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High speed high-density connector with modular structure for back board

A backplane connector, modular technology, applied in the direction of connection, connection device parts, connection parts protective grounding/shielding device, etc. Working characteristics, solid structure effect

Inactive Publication Date: 2008-12-24
GUIZHOU SPACE APPLIANCE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, shielding in these connectors only creates shielding between columns of signal contacts, ignoring electromagnetic coupling between differential signal pairs

Method used

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  • High speed high-density connector with modular structure for back board
  • High speed high-density connector with modular structure for back board
  • High speed high-density connector with modular structure for back board

Examples

Experimental program
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Effect test

Embodiment 2

[0048] In the second embodiment, the upper and lower bases are pressed into and fixed by means of bayonet locking. In addition, adhesives can also be used to mechanically fasten the upper base and the lower base together with good results.

[0049] Such as Figure 14 As shown, it is a schematic diagram of the assembly of the differential signal pins and the shielding unit in the pin connector of the high-speed and high-density backplane connector of the modular structure in the embodiment of the present invention.

[0050] In the figure: 7-horizontal ground shield, 7b-convex teeth, 7c, 7d-transition arc, 7f-pin, 8-differential pair signal pin unit, 11-longitudinal shield, 12-insert unit, 12c- Boss.

[0051] According to the inventive idea of ​​the patent of the present invention, the differential signal pin unit 8 and the transverse ground shielding sheet 7 can be designed as a module, and the present invention can also be realized. Such as Figure 14 As shown, in the embo...

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PUM

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Abstract

The invention provides a high-speed high-density backboard connector with a modularized structure. The electric connector comprises a pore connector and a pin connector, wherein the pore connector comprises a casing, a cover plate and a plurality of veneer sheet components; and the pin connector comprises a pedestal, a laterally-grounded shielding piece and differential pair signal pin units. The pin connector adopts the modularized structure. The differential signal pin units and the laterally-grounded shielding piece are arranged in the pedestal in a dense array. The modularized structure is fixed in the pin connector by adopting the interference fit or the double-wedge. Compared with the prior art, the backboard connector has the advantages of stable, compact and easily-expansible structure, complementary shielding and high-density and high-quality signal running characteristic.

Description

1. Technical field [0001] The present invention relates to electrical connectors for use in electronic systems, and more particularly to high speed high density backplane connectors of modular construction for transferring high speed signals between printed circuit boards in electronic components. 2. Background technology [0002] At present, in some large-scale electronic equipment or communication systems, the data and control signals between multiple line cards, the main control resource board and the switching network card are all connected through the backplane. Existing backplanes are printed circuit boards with many connectors, and conductive traces on the printed circuit board are connected to signal pins in the connectors so that signals can be sent between the connectors. Daughterboards also contain connectors that plug into connectors on the backplane. In this way, signals are sent between daughter boards via the backplane. [0003] Under this structure, as the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R12/16H01R13/648H01R13/658H01R13/514H01R12/71
Inventor 曹永泉
Owner GUIZHOU SPACE APPLIANCE CO LTD
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