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4872 results about "Grain boundary" patented technology

A grain boundary is the interface between two grains, or crystallites, in a polycrystalline material. Grain boundaries are 2D defects in the crystal structure, and tend to decrease the electrical and thermal conductivity of the material. Most grain boundaries are preferred sites for the onset of corrosion and for the precipitation of new phases from the solid. They are also important to many of the mechanisms of creep. On the other hand, grain boundaries disrupt the motion of dislocations through a material, so reducing crystallite size is a common way to improve mechanical strength, as described by the Hall–Petch relationship. The study of grain boundaries and their effects on the mechanical, electrical and other properties of materials forms an important topic in materials science.

Faceted structure, article, sensor device, and method

A faceted structure is provided that includes a crystalline composition comprising a metal nitride. The metal comprises one or more of aluminum, boron, indium, or gallium. The crystalline composition has at least one exposed surface that is a grain boundary, an etched surface, or a naturally formed facet, and the surface has the same crystallographic orientation of a substrate on which the crystalline composition is grown. A sensor device is provided that includes a faceted structure. Associated methods of making and using the faceted structure in a sensor device are provided.
Owner:MORPHO DETECTION INC

Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidification

Methods for processing an amorphous silicon thin film sample into a polycrystalline silicon thin film are disclosed. In one preferred arrangement, a method includes the steps of generating a sequence of excimer laser pulses, controllably modulating each excimer laser pulse in the sequence to a predetermined fluence, homoginizing each modulated laser pulse in the sequence in a predetermined plane, masking portions of each homogenized fluence controlled laser pulse in the sequence with a two dimensional pattern of slits to generate a sequence of fluence controlled pulses of line patterned beamlets, each slit in the pattern of slits being sufficiently narrow to prevent inducement of significant nucleation in region of a silicon thin film sample irradiated by a beam let corresponding to the slit, irradiating an amorphous silicon thin film sample with the sequence of fluence controlled slit patterned beamlets to effect melting of portions thereof corresponding to each fluence controlled patterned beamlet pulse in the sequence of pulses of patterned beamlets, and controllably sequentially translating a relative position of the sample with respect to each of the fluence controlled pulse of slit patterned beamlets to thereby process the amorphous silicon thin film sample into a single or polycrystalline silicon thin film.
Owner:THE TRUSTEES OF COLUMBIA UNIV IN THE CITY OF NEW YORK

Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidification

Methods for processing an amorphous silicon thin film sample into a polycrystalline silicon thin film are disclosed. In one preferred arrangement, a method includes the steps of generating a sequence of excimer laser pulses, controllably modulating each excimer laser pulse in the sequence to a predetermined fluence, homoginizing each modulated laser pulse in the sequence in a predetermined plane, masking portions of each homoginized fluence controlled laser pulse in the sequence with a two dimensional pattern of slits to generate a sequence of fluence controlled pulses of line patterned beamlets, each slit in the pattern of slits being sufficiently narrow to prevent inducement of significant nucleation in region of a silicon thin film sample irradiated by a beamlet corresponding to the slit, irradiating an amorphous silicon thin film sample with the sequence of fluence controlled slit patterned beamilets to effect melting of portions thereof corresponding to each fluence controlled patterned beamlet pulse in the sequence of pulses of patterned beamlets, and controllably sequentially translating a relative position of the sample with respect to each of the fluence controlled pulse of slit patterned beamlets to thereby process the amorphous silicon thin film sample into a single or polycrystalline silicon thin film
Owner:THE TRUSTEES OF COLUMBIA UNIV IN THE CITY OF NEW YORK

Grain boundary phase-reconstructed high-corrosion resistance Sintered NdFeB magnet and preparation method thereof

