A quick high-flexibility manufacturing method for a
ceramic circuit board comprises the following steps: irradiating
laser on the surface of a
ceramic matrix, and controlling the
energy density of the
laser to reach above the fracture threshold of the
chemical bond of the compound containing active ions, so that
chemical reaction occurs on the surface of the
ceramic matrix, an active substance is separated out to serve as a
chemical plating catalytic source, and the active substrate generated by the reaction and the
matrix form chemical metallurgical bonding, wherein different
laser sources are selected aiming at different
ceramic materials according to the
chemical bond energy of the ceramic material components, and the laser energy is controlled to reach the ceramic modified threshold by controlling the average power of laser output,
pulse repetition frequency, scanning speed, defocusing amount, space between scanning line and scanning times; and the ceramic matrix modified by the laser is placed into a
chemical plating solution to perform plating to form a
metal coating. The surface of the ceramic is modified by the laser, so that a
metal conductive layer and the
matrix form chemical metallurgical bonding, the bonding force of the circuit board is greatly increased, and the heat-conducting property and the electric property are improved.