1035results about How to "The connection is tight and firm" patented technology

The invention provides a semiconductor chip manufacturing method including the steps of: forming a concave portion extended in the thickness direction of a semiconductor substrate which has a front surface and a rear surface and has a function device formed on the front surface, from the front surface; forming an oxidation preventive film made of an inert first metal material by supplying the first metal material onto the inner wall surface of the concave portion; supplying a second metal material containing a metal which is oxidized more easily than the first metal material to the inside of the concave portion after the step of forming the oxidation preventive film; electrically connecting the second metal material supplied to the inside of the concave portion and the function device; and thinning the semiconductor substrate so that the thickness thereof becomes thinner than the depth of the concave portion by removing the semiconductor substrate from the rear surface while leaving the oxidation preventive film.

Axially compressible, high bandwidth F-connectors designed for conventional installation hand tools for interconnection with coaxial cable. Each connector has a rigid nut that is axially and rotatably secured to a molded plastic, tubular body. A rigid, conductive post coaxially extends through the connector, linking the nut and body. A post barbed end penetrates the cable within the connector. The body has a tubular shank with an obstruction-free surface and an integral stop ring. A tubular, metallic end cap is slidably fitted to the body shank, and thereafter forcibly compressed lengthwise, with travel limited by the stop ring. No detented structure is formed on the body, and the end cap can irreversibly assume any position, being held by end cap teeth. A tactile system comprising convex projections on the stop ring complemented by a resilient O-ring on the end cap helps installers determine correct placement through the sense of touch.

A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.

The invention belongs to the technical field of building components, and relates to an insertion connecting component with a tension connection function. By the aid of the insertion connecting component, the technical problem of unreliability in connection in the prior art can be solved. The insertion connecting component comprises a first tension nut and a second tension nut. The first tension nut and the second tension nut are respectively fixed to two ends of a prefabricated member, an insertion rod is detachably connected into the first tension nut, a middle nut is detachably connected into the second tension nut, an elastic component is arranged in the second tension nut, a clamp ring is arranged between the middle nut and the elastic component, the insertion rod can be clamped by the clamp ring when being inserted into the middle nut, the middle nut comprises a nut body, external threads are arranged on the outer wall of the nut body, a channel is arranged inside the nut body, an insertion connector can penetrate the channel, an end of the channel is expanded to form a clamp ring positioning cavity capable of accommodating the clamp ring, a clamp ring limiting cavity is arranged at an end of the clamp ring positioning cavity, and the clamp ring can be blocked by the clamp ring limiting cavity when slipping towards the end of the clamp ring positioning cavity and accordingly can be prevented from slipping out of the clamp ring positioning cavity. The insertion connecting component has the advantages that the insertion connecting component is stable and reliable in insertion procedures, and accordingly the construction work efficiency can be improved.

A high speed cable connector (1) includes a cover (3), a base (80) and a cable assembly (30) mounted between the cover and the base. The cable assembly includes a cable (42) consisting of a plurality of lines (44). Each line has a pair of upper and lower signal wires (442, 444) and a grounding wire (446). Front ends of the lines are sandwiched between upper half (462) and lower half (464) of a spacer (46) to which upper and lower shielding plates (50, 52) are respectively mounted. The upper and lower shielding plates are electrically connected with each other. The upper and lower signal wires are soldered to signal circuitry on top and bottom faces of a printed circuit board (62), respectively. The upper and lower shielding plates have engaging arms (508) soldered to ground circuitry of on the top and bottom faces of the printed circuit board, respectively. Each grounding wire is soldered to a corresponding upper shielding plate. Each pair of upper and lower signal wires is located between two pairs of upper and lower shielding plates, whereby cross-talk between the signal wires of two neighboring lines can be effectively suppressed.

An exposed connecting portion is formed by partially removing a film substrate by such laser etching while leaving a transmission line pattern. A film-type transmission line is placed in such a manner as to overlap the exposed connecting portion and a transmission line pattern on a side to be connected. Bonding, for example thermo compression bonding, is applied to the two overlapped line patterns. Since a gold ribbon is not used and overlapping of a high-dielectric substrate and the film substrate is unnecessary, impedance irregularity is reduced. This makes it possible to carry out bonding without the medium of the film substrate and a connection with high reliability may be achieved.

In accordance with the present invention, during formation of the interconnection board, the interconnection board remains securely fixed to a high rigidity plate being higher in rigidity than the interconnection board for suppressing the interconnection board from being bent.

A method of making a spark plug having a noble metal chip joined to an electrode main body of a ground electrode by interposing therebetween an intermediate member. The method comprises the steps of prior to joining the noble metal chip to the electrode main body, joining the intermediate member and the noble metal chip together, placing a noble metal chip and intermediate member assembly on the electrode main body in a way as to allow the intermediate member to contact the electrode main body, and welding the electrode main body and the intermediate member together while restricting relative movement of the electrode main body and the intermediate member without applying an urging force to a joint between the intermediate member and the noble metal chip.

A swivel-type portable flash device includes a C-shaped swivel cover that rotates (swivels) relative to a housing between an open position in which a plug connector is exposed for insertion in a host system, and a closed position in which the plug connector is covered and protected by the swivel cover. The swivel cover is permanently rotatably connected to the housing by way of ring-shaped protrusions that are movably engaged inside corresponding recessed ring-shaped grooves formed in upper/lower walls of the housing, whereby the swivel cover is manually rotatable relative to the housing between the opened and closed positions. The swivel cover also includes locking structures (e.g., locking notches) disposed on the ring-shaped protrusions, and the housing includes second locking structures disposed in the recessed ring-shaped grooves, where the first locking structures operably engage the second locking structures to prevent rotation of the swivel cover when the plug connector is in the closed position.

A hybrid multilayer substrate includes a cavity in a laminate structure formed of a resin portion and a ceramic multilayer substrate, the resin portion has a protrusion portion, the ceramic multilayer substrate has a penetrating hole, and the cavity is formed by fitting the protrusion portion of the resin portion to an end portion of the penetrating hole of the ceramic multilayer substrate.