The invention discloses a sintered Nd-Fe-B magnet with high corrosion resistance and the grain boundary reconstruction and a preparation method thereof. The composition of the invention is that: NdeFe100-e-f-gBfMg, wherein, e is greater than or equal to 6 and equal to or less than 24, f is greater than or equal to 5. 6 and equal to or less than 7, g is greater than or equal to 0.03 and equal to or less than 8, M is one or some of elements Dy, Tb, Pr, Sm, Yb, La, Co, Ni, Cr, Nb, Ta, Zr, Si, Ti, Mo, W, V, Ca, Mg, Cu, Al, Zn, Ga, Bi, Sn and In; The method is that: main phrase alloy and reconstructed grain boundary phase alloy are respectively pulverized and mixed uniformly; the powder mixture is pressed to a mould in the magnetic field, and fabricated into a sintering magnet in a high vacuum sintering furnace. By the reconstruction of the grain boundary phase composition, the invention can obtain the grain boundary phase alloy with low melting point and high electrode potential, decrease the potential difference between the main phase and the grain boundary phase on the basis of ensuring the magnetic properties, promote the intrinsic corrosion resistance of magnet, and has the advantages of simple process, low cost and being suitable for the batch production. Therefore, by combining the grain boundary reconstruction and double alloy method, the sintered Nd-Fe-B magnet with high intrinsic corrosion resistance can be prepared.
Owner:ZHEJIANG UNIV

Vertical memory cell for high-density memory

This disclosure provides embodiments for the formation of vertical memory cell structures that may be implemented in RRAM devices. In one embodiment, memory cell area may be increased by varying word line height and / or word line interface surface characteristics to ensure the creation of a grain boundary that is suitable for formation of conductive pathways through an active layer of an RRAM memory cell. This may maintain continuum behavior while reducing random cell-to-cell variability that is often encountered at nanoscopic scales. In another embodiment, such vertical memory cell structures may be formed in multiple-tiers to define a three-dimensional RRAM memory array. Further embodiments also provide a spacer pitch-doubled RRAM memory array that integrates vertical memory cell structures.
Owner:MICRON TECH INC

Perpendicular magnetic recording medium and process for manufacture thereof

An object of the present invention is to provide a perpendicular magnetic recording medium the SNR of which is improved by reducing noise thought to be due to an auxiliary recording layer so that a higher recording density can be achieved, and a method of manufacturing the same.In order to achieve the above object, a representative configuration of a perpendicular magnetic recording medium 100 according to the present invention includes, on a base, at least a magnetic recording layer 122 having a granular structure in which a non-magnetic grain boundary portion is formed between crystal particles grown in a columnar shape; a non-magnetic split layer 124 disposed on the magnetic recording layer 122 and containing Ru and oxygen; and an auxiliary recording layer 126 that is disposed on the split layer 124 and that is magnetically approximately continuous in an in-plane direction of a main surface of the base 110.
Owner:WESTERN DIGITAL TECH INC

Method for increasing sintering Nd-Fe-B coercive force by adding nano-oxide in crystal boundary phase

This invention discloses a method for increasing sintered Nd FeB coercive force by adding nm oxide in grain-boundary phase including the following steps: 1,applying casting technology to produce NdFeB ingot alloy or applying rapid hardening film technology to produce NdFeB rapid hardening film of with host phase alloy, applying casting technology to produce ingot alloy or rapid hardening film technology to get rapid hardening film or rapid quench technology to manufacture a rapid quench strip with the grain boundary phase alloy, 2, processing powder with the two alloys, 3, adding a nm oxide to the grain boundary phase alloy powder, 4, pressing the mixed powder into formation, 5, producing sintered magnetic body in a vacuum sintering oven.
Owner:ZHEJIANG UNIV

Semiconductor device and manufacturing method thereof

A technology is provided which allows a reduction in the size of a semiconductor device without degrading an electromagnetic shielding effect and reliability against reflow heating. After a plurality of components are mounted over a component mounting surface of a module substrate, a resin is formed so as to cover the mounted components. Further, over surfaces (upper and side surfaces) of the resin, a shield layer including a laminated film of a Cu plating film and an Ni plating film is formed. In the shield layer, a plurality of microchannel cracks are formed randomly along grain boundaries and in a net-like configuration without being coupled to each other in a straight line, and form a plurality of paths extending from the resin to a surface of the shield layer by the microchannel cracks.
Owner:RENESAS ELECTRONICS CORP
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