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965results about How to "Effective reflection" patented technology

Intelligent heat-insulating film and its preparing process

The invention relates to an intelligent heat-insulating film and a preparation method thereof. The invention adopts the mixture of phase transition intelligent nanometer powder in the rutile crystal structure and vanadium dioxide V1-XO2(X is more than 0 and less than 0.06) to uniformly disperse on a material which can be formed into films, thus preparing the intelligent heat-insulating film with the phase transition function. The intelligent heat-insulating film is a novel energy-saving material with the phase transition temperature adjustable within -10 DEG C to 70 DEG C. The film has high infrared transmittance and low reflectivity as well as excellent heat-insulating property at low temperatures. At high temperatures, the film has low infrared transmittance and high reflectivity as well as excellent heat insulating effect. The intelligent heat-insulating film can be used for heat-insulation and decorative-protection of the surfaces such as glass, plastic, metal, wood, concrete and so on.
Owner:FUDAN UNIV

Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device

There is provided a thermosetting light-reflecting resin composition that has a high level of various characteristics required of optical semiconductor element mounting boards, such as optical properties and thermal discoloration resistance, provides high releasability during molding such as transfer molding, and allows molding processes to be performed continuously. There are also provided a highly-reliable optical semiconductor element mounting board and an optical semiconductor device each produced with the resin composition, and methods for efficient production thereof. A thermosetting light-reflecting resin composition is prepared and used, which includes (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst, (D) an inorganic filler, (E) a white pigment, (F) an additive, and (G) a release agent as major components, wherein the resin composition, after curing, has a diffuse reflectance of 80% or more at a light wavelength of 400 nm; and the resin composition is possible to perform transfer molding 100 times or more continuously.
Owner:RESONAC CORP

Flip-chip LED chip structure and manufacturing method thereof

The invention discloses a flip-chip LED chip structure and a manufacturing method thereof. The LED chip comprises an epitaxial layer taking sapphire as substrate and an electrode layer taking SiO2 / Si as substrate; holes of periodical structure are etched on the front surface of the sapphire substrate, and random patterns are etched on the back surface; a growth buffer layer, an n type GaN layer (n-GaN), an MQWs (multi quantum wells) layer and a p type GaN layer (p-GaN) are successively grown on the sapphire substrate etched with holes as the epitaxial layer; one or more negative electrode grooves are etched on the p type GaN layer (p-GaN); a p type contact layer is sputtered on the p type GaN layer (p-GaN); an n type ohmic contact layer is electroplated on the n type GaN layer (n-GaN) exposed after etching; titanium (Ti), platinum (Pt) and aurum (Au) are successively deposited on the SiO2 / Si substrate as an electrode layer; the electrode distribution on the electrode layer is coincident with that on the etched epitaxial layer; and the LED chip is formed by bonding the epitaxial layer on the front surface of the sapphire substrate and the electrode layer on the SiO2 / Si substrate with Au solder. The structure has the advantages of stable performance, high utilization rate of electric energy and long service life.
Owner:CHONGQING UNIV

Package for light emitting diode, light emitting device, and light emitting device manufacturing method

The present invention relates to a light emitting diode package for mounting a light emitting diode, a light emitting diode device with the light emitting diode package mounting a vertical electrode type light emitting diode thereon and a manufacturing method for manufacturing the light emitting device.
The light emitting diode package of the invention comprises at least a molding, and a first clip 122 and a second clip 123 fitted on the molding. The molding has at least a first opening 1212 and a second opening 1213 formed in a bottom portion thereof. The molding also has a reflecting portion 1214 formed around the first opening 1212 and the second opening 1213 for reflecting light. The molding further has a fluorescent film member mounting portion 1113 formed integrally for mounting a fluorescent film member 116 in the opening of the reflecting portion 1214. The first clip 122 has a light emitting diode mounting projection formed substantially at the center portion thereof for mounting the light emitting diode and is made to engage resiliently with the molding at both ends thereof. The first clip 122 engages with the molding at both ends thereof. The second clip 123 has a bonding projection formed to engage resiliently with the molding at both ends thereof.
Owner:CI KASEI COMPANY
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