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456results about How to "Improve mass production" patented technology

Method for producing upsized frp member

The present invention relates to a method for manufacturing a large FRP member and has the following structure. The method for manufacturing a large FRP member, comprising the following steps (A) to (F). They are: setting step (A) of disposing a preform containing a reinforcing fiber base material on a surface of a molding die; sealing step (B) of covering a molding portion with a bagging material or a mold and providing at least one suction port and at least one resin injection port for sealing; evacuating step (C) of evacuating the molding portion through the suction port; hot-air heating step (D) of heating the molding portion by hot air; resin injection step (E) of injecting a thermosetting resin from the resin injection port for impregnating the reinforcing fiber base material with the resin while a temperature Tm of the molding die and a temperature Tv of the bagging material or the mold are both set to room temperature or more, and a difference DeltaT in temperature between the Tm and the Tv is set to 10° C. or less; and curing step (F) of curing the resin by maintaining the molding portion at a predetermined temperature Tpc which is equal to or more than room temperature. Preferably, the preform described above includes the reinforcing fiber base material and a resin distribution medium. In addition, it is preferable that in the hot-air heating step (D), the molding die be placed in a sealed chamber which is heat insulated with a heat insulating material, the hot air be circulated and supplied, and timing of starting the injection of the resin from a plurality of the resin injection ports be controlled in accordance with signals supplied from resin detection sensors provided in the molding die. The present invention provides a method for manufacturing a large FRP member having superior quality at an inexpensive cost and with high production yield, in which non-impregnated portions and voids are unlikely to be formed.
Owner:TORAY IND INC

Heat exchanger and its manufacturing method

The present invention provides a heat exchanger for exchanging heat through heat transfer plates by flowing a primary airflow and a secondary airflow in air passages. The heat exchanger comprises a unit element having a heat transfer plate and an air passage formed between the heat transfer plates by stacking the unit elements. Each of the unit elements is structured by molding a space rib for holding the space between the heat transfer plates integrally with a shield rib for shielding the leak of the airflows by use of a resin. The unit element includes an error detection part which can easily detect an error in stacking when the unit elements are stacked.
Owner:PANASONIC CORP

Light transmission and reception module, sub-mount, and method of manufacturing the sub-mount

InactiveUS20060198569A1Low costExcellent in mass producibilityCoupling light guidesMulticore optical fibreOptical receiversLight wave
A light transmission and reception module includes: a belt-shaped macromolecular optical waveguide film having an optical waveguide, an optical transmitter having a light emitting element and a first sub-mount for holding the light emitting element, for holding one end of the macromolecular optical waveguide film on the first sub-mount so that a light emitted from the light emitting element may be coupled to an incident end surface of the optical waveguide, and an optical receiver having a light detecting element and a second sub-mount for holding the light detecting element, for holding the other end of the macromolecular optical waveguide film on the second sub-mount so that the light emitted from an exit end surface of the optical waveguide may be received in the light detecting element.
Owner:FUJIFILM BUSINESS INNOVATION CORP

Package for light emitting diode, light emitting device, and light emitting device manufacturing method

The present invention relates to a light emitting diode package for mounting a light emitting diode, a light emitting diode device with the light emitting diode package mounting a vertical electrode type light emitting diode thereon and a manufacturing method for manufacturing the light emitting device.
The light emitting diode package of the invention comprises at least a molding, and a first clip 122 and a second clip 123 fitted on the molding. The molding has at least a first opening 1212 and a second opening 1213 formed in a bottom portion thereof. The molding also has a reflecting portion 1214 formed around the first opening 1212 and the second opening 1213 for reflecting light. The molding further has a fluorescent film member mounting portion 1113 formed integrally for mounting a fluorescent film member 116 in the opening of the reflecting portion 1214. The first clip 122 has a light emitting diode mounting projection formed substantially at the center portion thereof for mounting the light emitting diode and is made to engage resiliently with the molding at both ends thereof. The first clip 122 engages with the molding at both ends thereof. The second clip 123 has a bonding projection formed to engage resiliently with the molding at both ends thereof.
Owner:CI KASEI COMPANY

