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Method for creating reflow soldering ideal furnace temperature curve and application method thereof

A technology of reflow soldering and temperature curve, which is applied in electric temperature control, metal processing, auxiliary controller with auxiliary heating device, etc., to improve the quality of reflow soldering and improve production efficiency

Inactive Publication Date: 2018-09-28
CHENGDU XUNSHENG ELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, there is no relevant standardized process curve, and each factory's own process engineer manually evaluates the furnace temperature curve according to the solder paste data and the PCBA produced.

Method used

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  • Method for creating reflow soldering ideal furnace temperature curve and application method thereof

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Embodiment Construction

[0041] The present invention will be further described below in conjunction with accompanying drawing:

[0042] like figure 1 As shown, a method for creating an ideal temperature furnace curve for reflow soldering of the present invention comprises the following steps:

[0043] 1) Determine the solder paste parameters, including:

[0044] Preheating zone, initial temperature, temperature rise slope range;

[0045] Insulation zone, temperature range, time range;

[0046] Reflow zone, peak temperature range, liquid phase time range, solder paste melting point, solder paste freezing point;

[0047] Cooling zone, cooling slope range, cooling end temperature;

[0048] The above parameters are the characteristic parameters of the solder paste, which can be obtained from the information of the solder paste. It is an existing technology, and no specific description is required; the furnace temperature must meet the characteristics of the solder paste and be within the characterist...

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Abstract

The invention discloses a method for creating a reflow soldering ideal furnace temperature curve, comprising steps of: determining solder paste parameters; determining the size of PCBA boards, including a large board, a middle board and a small board; drawing a solder paste characteristic curve; adjusting a reflow furnace according to the solder paste characteristic curve to make the PCBA production furnace temperature meet the solder paste characteristic curve; according to the matched furnace temperature curve and a tolerance value, creating an upper limit curve and a lower limit curve of each point of the furnace temperature, and the middle belt being an ideal curve. The method for creating the reflow soldering ideal furnace temperature curve combines various parameters of the solder paste and determines the curve of each segment according to the sizes of the soldered PCBA boards, so that the furnace temperature curve of the reflow furnace does not depend on the subjective experience value of the process engineer, thereby objectively presenting the reflow soldering furnace temperature requirements, giving the reflow soldering furnace temperature standard, improving the reflow soldering quality, and finding the proper reflow furnace temperature and improving the production efficiency simply and quickly.

Description

technical field [0001] The invention relates to the field of soldering, in particular to a method for creating an ideal furnace temperature curve for reflow soldering and an application method thereof. Background technique [0002] Reflow soldering is one of the three main processes in the SMT placement process. Reflow soldering is mainly used to solder the circuit board with components already mounted. The solder paste is melted by heating to fuse the patch component and the circuit board pad, and then the solder paste is cooled by reflow soldering to cool the component and The pads are cured together. [0003] During the entire soldering process, the furnace temperature curve of reflow soldering plays a vital role in the soldering of electronic components. If the temperature is too low, it will lead to poor soldering. If the temperature is too high, it will cause damage to the components. If the device is cracked, the solder paste will change qualitatively if the tempera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05D23/30B23K3/00
CPCB23K3/00G05D23/30
Inventor 邹松张荣
Owner CHENGDU XUNSHENG ELECTRONICS TECH CO LTD
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