A novel process and apparatus for manufacturing
Solid Solder Deposit-
Printed Circuit Board (SSD-PCB) by either melting
solder paste or dry solder
powder previously deposited on a pocketed-PCB 20. Said process and apparatus, unlike the prior art, utilize as heat source an electrically heated conveyor
wire mesh 76 instead of a
reflow oven. Relatively thick flat-shaped SSDs 44 metallurgically bonded over each
soldering pad 24 of said pocketed-PCB 20 are formed. By itself, SSD-PCB technology provides the electronic
assembly industry with ready-to-solder PCBs consequently eliminating the need to use
solder paste at the
assembly line. This invention, unlike the prior art for producing SSD-PCBs, can utilize dry solder
powder piles 38 in conjunction with flux
layers 116 deposited on top of said conveyor
wire mesh 76 thereby excluding, all together, the use of paste printing equipment. Specifically my invention reduces the manufacturing cost, shortens manufacturing time, reduces manufacturing
energy consumption and improves SSD-PCB's quality and reliability while requiring less manufacturing equipment than the prior art.