977results about "Programmable/customizable/modifiable circuits" patented technology

A digital core embodied within a semiconductor die that requires plural separate power supply voltage domains is situated within any of a variety of integrated circuit packaging technologies. Within the integrated circuit package including this semiconductor die also exists a switch mode DC-to-DC voltage converter, preferably a synchronous step-down regulator powering the entire integrated circuit from one supply voltage. The components contained within the integrated circuit package along with the semiconductor die include the switch mode power supply's power switching transistors, inductor core and windings, digital open-loop output voltage fixing circuitry, output capacitors and substrate for mounting said components when integrated within a packaging technology that does not already include a substrate.

This specification describes techniques for manufacturing an electronic system module. The module includes flexible multi-layer interconnection circuits with trace widths of 5 microns or less. A glass panel manufacturing facility, similar to those employed for making liquid crystal display, LCD, panels is used to fabricate the interconnection circuits. A polymer base layer is formed on a glass carrier with an intermediate release layer. Alternate layers of metal and dielectric are formed on the base layer, and patterned to create an array of multi-layer interconnection circuits on the glass panel. A thick layer of polymer is deposited on the interconnection circuit, and openings formed at input / output (I / O) pad locations. Solder paste is deposited in the openings to form wells filled with solder. After dicing the glass carrier to form separated interconnection circuits, IC chips are stud bumped and assembled using flip chip bonding, wherein the stud bumps on the components are inserted into corresponding wells on the interconnection circuits. The IC chips are tested and reworked to form tested circuit assemblies. Methods for connecting to testers and to other modules and electronic systems are described. Module packaging layers are provided for hermetic sealing and for electromagnetic shielding. A blade server embodiment is also described.

A memory module includes a memory device, a connector, a plurality of lines coupling the memory device and the connector, and termination circuitry coupled to at least a subset of the lines. A method for terminating a memory bus includes providing at least two expansion sockets coupled to the memory bus; interfacing two expansion memory modules including termination circuitry with the expansion sockets; and disabling the termination circuitry for one of the expansion memory modules.

Printed circuit boards and breadboard devices have contact pads and magnetic component connectors where connection between the contact pads and the magnetic component connectors are made by magnetic force. Either the contact pad or the magnetic component connector will be magnetic and the other will be made of a material to which a magnet will be attracted. For example, printed circuit boards, which usually have copper traces, include contact pads made of a material to which a magnet will be attracted. Circuit components are connected to magnetic component connectors having magnetic legs which then connect the components to the contact pads of the circuit board or breadboard device. This makes the connection of components to a printed circuit board or breadboard device fast and easy and provides for easy removal and replacement of components. Magnetic component connectors can also be configured to connect magnetically to one another.

There is provided a method of manufacturing a conductive layer of in a signal transmission substrate. The method includes sewing conductive thread in sheet-like material having an insulating property so as to form one of a plurality of low resistance regions using the conductive thread in a high resistance region formed by the sheet-like material, moving the conductive thread from an end point of a previously sewed low resistance region to a start point of a low resistance region to be sewed subsequently, repeating the sewing and moving steps to form the plurality of low resistance regions in the high resistance region, and forming a plurality of holes in the conductive layer by press working so that an electrical component attached to at least one of the plurality of holes is able to transmit a signal between neighboring ones of the plurality of low resistance regions.