Air floatation rotating reflow soldering device and method

Abstract

The invention discloses an air floatation rotating reflow soldering device and method. The air floatation rotating reflow soldering device comprises a turntable, a hot plate, a limit plate, a furnace, a furnace door, a furnace cover, a rotating speed regulation device, a temperature controller and a gas regulator, the furnace comprises a cylinder and a drum, the top of the cylinder is divided into a feeding area, a discharging area and a variable temperature area, the discharging area is provided with a storage groove, the feeding area and the variable temperature area are provided with air holes, rolling balls are arranged on the peripheries of the feeding area and the variable temperature area, the turntable is coaxially mounted at the top of the cylinder, a boss of the turntable contacts with the rolling balls, the limit plate is mounted on the turntable, a hot plate is mounted in the variable temperature area, line grooves are formed right above an inlet and an outlet of the variable temperature area, and the line groove and the air holes can discharge nitrogen. The air floatation rotating reflow soldering device has the advantages that gas floating rotary transportation of welding parts is realized, friction among the surface of the hot plate and parts to be welded in the transportation process is avoided, reflow soldering of an automatic assembly line is realized, the welding environments are protected by the aid of air curtain barriers at the inlet and the outlet of the variable temperature area, and working efficiency and welding quality are improved.

Description

technical field [0001] The invention relates to rotary reflow welding equipment and a welding process, in particular to an air flotation rotary reflow welding device and method. Background technique [0002] The existing small reflow soldering furnace needs to realize the reflow soldering process in a single cavity. First, the production efficiency is not high; second, the energy loss caused by repeated heating and cooling; Fatigue damage; and large and medium-sized reflow soldering furnaces are divided into multiple chambers to achieve reflow soldering, and there are multiple temperature zones inside. The parts to be welded can realize assembly line operations in the reflow soldering furnace. They are used to transport the parts to be welded in a straight line. The parts to be welded are put into the reflow soldering furnace from one end, but they need to be taken out from the other end at the end of the conveyor belt. Due to the long length of the equipment itself, it is v...

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Problems solved by technology

[0002] The existing small reflow soldering furnace needs to realize the reflow soldering process in a single cavity. First, the production efficiency is not high; second, the energy loss caused by repeated heating and cooling; Fatigue damage; and large and medium-sized reflow soldering furnaces are divided into multiple chambers to achieve reflow soldering, and there are multiple temperature zones inside. The parts to be welded can realize assembly line operations in the reflow soldering furnace. They are used to transport the parts to be welded in a straight line. The parts to be welded are put into the reflow soldering furnace from one end, but they need to be taken out from the other end at the end of the conveyor belt. Due to the long length of the equipment itself, it is very inconvenient for the operator. , it will also reduce the welding efficiency to a certain extent

[0003] In addition, with the further widespread application of electronic components in various fields, the requirements for their stability are getting higher and higher, which requires electronic components to have excellent soldering quality. First, it is necessary to accurately meet the heating and cooling requirements of the reflow soldering process; The second is to ensure that the soldering is carried out under the condition of little or no oxygen. However, most of the current reflow soldering furnaces are open and do not isolate the influence of external air on the soldering layer, which often easily causes voids in the soldering layer of the device.

In order to reduce the occurrence of soldering voids, some reflow soldering furnaces also adopt a vacuum structure, but they usually use radiation heating to solder the weldments, which has the characteristics of low heat transfer efficiency.

The welding furnace that adopts the heat conduction method often puts the welded parts directly on the surface of the heating element, and there will be friction resistance during transmission, or the welded parts are moved by a mechanical lifting device, but the equipment cost and maintenance cost are higher

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