Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof

A reflow soldering and PCB board technology, which is applied in the direction of assembling printed circuits with electrical components and forming electrical connections of printed components, can solve the problems of cumbersome assembly steps and inconvenient demoulding operations, so as to reduce labor input and ensure product processing Quality, the effect of simplifying the processing flow

Inactive Publication Date: 2010-06-02
HUIZHOUSRTY INFORMATION ELECTRONICS
View PDF1 Cites 49 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The disadvantages of the above method are: it is difficult to realize the device that needs to avoid the protrusion of the PCB board, the assembly steps are cumbersome, the positioning pin is on the cover, and the demoulding operation is inconvenient

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof
  • Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof
  • Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The present invention will be further described below in conjunction with accompanying drawing.

[0020] see figure 2 , the positioning jig 1 used for loading, fixing and positioning PCB and FPC described in this embodiment, the positioning jig 1 is provided with a positioning pin 2, which is an auxiliary in the process of assembling the carrier board 3 and the cover board 6 Fixture, the carrier board 3 can be a hard high temperature resistant aluminum alloy material, the carrier board 3 is processed and formed sinker 4 according to the characteristics of PCB and FPC, and a set of high temperature resistant permanent Magnets, positioning holes 5 are also set on the carrier plate 3, and the cover plate 6 can be processed by a thin plate of ferromagnetic material with elastic deformation. The avoidance hole 7 is set according to the product characteristics, and the positioning hole 8 is set on the cover plate 6 to connect with the carrier plate 3. Positioning hole 5 coo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method for the assembly and the reflow soldering of a PCB and an FPC and a special positioning fixture thereof, which mainly solve the problems of inaccurate positioning, low efficiency of welding efficiency, difficulty for ensuring product quality and the like of manual assembly in the processes of assembling and soldering the PCB and the FPC. The method comprises the following steps: firstly, supporting, positioning and fixing the PCB by using a magnetic carrier board; secondly, carrying the FPC; next, preliminarily positioning the PCB and the FPC with a bonding agent; thirdly, printing a solder paster on a solder pad at the junction of the FPC and the PCB; and finally, pressing a magnetic cover board on the magnetic carrier board, fixing the positions of the FPC and the PCB, and performing the reflow soldering on the FPC and the PCB through a reflow oven. The method for the assembly and the reflow soldering of the PCB and the FPC and the special positioning fixture thereof have the advantages of simple operation, good reliability, great improvement on the production efficiency and the production quality of the FPC and the PCB in the processes of assembling and soldering, and processing cost reduction.

Description

technical field [0001] The invention belongs to the field of electronic product manufacturing, in particular to a combined welding method of a printed circuit board and a flexible circuit board. Background technique [0002] With the rapid development of science and technology and the improvement of people's living standards, information, fashion, health, etc. have become important components of life, and all of these are closely related to electronic products. The increasing functions, reliable performance and the speed of updating of electronic products all provide more space and challenges for the manufacturing technology of electronic products. The amount of flexible circuit boards and their integrated circuits is also rapidly expanding, and there are also a large number of printed circuit boards (abbreviated as PCB in English, commonly known as hard boards, note: hereinafter referred to as PCB) and flexible circuit boards (FPC in English, commonly known as soft boards)....

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/40H05K3/34
Inventor 唐明王小林陶建新文铁光邹洪海
Owner HUIZHOUSRTY INFORMATION ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com