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Adhesive polyimide resin and adhesive laminate

A polyimide resin, siloxane polyimide resin technology, applied in the direction of synthetic resin layered products, adhesives, layered products, etc., can solve low heat resistance, insufficient reliability, limitations, etc. question

Inactive Publication Date: 2003-03-26
NIPPON STEEL CHEMICAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the influence of epoxy and acrylic adhesives used as adhesives, heat resistance, galvanic corrosion, and laser processability for connecting and forming bosses are not sufficient, and are limited in applications requiring high-reliability packaging.
[0009] In addition, although there is also a method of forming a wiring board from a flexible base material (two-layer tape) that is directly bonded to a polyimide film and copper foil, in this case, due to the adhesive package with the semiconductor, there is a problem with Adhesives with low heat resistance used for bonding heat sinks and ribs expand due to the reflow temperature of about 250°C, or insufficient reliability due to insufficient electrical corrosion resistance
Conversely, when adhesives with high heat resistance are used, because these adhesives are thermosetting, they are affected by the heat treatment before the heating and pressing process, and the fluidity in the heating and pressing process is damaged, or the adhesion with the semiconductor chip is impaired. damage problem

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 2

[0083] 48.58 grams (0.1566 moles) of ODPA and 130 g of triethylene glycol dimethyl ether were added to the reactor, and 60.00 grams (0.0783 moles) of PSX were added with a dropping funnel under nitrogen protection. Stir at room temperature for about 2 hours, then heat the reaction solution to 190° C. under nitrogen protection, and heat and stir for 15 hours while removing water. Then the reaction solution was cooled to room temperature, and BAPP60.06 g (0.1463 mol), HAB4.22 g (0.0195 mole) and ODPA27.14 g (0.0875 mole) and 150 g of triethylene glycol dimethyl ether were added, under nitrogen protection The reaction solution was heated to 70° C., stirred for about 2 hours, and triethylene glycol dimethyl ether was added to make the solid content concentration 40% by weight to obtain a siloxane polyimide precursor resin solution. Synthesis example 3

Synthetic example 3

[0084] BPDA65.61 g (0.223 mol) and triethylene glycol dimethyl ether 130 g were added to the reactor, and PSX99.96 g (0.1305 mol) was added with a dropping funnel under nitrogen protection. Stir at room temperature for about 2 hours, then heat the reaction solution to 190° C. under nitrogen protection, and heat and stir for 15 hours while removing condensation water. Then the reaction solution was cooled to room temperature, 30.54 grams of BAPP (0.0744 moles), 3.85 grams of HAB (0.0178 moles) and 150 grams of triethylene glycol dimethyl ether were added, and the reaction solution was heated to 70 ° C under nitrogen protection. , stirred for about 2 hours, and then added triethylene glycol dimethyl ether to make the solid content concentration 40% by weight to obtain a siloxane polyimide precursor resin solution. Synthesis Example 4

Synthetic example 4

[0085] 23.48 g (0.0757 mol) of ODPA and 35 g of NMP were added to the reactor, and 10.51 g (0.0423 mol) of PSX (n=1) was added with a dropping funnel under nitrogen protection. Stir at room temperature for about 2 hours, then heat the reaction solution to 190° C. under nitrogen protection, and heat and stir for 5 hours while removing water. Then this reaction solution is cooled to room temperature, adds PSX (vi) 4.50 grams (0.0054 moles) with dropping funnel, adds BAPP11.54 grams (0.0281 moles) and NMP35 grams again, this reaction solution is stirred about 2 After 1 hour, NMP was added to make the solid content concentration reach 40% by weight to obtain a siloxane polyimide precursor resin solution. Synthesis Example 5

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PUM

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Abstract

An adhesive polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a phenolic hydroxyl group, carboxyl group, or vinyl group as a crosslinkable reactive group and (B2) a siloxanediamine and has a glass transition temperature of 50 to 25 DEG C and a Young's modulus (storage modulus) at 25 DEG C of 10<5> Pa or higher; and a laminate which comprises a substrate comprising a conductor layer and an insulating supporting layer having at least one polyimide resin layer and, disposed on a surface of the substrate, an adhesive layer comprising a layer of the adhesive polyimide resin. The adhesive polyimide resin and the laminate have satisfactory adhesion strength even after exposure to a high temperature of up to 27 DEG C and further have excellent heat resistance in reflow ovens. They are hence suitable for use in the bonding of electronic parts.

Description

technical field [0001] The present invention relates to an adhesive polyimide resin suitable as an adhesive for electronic components, and a laminate having a layer of the adhesive polyimide resin. Background technique [0002] In recent years, along with miniaturization and high density of electronic devices, semiconductor chips have been highly integrated. Accordingly, various methods have been proposed for semiconductor packaging. For example, an epoxy-based or polyimide-based organic packaging substrate, or an inorganic substrate such as silicon, is used as an insulating substrate for the package. Metal plates for heat dissipation are also used. Therefore, the bonding of these various types of materials becomes an important factor technology that affects the overall reliability of the package. [0003] On the other hand, in the manufacturing process of the package, in order to improve workability, an adhesive may be formed in advance on the sur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B32B27/34C08G73/10C08G77/455C09J179/08C09J183/10H01L21/58H01L23/498H05K1/03H05K3/46
CPCH01L2924/01015C08G73/106H01L23/49894H01L2924/0105H01L2924/01082H01L2924/01018H01L24/83H01L2924/01019H05K1/0346H05K3/4626H01L2924/01029H01L2924/00013C08G77/455H01L2224/29C09J183/10H01L2924/01027H01L2924/01013H01L2224/8385C09J179/08H01L2924/01039H01L2224/29298B32B27/34H01L2924/0665H01L2224/2919H01L2924/04953H01L2224/29191H01L2924/19042H01L24/29H01L2924/01005H01L2924/01033H01L2924/01006B32B15/08H01L2924/10253H01L2224/8319H01L2924/07802H01L2924/12042Y10T156/10Y10T428/31663Y10T428/31678Y10T428/31681Y10T428/31721Y10T428/31504H01L2924/0715H01L2924/07025H01L2924/00014H01L2924/00H01L2224/29099H01L2224/29199H01L2224/29299H01L2224/2929C08G73/10B32B2379/08B32B2311/12B32B2311/16B32B27/281B32B2311/24B32B2311/30B32B7/12
Inventor 德久极德光明金子和明
Owner NIPPON STEEL CHEMICAL CO LTD
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