457 results about "Reflow oven" patented technology

A solder reflow oven for the processing of ball grid array substrates bearing solder balls is described, comprising: input means for introducing substrates into the oven, a processing chamber within which the substrates are subject to a solder reflow process, and output means for discharging substrates from the oven for further processing or handling, and means for transferring the substrates through the processing chamber in a first direction towards the output means. The processing chamber comprises a plurality of heating and cooling zones arranged with a constant pitch in the first direction, and the transferring means is adapted to move the substrates in the first direction in stages, with each component moving a distance equal to the pitch between two zones in each stage, whereby the components are moved from zone to zone in stages. In addition each block of each heating zone and each block of each cooling zone is connected to a source of fresh gas, and each block of each heating zone is provided with means for heating the gas, and each block of each cooling zone is provided with means for cooling the gas, and each block is formed with a serpentine channel between the source of fresh gas and at least one opening through which the gas is discharged from the block towards a substrate.

The present invention offers a method of welding FPC board and PCB board, and the special fixture for this method which includes an upper-template and an under-template. The method includes the following steps: the first step, printing solder paste onto a big-piece PCB board composed of several small-piece PCB boards; the second step, using SMT to compose components onto the PCB board; the third step, fixing the PCB board in the slot of under-template of the fixture for locating; the fourth step, aligning the solder pad zones of FPC board and PCB board; the fifth step, covering the upper-template of the fixture to the upper-surface of the PCB board, and the overlapped area of solder-pad zone is 50%-80%, the under-surface of the upper-template should must maintain horizontal, rotating the block button on the under-template to fasten the upper-template; the sixth step, sending the fastened fixture into enclosed reflow oven for refluxing weld; the seventh step, taking off the template, checking the welding state between FPC board and PCB board. As the said welding method is less in steps and simple in its special fixture, the productive efficiency is high, and the cost is low.

The invention discloses a method for the assembly and the reflow soldering of a PCB and an FPC and a special positioning fixture thereof, which mainly solve the problems of inaccurate positioning, low efficiency of welding efficiency, difficulty for ensuring product quality and the like of manual assembly in the processes of assembling and soldering the PCB and the FPC. The method comprises the following steps: firstly, supporting, positioning and fixing the PCB by using a magnetic carrier board; secondly, carrying the FPC; next, preliminarily positioning the PCB and the FPC with a bonding agent; thirdly, printing a solder paster on a solder pad at the junction of the FPC and the PCB; and finally, pressing a magnetic cover board on the magnetic carrier board, fixing the positions of the FPC and the PCB, and performing the reflow soldering on the FPC and the PCB through a reflow oven. The method for the assembly and the reflow soldering of the PCB and the FPC and the special positioning fixture thereof have the advantages of simple operation, good reliability, great improvement on the production efficiency and the production quality of the FPC and the PCB in the processes of assembling and soldering, and processing cost reduction.

The suction ports of a hot air blowing heater are arranged in a zigzag shape crossing the direction of travel of a printed circuit board, and hot air discharge nozzles project from inside or alongside the suction ports. Accordingly, in the reflow furnace according to the present invention, hot air discharged from the hot air discharge nozzles does not collide with hot air sucked into the suction ports, and turbulence does not take place.

A semiconductor device having both high strength and high thermal radiation that is capable of being applied to mounting on automobiles experiencing many thermal cycles, and a manufacturing method thereof are provided. A circuit board 1a for a resin encapsulated semiconductor module device has a configuration where a silicon nitride plate 2 with a thickness of 0.635 mm has copper plates of 1.0 mm and 0.8 mm bonded to both sides thereof via active metal. A copper plate 3a is bonded to the surface side of the silicon nitride plate 2, and a prescribed circuit pattern is formed on the copper plate 3a. Tin-silver-copper cream solder layers 4a and 4b with a thickness of 200 μm are formed at a prescribed location on the circuit pattern 3a on which a semiconductor element 6 is mounted and at a prescribed location of a base plate 1 on which the circuit board 1a is disposed. Nickel particles 5 having a maximum particle size of 100 μm and an average particle size of 70 μm are dispersed in the solder 4a on the base plate 1 of good thermal conductivity. A semiconductor element (chip) 6, the circuit board 1a, and the base plate 1 are disposed on predetermined locations. Thereafter, they are set in a reflow oven (not shown in the drawings) for reflow soldering. After the inside of the reflow oven is replaced by a nitrogen atmosphere, the reflow oven is heated to 280° C. At the time when solder is melted, the inside of the oven is decompressed to 1 Pa, nitrogen is introduced, and the reflow oven is cooled to about room temperature, thereby completing the solder bonding step. After flux is washed, an outer case 7 with an insert-molded outlet terminal 8 is adhered to the base plate 1 and a predetermined connection is conducted via an aluminum bonding wire 9. Then, silicone gel 10 is injected into a package delimited via the base plate 1 and the outer case 7, and the silicone gel 10 is heat-hardened, thereby completing a resin encapsulated semiconductor device A.

A novel process and apparatus for manufacturing Solid Solder Deposit-Printed Circuit Board (SSD-PCB) by either melting solder paste or dry solder powder previously deposited on a pocketed-PCB 20. Said process and apparatus, unlike the prior art, utilize as heat source an electrically heated conveyor wire mesh 76 instead of a reflow oven. Relatively thick flat-shaped SSDs 44 metallurgically bonded over each soldering pad 24 of said pocketed-PCB 20 are formed. By itself, SSD-PCB technology provides the electronic assembly industry with ready-to-solder PCBs consequently eliminating the need to use solder paste at the assembly line. This invention, unlike the prior art for producing SSD-PCBs, can utilize dry solder powder piles 38 in conjunction with flux layers 116 deposited on top of said conveyor wire mesh 76 thereby excluding, all together, the use of paste printing equipment. Specifically my invention reduces the manufacturing cost, shortens manufacturing time, reduces manufacturing energy consumption and improves SSD-PCB's quality and reliability while requiring less manufacturing equipment than the prior art.

An object of the present invention is to provide a digital-output electret condenser microphone capable of being soldered on a wiring substrate of an apparatus by using a reflow furnace. An electret condenser microphone according to the present invention has an electret polymer film and a spacer that are formed of a heat-resistant material. Sound apertures are provided in a front panel of the electrically conductive capsule and / or the wiring substrate. Provided on the surface exposed in the open end of the electrically conductive capsule are multiple terminals, including at least a power supply terminal, a digital signal output terminal, and a clock input terminal. The terminals are protruded outward beyond a caulked part at the open end of the electrically conductive capsule.