Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

8260results about How to "High elongation" patented technology

Curable composition

The present invention has its object to provide a curable composition which comprises an amidine compound as a non-organotin catalyst and shows good elongation, flexibility, surface curability, depth curability and adhesiveness; the above object can be achieved by a non-organotin curable composition which comprises: (A) an organic polymer containing a silyl group capable of crosslinking under siloxane bond formation, the silyl group being a group represented by the general formula (1): —SiR1X2; (B) an amidine compound (B-1) as a silanol condensation catalyst; and (C) a carboxylic acid, wherein the ratio between the number of moles (b) of all nitrogen atoms in the (B-1) component of the composition and the number of moles (c) of all carboxyl groups in the (C) component of the composition, namely the ratio (b) / (c), is higher than 2.
Owner:KANEKA CORP

Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing

A build-up structure for chip to chip interconnects and System-In-Package utilizing multi-angle vias for electrical and optical routing or bussing of electronic information and controlled CTE dielectrics including mesocomposites to achieve optimum electrical and optical performance of monolithic structures. Die, multiple die, Microelectromechanical Machines (MEMs) and / or other active or passive components such as transducers or capacitors can be accurately positioned on a substrate such as a copper heatsink and multi-angle stud bumps can be placed on the active sites of the components. A first dielectric layer is preferably placed on the components, thereby embedding the components in the structure. Through various processes of photolithography, laser machining, soft lithography or anisotropic conductive film bonding, escape routing and circuitry is formed on the first metal layer. Additional dielectric layers and metal circuitry are formed utilizing multi-angle vias to form escape routing from tight pitch bond pads on the die to other active and passive components. Multi-angle vias can carry electrical or optical information in the form of digital or analog electromagnetic current, or in the form of visible or non-visible optical bussing and interconnections.
Owner:CAPITALSOURCE FINANCE

Centrifugal casting high-speed steel composite roll and manufacture method thereof

The invention relates to a centrifugal casting high-speed steel composite roll and a manufacture method thereof and belongs to the field of casting. The composite roll is composed of outer layer high-speed steel, middle layer graphitic steel and core high-strength nodular cast iron by centrifugal compounding. The centrifugal casting high-speed steel composite roll is based on the conventional high-carbon high-vanadium high-speed steel roll, the content of vanadium is appropriately reduced, niobium is added at the same time, and the Nb / V is controlled to be 0.3 to 0.5 so that Nb and V form complex carbide (V, Nb) C so as to avoid forming segregation under the action of centrifugal force. A roll core of the high-speed steel composite roll adopts high-strength nodular cast iron, and a multivariate graphite steel middle layer is poured between an outer layer and the roll core for preventing interfusing elements of Cr, B, and the like which cause embrittlement when the nodular cast iron is poured to be fused with the outer layer high-speed steel. Microalloying processing for refining the organization is carried out on a roll surface high-speed steel material and the middle layer graphitic steel so as to achieve the purpose of improving the thermal cracking capacity of the roll material. The centrifugal casting high-speed steel composite roll has high overall performance, long service life and good economic benefits.
Owner:BEIJING UNIV OF TECH

Low-smoke halogen-free flame retardant thermoplastic elastomer alloy for flexible wire rod and preparation method thereof

The invention discloses a low-smoke halogen-free flame-retarding thermoplastic elastomer alloy used for soft wires and a preparation method of the alloy, which is characterized in that: the material comprises thermoplastic polyurethane elastomer, thermoplastic styrene elastomer, compatilizer, phosphorus-nitrogen compound flame retardant, flame-retarding potentiating agent, lubricant, antioxidant and colorant; the weight ratio of the thermoplastic polyurethane elastomer, the thermoplastic styrene elastomer, the compatilizer, the phosphor-nitrogen compound flame retardant, the flame-retarding potentiating agent, the lubricant, the antioxidant and the colorant is 40 to 55 : 5 to 25 : 5 to 10 : 20 to 25 : 3 to 10 : 1.5 : 0.25 : 0.25; the preparation method is that the all components are evenly mixed in a high-speed mixer, and then extruded, drew and granulated at 170 to 210 degree centigrade, and then a low-smoke halogen-free flame-retarding thermoplastic elastomer alloy used for soft wires is obtained. The low-smoke halogen-free flame-retarding thermoplastic elastomer alloy used for soft wires has the advantages of achieving distinct flame-retarding effect at a small quantity of flame retardant dosage, satisfying the flame-retarding requirement of low-voltage wires, adjusting the Shore durometer number of the material between 80 to 95, good pliability, high physical mechanical property and according with the halogen-free and environment-friendly requirement.
Owner:SILVER AGE ENG PLASTICS DONGGUAN

Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing

A build-up structure for chip to chip interconnects and System-In-Package utilizing multi-angle vias for electrical and optical routing or bussing of electronic information and controlled CTE dielectrics including mesocomposites to achieve optimum electrical and optical performance of monolithic structures. Die, multiple die, Microelectromechanical Machines (MEMs) and/or other active or passive components such as transducers or capacitors can be accurately positioned on a substrate such as a copper heatsink and multi-angle stud bumps can be placed on the active sites of the components. A first dielectric layer is preferably placed on the components, thereby embedding the components in the structure. Through various processes of photolithography, laser machining, soft lithography or anisotropic conductive film bonding, escape routing and circuitry is formed on the first metal layer. Additional dielectric layers and metal circuitry are formed utilizing multi-angle vias to form escape routing from tight pitch bond pads on the die to other active and passive components. Multi-angle vias can carry electrical or optical information in the form of digital or analog electromagnetic current, or in the form of visible or non-visible optical bussing and interconnections.
Owner:CAPITALSOURCE FINANCE

Semi-aromatic polyamide resin

InactiveUS20090098325A1Good adhesive propertyHigh residence stability and hot water resistanceSynthetic resin layered productsFlexible pipesDiamineCarboxylic group
A semi-aromatic polyamide resin is provided which has a high level of residence stability, hot-water resistance and chemical resistance and is also excellent in adhesive properties and compatibility with other resins and the like.The semi-aromatic polyamide resin comprises: dicarboxylic acid units in which 50 to 100 mol % of the dicarboxylic acid units are aromatic dicarboxylic acid units; and diamine units in which 60 to 100 mol % of the diamine units are aliphatic diamine units having 9 to 13 carbon atoms. Furthermore, at least 10% of terminal groups of molecular chains of the polyamide resin are blocked with a terminal-blocking agent, and the amount of terminal amino groups of the molecular chains is 60 μeq / g or more and 120 μeq / g or less. In addition, [NH2] / [COOH]≧6 is satisfied, where [NH2] (μeq / g) represents the amount of the terminal amino groups and [COOH] (μeq / g) represents the amount of terminal carboxyl groups.
Owner:KURARAY CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products