8364results about "Laminated elements" patented technology

Novel manifolds and methods of flow through manifolds are described. Apparatus and techniques are described in which flow from a relatively large volume header is equally distributed to process channels. Methods of making laminated, microchannel devices are also described.

The present invention provides drug delivery dressings having a fluid control film component that comprise a sheet having microchannels that permit directional flow of a liquid.

Ergonomic systems which provide medical therapy, comfort and enhanced function are provided. Surfaces are provided with adjustable contour, transient force damping and temperature. The technologies are applied to footwear, seating surfaces an cryotherapy devices. The cooling and cryotherapy system employ an evaporator in close proximity to skin, and therefore employ methods to reduce risk of frostbite. Advanced control and power supply options are disclosed.

An apparatus for cooling at least one heated surface includes a base plate defining a number of inlet and outlet manifolds. The inlet manifolds are configured to receive a coolant, and the outlet manifolds exhaust the coolant. The inlet and outlet manifolds are interleaved. The apparatus also includes at least one substrate having inner and outer surfaces. The inner surface is coupled to the base plate and defines a number of microchannels that receive the coolant from the inlet manifolds and deliver the coolant to the outlet manifolds. The microchannels are oriented substantially perpendicular to the inlet and outlet manifolds. The outer surface is in thermal contact with the heated surface. The apparatus also includes an inlet plenum that supplies the coolant to the inlet manifolds, and an outlet plenum that exhausts the coolant from the outlet manifolds. The inlet plenum and outlet plenum are oriented in a plane of the base plate.

A device is disclosed for producing light that may include one or more printed circuit boards (PCBs), an electronics package may be disposed about the first surface of one or more of the PCBs and a housing. The PCBs may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core(s). A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and / or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The PCBs may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these. The device may also include a housing to contain the plurality of PCBs such that air flow may enter the housing and pass by the pins for cooling of the PCBs and electronics thereof. The housing may also be configured to permit external power to be applied to the PCBs within the apparatus.

A three-dimensional shape modeling of a real object that reduces the limitations on the target shape and color. The rough shape of the target object is determined by a silhouette method (which has limitation on the target shape) and, at the same time, the detailed shape of the target object is determined by a triangulation method or the like (which has limitation on the target color). By using both sets of information, the consistency between the rough and detailed shape information are checked. For the portions where the consistency is not satisfied (points where detailed shape information is absent or points where detailed shape section is present outside the rough shape), rough shape is assumed to be the final object information and for other portions, the detailed shape is taken as the final object information. In this manner, three-dimensional shape modeling with reduced limitations on the target shape and color can be performed.