The integrated lead suspension
assembly comprises several improvements. An oversized terminating pad for the electrical traces and a smaller adjacent
insulation layer on the flexure
assembly enable
laser solder ball bonding of the pads to the read / write terminal contacts on the slider without clamping operation. Consequently, the tip of the load beam can be made narrow for a structure that provides for head loading and unloading functions, which improves the dynamic performance of the suspension
assembly. The flexure assembly is configured such that it requires no permanent bending in its forming process, and any permanent bending required is done to the load beam. The
limiter that limits the travel of the flexure assembly is formed on the load beam and it is bent to the functional position only after attachment of the flexure assembly to the load beam. The
limiter is configured and positioned at the
leading edge side of the slider to optimize the unloading process and to minimize the possibility of disengagement of the
limiter and the flexure assembly during high shock environment. Asymmetric backing branches are provided for the read and write traces in the flexure assembly located at the hinge area of the load beam, the widths of which are sized to optimize the dynamic
signal performance of the read and write traces without
impact on the
vertical stiffness of the suspension. Low profile flanges at 30°–60° that bend from the plane of the load beam are provided along the edges of the load beam to optimize
bending stiffness and flow induced vibration. Dimples are provided along the load beam to facilitate
insertion of a plastic head separation tool.