352results about "Porous dielectrics" patented technology

An electrical conductor formed from one or more metallic inks. The electrical conductor comprises a network of interconnected metallic nodes. Each node comprises a metallic composition, e.g., one or more metals or alloys. The network defines a plurality of pores having an average pore volume of less than about 10,000,000 nm3. The electrical conductors advantageously have a high degree of conductivity, e.g., a resistivity of not greater than about 10× the resistivity of the (bulk) metallic composition, which forms the individual nodes.

Processes for controlling ink migration during the formation of printable electronic features. In a preferred aspect, the invention is to a process for forming at least a portion of an electronic feature. The process includes the steps of: (a) providing a first substrate having a first surface; (b) modifying the first surface to form a modified surface; and (c) applying an ink to at least a portion of the modified surface, wherein the modified surface interacts with the ink to inhibit lateral and / or longitudinal migration of the applied ink, and wherein the applied ink forms at least a portion of the electronic feature. In another aspect, the invention is to a process for encouraging electronic ink spreading with a surfactant.

The invention provides a manufacturing method of an insulating film having a plurality of pores, as well as a manufacturing method of a highly integrated semiconductor device with high yield. According to the invention, a porous insulating film is formed by forming a plurality of pores in an interlayer insulating film using a laser beam, which results in lower dielectric constant of the interlayer insulating film. In addition, a composition containing conductive particles is discharged onto the porous insulating film by a droplet discharge method typified by an ink jet printing method, and then baked to form a wire. As the laser beam, an ultrashort pulse laser beam is preferably used.

The invention relates to a flexible and extendable electronic device based on biocompatible films and a manufacturing method, and belongs to the technical field of flexible and extendable electronic devices. The flexible and extendable electronic device is technically characterized in that the biocompatible films are used as an encapsulation layer and a substrate layer of the flexible and extendable electronic device, a bonding layer used for enhancing the boundary strength between the encapsulation layer and a functional layer can be further arranged between the encapsulation layer and the functional layer, and an adhesive layer used for enhancing the adhesive force of the device with the surface of an object to be tested is arranged underneath the substrate layer; the functional layer is of a flexible and extendable structure. In the manufacturing process of the flexible and extendable electronic device, a transfer printing technology based on a solution is mainly adopted to achieve integration of the functional layer and a flexible substrate. The flexible and extendable electronic device structurally keeps and even improves flexibility and extensibility. Meanwhile, compatibility features such as waterproofness, breathability and low allergenicity of the flexible and extendable electronic device allow the flexible and extendable electronic device to normally work on the surface of a human body for more than 24 hours without causing a foreign body feeling and discomfort, and skin soaking or rubefaction or other anaphylactic reactions caused by poor biocompatibility can be avoided.

A low dielectric constant printed circuit board includes: a low dielectric constant porous polymer layer having holes therethrough, the porous layer having pores; and a patterned metallization layer over surfaces of the low dielectric constant porous polymer layer and surfaces of the holes, the patterned metallization layer not significantly protruding into the pores of the porous layer.

A printed circuit board material for embedded passive devices, which has excellent electromagnetic properties and reliability is provided. The invention provides a printed circuit board material comprises: a conductive copper foil layer; a resin bonding layer formed on the conductive layer and including above 70-100 vol % of resin and 0-30 vol % of filler; and a functional layer formed on the resin bonding layer and including resin and filler. The printed circuit board material has the resin bonding layer interposed between the copper foil layer and the functional layer. Thus, even when the content of fillers in the functional layer is increased, the adhesion strength between the conductive layer and the functional layer is ensured without deteriorating the properties of the functional layer, such as dielectric and magnetic properties.

The invention relates to a method for utilizing one or more B-stageable or pre-formed underfill encapsulant compositions in the application of electronic components, most commonly chip scale packages (CSP's) to substrates. One such composition comprises a thermoplastic resin system comprising a phenoxy resin, an expandable polymer sphere or thermosetting composition, optionally an epoxy resin such as higher molecular weight epoxy resin, a solvent, an imidazole-anhydride catalyst or comparable latent catalyst, and optionally, fluxing agents and / or wetting agents. The underfill encapsulant may be B-stageable to provide a coating on the substrate or component that is smooth and non-tacky. In an alternative embodiment, the underfill encapsulant is a pre-formed film. In both embodiments the expandable filler material expands upon the application of higher temperatures to form a closed-cell foam structure in the desired portion of the assembly. The method of applying the underfill application of the underfill to a component or substrate, attachment of the component and substrate, and heating of the assembly to a temperature sufficient to cause the expandable thermoplastic or thermosetting composition to foam. A second pre-applied underfill composition containing an epoxy resin, an anhydride curing agent, and catalyst may also be applied, either separately or in conjunction with the foamable underfill. The second composition acts as a pressure sensitive adhesive and may be applied selectively to parts of the CSP, for example to the solder bumps. The pressure sensitive adhesive property of the composition provides sufficient tack in order to hold the electronic assembly together during the assembly process.

A wiring glass substrate includes a glass substrate formed of glass and having a plurality of holes formed at predetermined positions, bumps so formed as to be connected to a conductive material filling the holes and wirings formed on a surface opposite to a surface having the bumps formed thereon and electrically connecting a plurality of connection terminals arranged in intervals different from intervals of the holes to the conductive material. The shape of the conductive material is porous and porous electrodes are bonded to the inner wall surfaces of the holes by an anchor effect to increase the strength of the glass substrate.

A radiation sensitive dielectric constant changing composition comprising (A) a decomposable compound, (B) a nondecomposable compound, (C) a radiation sensitive decomposer and (D) a stabilizer. The composition allows its dielectric constant to be changed by a simple method, has a sufficiently large difference between its changed dielectric constant and its original dielectric constant and can provide a dielectric constant pattern and an optical material which are stable regardless of their use conditions.

A switch or circuit board having a first conductive area on a first side of the board, a second conductive area on a second side of the board, several tiny holes running through the board from the first side to the second side, and a conductive material substantially filling the holes by capillary force, where the conductive material forms an electrical connection between the first conductive area and the second conductive area.

A mesoporous silica / fluorinated polymer composite material. Made up of hydrophobic modified mesoporous silica with a pore size of 0.1 to 50 nm and a fluorinated polymer, to provide Dk<4, Df<0.04, and CTE<60 ppm, the material is suitable for use in printed circuit boards or substrates in high frequency applications.

A metal substrate with an insulation layer includes a metal substrate having at least an aluminum base and an insulation layer formed on said aluminum base of said metal substrate. The insulation layer is a porous type anodized film of aluminum. The anodized film includes a barrier layer portion and a porous layer portion, and at least the porous layer portion has compressive strain at room temperature. a magnitude of the strain ranges from 0.005% to 0.25%. The anodized film has a thickness of 3 micrometers to 20 micrometers.

A method of fabricating an RFID antenna, the method comprising: (a) depositing a slurry upon a substrate in a predetermined pattern, the substrate including a plurality of micropores operative to drain a fluid component of the slurry from the surface of the substrate, while maintaining conductive particles of the slurry on a surface of the substrate; and (b) drying the conductive particles to secure the conductive particles upon a surface of the substrate and provide a conductive antenna. The invention also includes an RFID tag comprising: (a) a substrate including a plurality of micropores; (b) a microchip; and (c) an RFID antenna in electrical communication with the microchip and contacting the substrate, the RFID antenna comprising conductive particles deposited upon the substrate by ejecting a slurry from an inkjet printer.