance functional testingHigh temperature burn in applicationsElectrical measurement instrument detailsElectrical testingElastomerContact pad
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
Owner:GLOBALFOUNDRIES INC
Methods and apparatus for measuring analytes using large scale fet arrays
ActiveUS20120247977A1Facilitate rapid acquisition of dataSmall sizeBioreactor/fermenter combinationsBiological substance pretreatmentsCMOSOrganismal Process
Methods and apparatus relating to very large scale FET arrays for analyte measurements. ChemFET (e.g., ISFET) arrays may be fabricated using conventional CMOS processing techniques based on improved FET pixel and array designs that increase measurement sensitivity and accuracy, and at the same time facilitate significantly small pixel sizes and dense arrays. Improved array control techniques provide for rapid data acquisition from large and dense arrays. Such arrays may be employed to detect a presence and / or concentration changes of various analyte types in a wide variety of chemical and / or biological processes. In one example, chemFET arrays facilitate DNA sequencing techniques based on monitoring changes in the concentration of inorganic pyrophosphate (PPi), hydrogen ions, and nucleotide triphosphates.
Owner:LIFE TECH CORP
High density integrated circuit apparatus, test probe and methods of use thereof
InactiveUS20080100316A1High performance functional testingHigh temperature burn in applicationsManufacture of electrical instrumentsMeasurement leads/probesElastomerContact pad
Owner:GLOBALFOUNDRIES INC
Fast signal detection and distributed computing in portable computing devices
ActiveUS20060031684A1Quick checkElectric signal transmission systemsDigital data processing detailsModel parametersImpulse function
This disclosure describes a distributed reader architecture for a mobile computing device such as cellular telephone handset. This architecture includes a reader library that reads device capabilities and business model parameters in the device, and in response, for selects an appropriate configuration of reader modules for identifying a content item. The reader modules each perform a function used in identifying a content item. The modules are selected so that the resources available on the device and in remote devices are used optimally, depending on available computing resources on the device and network bandwidth. One example of a reader module is a fast watermark detection module that quickly detects the presence of a watermark, enabling resources to be focused on portions of content that are most likely going to lead to successful content identification. A watermark signal structure for fast watermark detection is comprised of a dense array of impulse functions in a form of a circle in a Fourier magnitude domain, and the impulse functions having pseudorandom phase. Alternative structures are possible.
Owner:DIGIMARC CORP
Methods and Apparatus for Detecting Molecular Interactions Using FET Arrays
ActiveUS20120088682A1Facilitate rapid acquisition of dataImprove signal-to-noise ratioTransistorWeather/light/corrosion resistanceCMOSAnalyte
Methods and apparatuses relating to large scale FET arrays for analyte detection and measurement are provided. ChemFET (e.g., ISFET) arrays may be fabricated using conventional CMOS processing techniques based on improved FET pixel and array designs that increase measurement sensitivity and accuracy, and at the same time facilitate significantly small pixel sizes and dense arrays. Improved array control techniques provide for rapid data acquisition from large and dense arrays. Such arrays may be employed to detect a presence and / or concentration changes of various analyte types in a wide variety of chemical and / or biological processes.
Owner:LIFE TECH CORP
Hierarchically-dimensioned-microfiber-based dry adhesive materials
InactiveUS20050271870A1Film/foil adhesivesDecorative surface effectsHigh dimensionalAdhesive materials
Embodiments of the present invention include hierarchically-dimensioned, microfiber-based dry adhesive materials featuring dense arrays of microfibers with free tips terminating in numerous microfibrils. In certain embodiments, more than two levels of microfiber-dimension hierarchy may be employed, each dimension involving smaller microfibrils emanating from the tips of the microfibers or microfibrils of the next highest dimensional level. Various additional embodiments of the present invention are directed to methods for preparing hierarchically-dimensioned, microfiber-based dry adhesive materials. These methods include single-pass or multi-pass imprint-lithography, pattern masking and etching, and imprinting fiber-embedded substrates followed by etching.
Owner:HEWLETT PACKARD DEV CO LP
High density LED array
ActiveUS7071493B2Improved matingHigh bulk densitySolid-state devicesSemiconductor devices for light sourcesHigh densityLed array
A dense array of semiconductor devices having an array of micro-reflectors, the micro-reflectors having characteristics that enhance dense packing of the array in balance with collection and collimation of the array's radiant output.
Owner:SILICON VALLEY BANK
High Densitiy Interactive Media Guide
InactiveUS20090210910A1Easy to readIncrease the amount of informationTelevision system detailsColor television detailsHigh densityComputer graphics (images)
A high density interactive media guide interface provides for the selection of a source from a dense array of available sources by displaying an array of available sources in a dense format that illustrates the availability of a high number of sources and expanding the display of selected sources to provide additional information regarding that source. “Clickless selection” is provided by either positioning the cursor over the desired selection or positioning the desired selection under a pre-designated position.