A USB based on a Type C

The invention provides a USB based on a Type C. The USB comprises a housing, an upper insertion assembly and a lower insertion assembly. The upper insertion assembly comprises an upper insulation body and an upper row of conductive terminals. The lower insertion assembly comprises a lower insulation body, a metal shielding layer and a lower row of conductive terminals. The metal shielding layer and the lower row of conductive terminals are integrally molded. The lower row of conductive terminals comprises lower grounding terminals. Abutting portions of the lower grounding terminals comprise plate-shaped grounding basal bodies and grounding portions formed through projecting downwards from the basal bodies. The grounding portions and the grounding basal bodies are in different planes. The grounding basal bodies are arranged in the lower insulation body. The grounding portions are exposed outside the lower insulation body, and are used for contact with grounding terminals for abutting the USB; and the grounding basal bodies and main body portions of the lower grounding terminals are widened portions. Through adoption of the USB of the invention, the part composition of the product can be reduced; the reliability of the product when heavy currents pass can be raised; and the simplicity can also be raised.
Owner:ALL BEST ELECTRONICS TECH CO LTD

Method for manufacturing hydrodynamic bearing and rotating shaft

The invention provides a manufacturing method of dynamic pressure bearing, which comprises the following steps: an obturator is provided, the surface of the obturator is convexly provided with a plurality of protrusions; the obturator is arranged in the central position of a hollow bearing mould, and a hollow cavity in the bearing mould is filled with the mode of encapsulation molding to form an embryo of the dynamic pressure bearing; the obturator is removed from the embryo of the dynamic pressure bearing through the mode of catalytically degreasing; binder in the embryo of the dynamic pressure bearing is removed; the embryo of the dynamic pressure bearing is sintered; finally, the dynamic pressure bearing is formed. The dynamic pressure bearing integrally forms the dynamic pressure bearing and a dynamic pressure groove through the method of encapsulation molding, and removes micro-molecular gases which is decomposed from the obturator by using the method of catalytically degreasing, thereby preventing the embryo of dynamic pressure bearing from generating defects as deformation, bending or fracture, etc., improving the mass production capability and the dimensional precision of the dynamic pressure bearing. The invention also provides a manufacturing method of a dynamic pressure rotating shaft.
Owner:FU ZHUN PRECISION IND SHENZHEN +1

Method for producing electrochemical capacitor electrode

A method is provided for enhancing the bond between the polarizable electrode layer and the undercoat layer. The method includes a first step for forming an undercoat layer on a collector and a second step for forming a polarizable electrode layer on said undercoat layer. The first step is performed by coating said collector with a coating solution for the undercoat layer that includes electroconductive particles, a first binder, and a first solvent. The second step is performed by coating said undercoat layer with a coating solution for the polarizable electrode layer that includes porous particles, a second binder, and a second solvent. The first solvent can dissolve or disperse said first and second binders. The second solvent can dissolve or disperse said first and second binders. The fusion of the interface between the undercoat layer and the polarizable electrode layer enhances the bond therebetween.
Owner:TDK CORPARATION +1

Light-emitting diode array

A light-emitting diode array comprising a conductive layer formed on a substrate, separate light-emitting portions formed on the conductive layer, a first electrode formed on at least part of an upper surface of each light-emitting portion, and a second electrode formed on the conductive layer adjacent to the light-emitting portions; the first electrode comprising a common switching electrode matrix; the second electrode comprising a common electrode divided such that one second electrode exists in every block; and at least one of bonding pads extending to the first common electrode and the second common electrode being formed on a bonding portion formed on the conductive layer like an island, whereby the bonding pads are separate from each other.
Owner:LEXTAR ELECTRONICS CORP
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