125results about How to "Improve quality and reliability" patented technology

The present invention improves the reliability of wirings, facilitates the orientation control of liquid crystal, or improves a reflectance of a reflective liquid crystal display device. In the case where a plurality of leveling films are laminated, a first leveling film is formed to have a thickness smaller than that of a second leveling film, thereby realizing a higher leveling rate. Therefore, unevenness of the surface due to level differences is reduced, and it becomes possible to attain the above objects.

A new apparatus for inductively soldering surface-mount, straddle-mount and through-hole type electronic components into a self-soldering PCB (printed circuit board) in an automated fashion utilizing localized Electromagnetic Induction Heating (E.I.H.). Current manufacture technology for packaging electronic components depends on the reflow and wave soldering processes. Both processes heat up to relatively high temperatures the entire assembly, namely its PCB and all the electronic components being soldered into it. Such harsh high-temperature environment frequently causes components damage resulting in rejects and / or demanding rework. With this invention reflow oven and / or wave soldering equipment is not required. During a soldering operation only the leads and pads being soldered are heated but neither the body of said electronic components nor the dielectric material forming said self-soldering PCB and its interconnecting traces are heated. Because of this selectively localized inductive heating, the invention permits to reduce cost and improve the quality and reliability of manufactured products. The invention consumes about 200 times less energy than the reflow and wave soldering processes. This invention can readily be utilized to complement and / or supplement the reflow and wave soldering processes by providing selective inductive self-soldering of odd-form and / or heat-sensitive components. The invention also allows in-process, and in-situ, testing of soldered joints quality thus permitting rework before final assembly of a self-soldering PCB is completed. This invention also provides for a useful inductive de-soldering apparatus.

Disclosed is an earphone set using both bone conduction and air conduction. The earphone set includes: a dual earphone which allows a user to selectively hear sounds from the front or rear side of the earphone set; a case cover provided at an end of the dual earphone; a cylindrical reinforcing frame assembled on one side of the case cover; a finishing ring mounted on the outer peripheral surface of the cylindrical reinforcing frame; a top cover assembled on one side of the cylindrical reinforcing frame and the finishing ring and having an extension projection at one side thereof; a rubber ear cap assembled at a front end of the extension projection to be inserted into an ear hole of a user; and a bone conduction vibrator provided inside the dual earphone.

The present invention improves the reliability of wirings, facilitates the orientation control of liquid crystal, or improves a reflectance of a reflective liquid crystal display device. In the case where a plurality of levelling films are laminated, a first levelling film is formed to have a thickness smaller than that of a second levelling film, thereby realizing a higher levelling rate. Therefore, unevenness of the surface due to level differences is reduced and it becomes possible to attain the above objects.

A system and method for mapping. radio-frequency (RF) noise, and estimating channel quality in a multi-channel ultra-wideband communication system is provided. One method includes placing a plurality of time bins within a plurality of time frames and assigning a plurality of UWB communication channels comprising selected time bins. RF noise amplitude data is then sampled from selected time bins. The sampled RF noise amplitude data from the time bins is then averaged, thereby obtaining an average RF noise amplitude in each of the plurality of channels. The RF noise amplitude indicates the amount of RF noise present in a channel. The channels may then be ranked based on the characteristics of the RF noise.

A method for augmenting quality or reliability of semiconductor units, including providing few populations of semiconductor units that are subject to quality or reliability testing. The populations include few quality or reliability fail candidate populations and other population(s). The method includes the step of associating test flows to the populations. Each test flow includes stress testing sequence. The stress testing sequence for the quality or reliability fail candidate population includes a stress test of increased duration compared to duration of a stress test in the test flow of the other population. The stress test sequence for the other population includes a stress test of increased voltage compared to corresponding operating voltage specification for a semiconductor unit. The method further includes the step of applying, within a sort testing stage, the corresponding test flow to the populations and identifying any unit which failed the stress sequence.

A method for digital video image stabilization, the method including: estimating, from at least one portion of a frame, global frame displacement between an initial reference digital video frame and a current frame in a video sequence of frames; verifying, for the entire frame, the validity of the estimated frame displacement; and compensating for the estimated frame displacement by aligning at least one frame in the sequence with respect to the initial reference frame; wherein the step of aligning includes producing a corrected motion vector for the frame to be aligned and displacing the frame within the video frames sequence in accordance with the corrected motion vector.

In a working method for a cleaning device (2) that moves back and forth in a swimming pool (1), control thereof is such thatthe cleaning device (2) moves from a starting position at a low speed in a forward direction V in a first pass in a first cleaning path (4) until it runs up to a pool wall (3), wherein the distance D1 traversed along the first cleaning path is measured or determined,the cleaning device (2) is then guided to a second cleaning path (5) deviating from or offset relative to the first cleaning path (4) in a second pass, initially at a low speed, whereupon the cleaning device then moves in a backward direction along the second cleaning path (5) at a high speed until the distance Dz traversed is smaller than the distance D1 traversed in the previous pass by an amount A,upon reaching distance Dz the cleaning device (2) continues to move along the second cleaning path (5) at low speed until it runs up to a swimming pool wall (3), wherein the distance D2 traversed along the second cleaning path is measured or determined, andthe cleaning device (2) is controlled in the same manner in each subsequent pass as in the previous pass.

When an extra-high density optical disc, a DVD having a recording density lower than that of the extra-high density optical disc, a CD having a recording density lower than that of the DVD, and a combined optical recording medium in which the extra-high density optical disc, DVD, and CD are appropriately combined and integrally stacked are selectively recorded or reproduced by an objective lens whose numerical aperture (NA) is set to 0.75 or more, the objective lens satisfies the following expression:t<a·f+b wherein t: an axial thickness of the objective lens, f: a focal distance of the objective lens, a: a coefficient, and b: a constant, and the coefficient a and the constant b satisfies that a=2.02, b=−1.94; a=2.08, b=−1.84; or a=2.11, b=−1.77.

A method for fabricating a circuit board with a conductive structure and the same are proposed. A buffer metal layer is formed on an electrically connecting pad of a circuit layer of a circuit board in advance. A conductive structure is then formed on the buffer metal layer to form the conductive structure of the present invention and is connected to the circuits located in the different layers of the circuit board. The combining strength of the conductive structure and the electrically connecting pad is reinforced by the buffer metal layer as the buffer metal layer has high ductility. The long-term electrical quality and stability are also enhanced.

A method of cleaning a wafer, adapted for a patterned gate structure. The gate structures comprise a gate dielectric layer, a nitrogen-containing barrier layer and a silicon-containing gate layer sequentially stacked over the substrate. The method includes cleaning the substrate with phosphoric acid solution and hydrofluoric acid solution so that silicon nitride residues formed in a reaction between the nitrogen-containing barrier layer and the silicon-containing gate layer can be removed and the amount of pollutants and particles can be reduced. Ultimately, the yield of the process as well as the quality and reliability of the device are improved.

An approach is provided for managing a deployment of a software package. A retrieved quality assurance (QA) seal corresponding to a software package is verified. A target deployment environment (TDE) is obtained. The QA seal is read to obtain first and second profiles, and metadata, which specify a deployment environment, hardware and software dependencies required in the deployment, and an approval for a release of the software package to the specified deployment environment, respectively. Based on a determination that the TDE matches the specified deployment environment, the QA seal indicates the software package is compatible with the TDE. The dependencies are determined to be satisfied. Based on the software package being compatible with the TDE, the dependencies being satisfied, and the specified approval for the release of the software package, a notification of an authorization of the deployment of the software package to the TDE is generated.