Owner:THOMSON LICENSING SA
Electronic assembly having semiconductor component with polymer support member and method of fabrication
A semiconductor component includes a substrate, bonding pads on the substrate, and external contacts bonded to the bonding pads. Exemplary external contacts include solder balls, solder bumps, solder columns, TAB bumps and stud bumps. Preferably the external contacts are arranged in a dense array, such as a ball grid array (BGA), or fine ball grid array (FBGA). The component also includes a polymer support member configured to strengthen the external contacts, absorb forces applied to the external contacts, and prevent separation of the external contacts from the bonding pads. In a first embodiment, the polymer support member comprises a cured polymer layer on the substrate, which encompasses the base portions of the external contacts. In a second embodiment, the polymer support member comprises support rings which encompass the base portions of the external contacts. In either embodiment the polymer support member transfers forces applied to the external contacts away from the interface with the bonding pads, and into the center of the contacts.
Owner:MICRON TECH INC
High speed high-density connector with modular structure for back board
InactiveCN101330172AStable structureCompact structureCoupling protective earth/shielding arrangementsInterference fitState of art
The invention provides a high-speed high-density backboard connector with a modularized structure. The electric connector comprises a pore connector and a pin connector, wherein the pore connector comprises a casing, a cover plate and a plurality of veneer sheet components; and the pin connector comprises a pedestal, a laterally-grounded shielding piece and differential pair signal pin units. The pin connector adopts the modularized structure. The differential signal pin units and the laterally-grounded shielding piece are arranged in the pedestal in a dense array. The modularized structure is fixed in the pin connector by adopting the interference fit or the double-wedge. Compared with the prior art, the backboard connector has the advantages of stable, compact and easily-expansible structure, complementary shielding and high-density and high-quality signal running characteristic.
Owner:GUIZHOU SPACE APPLIANCE CO LTD
Methods for operating chemically-sensitive sample and hold sensors
ActiveUS8496802B2Facilitate rapid acquisition of dataSmall sizeTransistorWeather/light/corrosion resistanceCMOSAnalyte
Methods and apparatus relating to very large scale FET arrays for analyte measurements. ChemFET (e.g., ISFET) arrays may be fabricated using conventional CMOS processing techniques based on improved FET pixel and array designs that increase measurement sensitivity and accuracy, and at the same time facilitate significantly small pixel sizes and dense arrays. Improved array control techniques provide for rapid data acquisition from large and dense arrays. Such arrays may be employed to detect a presence and / or concentration changes of various analyte types in a wide variety of chemical and / or biological processes. In one example, chemFET arrays facilitate DNA sequencing techniques based on monitoring changes in hydrogen ion concentration (pH), changes in other analyte concentration, and / or binding events associated with chemical processes relating to DNA synthesis.
Owner:LIFE TECH CORP
Method for manufacturing high density non-volatile magnetic memory
ActiveUS8802451B2Total current dropReduced dimensionNanomagnetismNanoinformaticsFeature DimensionHigh density
Methods of fabricating MTJ arrays using two orthogonal line patterning steps are described. Embodiments are described that use a self-aligned double patterning method for one or both orthogonal line patterning steps to achieve dense arrays of MTJs with feature dimensions one half of the minimum photo lithography feature size (F). In one set of embodiments, the materials and thicknesses of the stack of layers that provide the masking function are selected so that after the initial set of mask pads have been patterned, a sequence of etching steps progressively transfers the mask pad shape through the multiple mask layer and down through all of the MTJ cell layers to the form the complete MTJ pillars. In another set of embodiments, the MTJ / BE stack is patterned into parallel lines before the top electrode layer is deposited.
Owner:AVALANCHE TECH
Method of manufacturing surface textured high-efficiency radiating devices and devices obtained therefrom
InactiveUS20030075723A1Reduce power consumptionImprove Outcoupling EfficiencySolid-state devicesSemiconductor/solid-state device manufacturingActive matrixEmission efficiency
The present invention relates to radiation, preferably light emitting, devices with a high radiation emission efficiency and to fabricating these as small devices in an array of such devices. In one embodiment, the emitting devices can be placed in dense arrays. In another embodiment, outcoupling efficiency of the devices is improved, which leads to a reduced power consumption for a given radiation output power. In another embodiment, the speed of the radiation is increased, hence the serial bandwidth per optical channel is increased. The invention further relates to light emitting devices that exhibit uniform radiation emission characteristics. The light emitting devices (diodes, LEDs) of the present invention can be used for applications wherein two-dimensional LED arrays, particularly low-power arrays, are useful, such as in display technology. Active matrix displays relying on liquid crystals (e.g. integrated on CMOS circuitry) could be replaced by LED arrays. Dense and bright one-dimensional LED arrays are useful for example for printing and copying. Also for single LED applications it is important to have a maximum of photons escaping from the light emitting surface. The intensity of light per unit area (the brightness) is larger, and this is useful in many applications. Furthermore, the packaging cost can be reduced. In order to achieve a large global efficiency, many conventional LEDs need an elaborate package that includes a cavity with mirrors, because the light is emitted from more than one surface of the LED.
