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Electronic component carrier and method for shattering and loading electronic components on circuit board

A technology for electronic components and circuit boards, which is applied in the field of electronic component carriers, and can solve problems such as slow disassembly speed, damage to integrated circuits, and electronic components that cannot be disassembled from circuit boards.

Inactive Publication Date: 2005-03-09
HTC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1) The disassembly equipment is expensive-the size of the integrated circuit is various, and the heat gun must be equipped with a complete set of air nozzles to disassemble the integrated circuits of different sizes;
[0006] 2) Slow disassembly speed - taking a 17 mm square integrated circuit as an example, it takes an average of 30 seconds for a skilled electronic component disassembler to disassemble an integrated circuit of this size from the circuit board, and this 30 seconds is just to disassemble a circuit board. The time it takes for the integrated circuit to be removed from the circuit board, and it will take longer to remove all the electronic components on the circuit board;
[0007] 3) The temperature control is not easy - the important factor of whether the process of removing electronic components from the circuit board by using a heat gun can be successfully completed is whether the temperature and air volume of the hot air emitted by the heat gun from its nozzle are stable
The temperature of the hot air emitted by the air nozzle of a general heat gun is between 250 degrees Celsius and 600 degrees Celsius. Too low or too high hot air temperature will cause integrated circuits (including electronic components of course) to be unable to be printed on the circuit board. is disassembled and damages the integrated circuit;
[0008] 4) Some electronic components cannot be disassembled from the circuit board - because electronic components of plastic materials, such as connectors, switches, etc., have become very fragile after being blown by the hot air from the nozzle of the heat gun , it is almost impossible to withstand any irregular external force, so even if such electronic components are forcibly removed from the circuit board, the usage rate of the removed electronic components must be very low;
[0009] 5) Electronic components such as integrated circuits that have been disassembled from the circuit board are often bent or deformed due to the carelessness of the electronic component disassembler or insufficient disassembly skills, so that even though the integrated circuit It has been removed from the circuit board with great difficulty, but unfortunately it is no longer usable

Method used

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  • Electronic component carrier and method for shattering and loading electronic components on circuit board
  • Electronic component carrier and method for shattering and loading electronic components on circuit board
  • Electronic component carrier and method for shattering and loading electronic components on circuit board

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Embodiment Construction

[0035] The electronic component carrier of the present invention is used in a reflow oven, please refer to figure 1 , figure 1 It is a schematic diagram of the electronic component carrier 10 in a reflow oven 90 according to the preferred embodiment of the present invention. A circuit board 16 is placed in the electronic component carrier 10, and a plurality of circuit boards ( Surfacemounting technology, SMT) is attached to the electronic components (shown in dotted lines) 22 on the circuit board 16 . The reflow oven 90 includes a trigger 38 (shown at image 3 ) and a conveying device 92 for conveying the electronic component carrier 10 . Please refer to figure 2 , figure 2 It is a temperature / time relationship diagram in the reflow oven 90, wherein the horizontal axis represents time and the vertical axis represents temperature. The reflow oven 90 is activated at time t0, and then the temperature in the reflow oven 90 will gradually increase. At time t1, the temperatu...

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PUM

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Abstract

An electronic element carrier is composed of a fixed frame, a clamper fixed to said fame and clamping a circuitboard on said frame, an impacter for impacting the circuitboard to separate the electronic elements from the circuitboard when the temp in a welding furnace is higher than a predefined temp, and a carrier for collecting the separated electronic elements.

Description

technical field [0001] The present invention provides an electronic component carrier, especially an electronic component carrier that can be used to shake off electronic components on a circuit board and support the components that have been shaken off. Background technique [0002] With the rapid development of electronic technology, the alternation of generations of various electronic products has become more frequent. The electronic components on the circuit boards in the electronic products that are usually eliminated, except for some more expensive electronic components such as memory, processors, etc., which are carefully removed from the circuit boards in the electronic products manually, and the rest are relatively expensive. Inexpensive electronic components are often discarded along with the entire electronic product due to expensive labor costs. Apart from environmental protection issues, this approach wastes many valuable resources. [0003] There are two conve...

Claims

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Application Information

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IPC IPC(8): B25B27/00B25B27/14
Inventor 杨军威
Owner HTC CORP
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