10677results about "Circuit susbtrate materials" patented technology

An LED illumination apparatus according to the present invention includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.

A semiconductor package including top-surface terminals for mounting another semiconductor package provides a three-dimensional circuit configuration that can provide removable connection of existing grid-array packages having a standard design. A semiconductor die is mounted on an electrically connected to a circuit substrate having terminals disposed on a bottom side for connection to an external system. The die and substrate are encapsulated and vias are laser-ablated or otherwise formed through the encapsulation to terminals on the top surface of the substrate that provide a grid array mounting lands to which another grid array semiconductor package may be mounted. The bottom side of the vias may terminate and electrically connect to terminals on the substrate, terminals on the bottom of the semiconductor package (through terminals) or terminals on the top of the semiconductor die. The vias may be plated, paste-filled, filled with a low melting point alloy and may have a conical profile for improved plating performance.

A method for fabricating semiconductor components and interconnects includes the steps of providing a substrate, such as a semiconductor die, forming external contacts on opposing sides of the substrate by laser drilling vias through the substrate, and forming conductive members in the vias. The conductive members include enlarged terminal portions that are covered with a non-oxidizing metal. The method can be used to fabricate stackable semiconductor packages having integrated circuits in electrical communication with the external contacts. The method can also be used to fabricate interconnects for electrically engaging packages, dice and wafers for testing or for constructing electronic assemblies.

An organic electroluminescent device cfomprising: a transparent substrate; a first electrode disposed over the substrate for injecting charge of a first polarity; a second electrode disposed over the first electrode for injecting charge of a second polarity opposite to said first polarity; an organic light-emitting layer disposed between the first and the second electrode, wherein the second electrode is reflective, the first electrode is transparent or semi-transparent, and one or more intermediate layers of dielectric material with a refractive index greater than 1.8 or a metal material is disposed between the substrate and the first electrode forming a semi-transparent mirror whereby a microcavity is provided between the reflective second electrode and the semi-transparent mirror, all the intermediate layers disposed between the substrate and the first electrode having a surface nearest the organic light-emitting layer not more than 150 nm from a surface of the first electrode nearest the organic light-emitting layer.

An integrated circuit substrate having laser-embedded conductive patterns provides a high-density mounting and interconnect structure for integrated circuits. Conductive patterns within channels on the substrate provide interconnects that are isolated by the channel sides. A dielectric material is injection-molded or laminated over a metal layer that is punched or etched. The metal layer can provide one or more power planes within the substrate. A laser is used to ablate channels on the surfaces of the outer dielectric layer for the conductive patterns. The conductive patterns are electroplated or paste screen-printed and an etchant-resistive material is applied. Finally, a plating material can be added to exposed surfaces of the conductive patterns. An integrated circuit die and external terminals can then be attached to the substrate, providing an integrated circuit having a high-density interconnect.

A thermosetting composition comprises a capped poly(arylene ether), an alkenyl aromatic monomer, and an acryloyl monomer. The composition provides good flow properties and fast curing rates. After curing, the composition exhibits good stiffness, toughness, heat resistance, and dielectric properties.

Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.

A low-EMI circuit which realizes a high mounting density by converting the potential fluctuation off a power supply layer with respect to a ground layer which occurs on switching an IC device etc., into Joule's heat in the substrate without using any parts as a countermeasure against the EMI. Its structure, a circuit board using it, and a method of manufacturing the circuit board are also disclosed. Parallel plate lines in which the Q-value of the stray capacitance between solid layers viewed from the power supply layer and ground layer is equivalently reduced and which are matchedly terminated by forming a structure in which a resistor (resistor layer) and another ground layer are provided in addition to the power supply layer and the ground layer on a multilayered circuit board. A closed shield structure is also disclosed. This invention can remarkably suppress unwanted radiation by absorbing the potential fluctuation (resonance) which occurs in a power supply loop by equivalently reducing the Q-value of the stray capacitance, absorbing the standing wave by the parallel plate lines matchedly terminated and, closing and shielding the parallel plate lines.