Owner:SIGNIFY HLDG BV
Nanowire array and nanowire solar cells and methods for forming the same
Owner:RGT UNIV OF CALIFORNIA
Graphene fet devices, systems, and methods of using the same for sequencing nucleic acids
ActiveUS20160265047A1Number of EliminationsFaster data acquisitionTransistorMicrobiological testing/measurementSensor arrayReaction layer
Provided herein are devices, systems, and methods of employing the same for the performance of bioinformatics analysis. The apparatuses and methods of the disclosure are directed in part to large scale graphene FET sensors, arrays, and integrated circuits employing the same for analyte measurements. The present GFET sensors, arrays, and integrated circuits may be fabricated using conventional CMOS processing techniques based on improved GFET pixel and array designs that increase measurement sensitivity and accuracy, and at the same time facilitate significantly small pixel sizes and dense GFET sensor based arrays. Improved fabrication techniques employing graphene as a reaction layer provide for rapid data acquisition from small sensors to large and dense arrays of sensors. Such arrays may be employed to detect a presence and / or concentration changes of various analyte types in a wide variety of chemical and / or biological processes, including DNA hybridization and / or sequencing reactions. Accordingly, GFET arrays facilitate DNA sequencing techniques based on monitoring changes in hydrogen ion concentration (pH), changes in other analyte concentration, and / or binding events associated with chemical processes relating to DNA synthesis within a gated reaction chamber of the GFET based sensor.
Owner:CARDEA BIO INC
Hierarchically-dimensioned-microfiber-based dry adhesive materials
InactiveUS20050271869A1Film/foil adhesivesSynthetic resin layered productsHigh dimensionalAdhesive materials
Embodiments of the present invention include hierarchically-dimensioned, microfiber-based dry adhesive materials featuring dense arrays of microfibers with free tips terminating in numerous microfibrils. In certain embodiments, more than two levels of microfiber-dimension hierarchy may be employed, each dimension involving smaller microfibrils emanating from the tips of the microfibers or microfibrils of the next highest dimensional level. Various additional embodiments of the present invention are directed to methods for preparing hierarchically-dimensioned, microfiber-based dry adhesive materials. These methods include single-pass or multi-pass imprint-lithography, pattern masking and etching, and imprinting fiber-embedded substrates followed by etching.
Owner:HEWLETT PACKARD DEV CO LP
Optically active substrates
InactiveUS7158224B2High refractive indexExtension of timeChemiluminescene/bioluminescenceMicroscopesLength waveRadiation
A device for optical examination of biological materials using radiation of a selected wavelength includes a substrate having a first surface and a second surface opposite to the first surface. The first surface includes a dense array of micro-optical elements arranged to provide increased intensity radiation or evanescent radiation. The first surface is in close proximity to the biological material being examined.
Owner:AFFYMETRIX INC
Semiconductor package having flex circuit with external contacts
InactiveUS6911355B2Semiconductor/solid-state device detailsSolid-state devicesElectrical conductorFlexible circuits
A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in electrical communication with the external contacts. The package also includes interconnects configured to provide separate electrical paths between die contacts (e.g., bond pads), and the conductors on the flex circuit. Several different embodiments of interconnects are provided including: bumps on the die contacts, bonded to the flex circuit conductors with a conductive adhesive layer; polymer bumps on the conductors, or die contacts, applied in a semi-cured state and then fully cured; solder bumps on the die contacts and conductors, bonded to one another using a bonding tool; rivet-like bonded connections between the conductors and die contacts, formed using metal bumps and a wire bonding or ball bonding apparatus; single point bonded connections between the conductors and die contacts, formed with a bonding tool; and wire bonds between the conductors and die contacts.
Owner:ROUND ROCK RES LLC
Graphene FET devices, systems, and methods of using the same for sequencing nucleic acids
ActiveUS9618474B2Faster data acquisitionImprove accuracyTransistorMicrobiological testing/measurementReaction layerSensor array
Provided herein are devices, systems, and methods of employing the same for the performance of bioinformatics analysis. The apparatuses and methods of the disclosure are directed in part to large scale graphene FET sensors, arrays, and integrated circuits employing the same for analyte measurements. The present GFET sensors, arrays, and integrated circuits may be fabricated using conventional CMOS processing techniques based on improved GFET pixel and array designs that increase measurement sensitivity and accuracy, and at the same time facilitate significantly small pixel sizes and dense GFET sensor based arrays. Improved fabrication techniques employing graphene as a reaction layer provide for rapid data acquisition from small sensors to large and dense arrays of sensors. Such arrays may be employed to detect a presence and / or concentration changes of various analyte types in a wide variety of chemical and / or biological processes, including DNA hybridization and / or sequencing reactions. Accordingly, GFET arrays facilitate DNA sequencing techniques based on monitoring changes in hydrogen ion concentration (pH), changes in other analyte concentration, and / or binding events associated with chemical processes relating to DNA synthesis within a gated reaction chamber of the GFET based sensor.
Owner:CARDEA BIO INC
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