A thermally conductive interface, which may be in the form of a double-sided, pressure sensitive adhesive tape, disposable intermediate a heat-generating source having a first heat transfer surface formed of a first material having a low surface energy, and a thermal dissipation member having a second heat transfer surface which is formed of a second material having a surface energy substantially higher than the surface energy of the first material, and which is disposable opposite the first heat transfer surface of the heat-generating source in a spaced-apart, heat transfer adjacency therewith. The interface includes a first pressure sensitive adhesive (PSA) surface which is bondable under pressure to at least a portion of the first heat transfer surface of the heat-generating source, and an opposing second pressure sensitive adhesive (PSA) surface bondable under pressure to at least a portion of the second heat transfer surface of the heat-generating source. The first PSA surface is presented from a layer of a thermally-conductive, first pressure sensitive adhesive composition, preferably silicone-based, having an affinity to the first heat transfer surface of the heat generating source. In turn, the second PSA surface is presented from a layer of a second pressure sensitive adhesive composition, preferably acrylic-based, different from the first composition and having an affinity to the second heat transfer surface of the thermal dissipation member. The interface is particularly adapted for bonding a plastic packaged electronic component to a metal heat sink.

A curable flame retardant epoxy resin composition including (a) at least one flame retardant epoxy resin; (b) at least one amphiphilic block copolymer; and (c) a curing agent. Such components are present in the curable composition in the appropriate amounts and ratios such that, upon curing, the block copolymer self-assembles into a nano structure morphology, such as a worm-like micelle morphology. The resulting cured product made from the composition of the present invention has a remarkably increased high fracture resistance; and allows the use of flame retardant epoxies in applications where fracture resistance is an issue.

According to the present invention, a rearview mirror comprises a first substrate having a front surface and a rear surface, a reflective coating disposed on a surface of the first substrate, and an electronic circuit component secured to the rear surface of the first substrate. The mirror element may be an electrochromic mirror element comprising a transparent second substrate positioned in front of the first substrate. The electronic component secured to the rear surface may be a component of a drive circuit for the electrochromic mirror element. The rearview mirror element may further comprise electrically conductive tracings provided on the rear surface of the first substrate electrically coupled to the electrical component. The tracings may be used to electrically couple the drive circuit to the electrodes of the electrochromic mirror element. The tracings may be deposited on the rear surface using numerous methods including inkjet printing techniques.

A thermosetting composition comprises a capped poly(arylene ether), an alkenyl aromatic monomer, and an acryloyl monomer. The composition provides good flow properties and fast curing rates. After curing, the composition exhibits good stiffness, toughness, heat resistance, and dielectric properties.

In embodiments, the present invention may attach at least two isolated electronic components to an elastomeric substrate, and arrange an electrical interconnection between the components in a boustrophedonic pattern interconnecting the two isolated electronic components with the electrical interconnection. The elastomeric substrate may then be stretched such that the components separate relative to one another, where the electrical interconnection maintains substantially identical electrical performance characteristics during stretching, and where the stretching may extend the separation distance between the electrical components to many times that of the unstretched distance.

The present invention provides systems and methods for attenuating the effect of ambient light on optical sensors and for measuring and compensating quantitatively for the ambient light.

There is presented a high frequency module, in which a recess 2a for mounting power amplifier device is formed on a lower surface of a dielectric substrate 2, and a recess 2b for mounting surface acoustic wave filter is formed on an upper surface of the dielectric substrate 2, and a power amplifier device 4 and a surface acoustic wave filter 8 are mounted through conductive bumps 3a and 3b on the recesses 2a and 2b, respectively. In addition, a through-hole conductor 11 whose one end is exposed at the lower surface of the dielectric substrate 2 is provided between the recesses 2a and 2b. The exposed end of the through-hole conductor 11 is attached to a thermal dissipation conductor 15 on an upper surface of an external electric circuit board 7 through a brazing material 13.

A curved-surface display panel fabrication method for fabricating a curved-surface display panel using a flat display panel having a first substrate and a second substrate includes: paring partially outer surfaces of the first substrate and the second substrate so as to reduce thicknesses thereof to a predetermined thickness; bending the pared flat display panel to a desired curved shape; attaching a first guide member which has a shape corresponding to the desired curved shape to the first substrate with a predetermined gap from the pared outer surface thereof and attaching a second guide member with has a shape corresponding to the desired curved shape to the second substrate with a predetermined gap from the pared outer surface thereof; and forming light transmitting reinforcing layers respectively in a space between the first guide member and the first substrate and a space between the second guide member and the second substrate.