618 results about "Low inductance" patented technology

A low inductance electrical machine that may be used as an alternator or motor with low armature inductance is disclosed. Arrangements of complementary armature windings are presented in which the fluxes induced by currents in the armature windings effectively cancel leading to low magnetic energy storage within the machine. This leads to low net flux levels, low core losses, low inductance and reduced tendency toward magnetic saturation. The inclusion of additional gaps in the magnetic circuit allows for independent adjustment of air gap geometry and armature inductance. Separately excited field arrangements are disclosed that allow rotor motion to effect brush-less alternator or brush-less motor operation. An exemplary geometry includes a stator including two annular rings and a concentric field coil together with a rotor structure separated from the stator by four air gaps.

A flip chip power device having an integrated low inductance ground and heat sink path and an isolation structure is provided. A substrate is formed having transistors and an ohmic contact region circumscribing the transistors. Dielectric layers are formed on the substrate, and a common metal layer is formed on the dielectric layers. An isolation metal layer is formed on the dielectric layers above the ohmic contact region. The common metal layer is coupled to a first region of each of the transistors, and the isolation metal layer is coupled to the ohmic contact region. A first bump is formed on the common metal layer, and a second bump is formed on the isolation metal layer. When the power device is attached to a second substrate, the first bump forms a low inductance ground and heat sink path to the second substrate, and an isolation structure is formed.

A broad-band technique for reducing the distributed inductance of a four-conductor Kelvin cable is disclosed. A special inductance-canceling cable section is connected in tandem with the cable section contacting the cell / battery. Connections between the two cable sections are transposed such that conductors in each conductor pair of the canceling section connect to current-carrying and voltage-sensing conductors from different conductor pairs in the contacting section. The canceling section thereby exhibits a distributed negative mutual inductance between its current-carrying and voltage-sensing conductors that can effectively cancel the distributed positive mutual inductance introduced by the contacting section.In one embodiment, conductor pairs comprise pairs of insulated wires which may be twisted together. In other disclosed embodiments, conductor pairs comprise shielded coaxial cables.

A capacitor-built-in-type printed wiring substrate which can reliably eliminate noise and attain extremely low resistance and low inductance in connections between an IC chip and the capacitor, and a printed wiring substrate and capacitor for use in the same. A capacitor-built-in-type printed wiring substrate 100 on which an IC chip is mounted includes a capacitor-built-in-type printed wiring substrate 110 and an IC chip 101 mounted on the capacitor-built-in-type printed wiring substrate 110. A printed wiring substrate 120 includes a number of connection-to-IC substrate bumps 152 and a closed-bottomed capacitor accommodation cavity 121 formed therein. A capacitor 130 is disposed in the cavity 121 and includes a pair of electrode groups 133E and 133F and a number of connection-to-IC capacitor bumps 131 connected to either one of the paired electrode groups 133E and 133F. The connection-to-IC capacitor bumps 131 are flip-chip-bonded to corresponding connection-to-capacitor bumps 103 on the IC chip 101. The connection-to-IC substrate bumps 152 are flip-chip-bonded to corresponding connection-to-substrate bumps 104 on the IC chip 101.

A Class D switching audio amplifier incorporating four state modulation, input-to-output drive and feedback signal isolation, dual topology output filtration, and a low inductance board layout. The four state modulation results in a common mode voltage in the absence of audio. The input-to-output isolation of drive and feedback signals allows for elimination of large power transformers in applications without user-accessible outputs. Such isolation may make use of optical isolators. The output filter includes common mode and differential topology filter stages. The low inductance board layout treats the amplifier and power supply boards as modules, and utilizes both sides of the amplifier board in order to minimize trace length.

A multilayer ceramic capacitor assembly capable of exhibiting low high-frequency inductance and a controlled equivalent series resistance (ESR) while maintaining a useful capacitance value includes respective pluralities of first and second electrode elements interleaved to form a stack. Controlled ESR is achieved either through inclusion of specific types of materials or through alteration of the shape of various component parts. A resistive material may be used in typical end terminations, via terminations, electrode elements or connective tab structures. Additionally, the dielectric may be made lossy so as to enhance resistivity without overly affecting device capacitance. Still further, an additional layer of resistive material may be added to an outer device surface to connect filled-via terminations to end terminations or radial resistive prints may be used to only partially fill the vias. Finally, various electrode element configurations, such as flat plate, serpentine, mesh, L-, O- or U-shaped patterns, may be employed.

A method and apparatus for tuning and matching extremely small sample coils with very low inductance for use in magnetic resonance experiments conducted at low frequencies. A circuit is disclosed that is appropriate for performing measurements in fields where magnetic resonance is beneficially utilized. The circuit has a microcoil, an adjustable tuning capacitance, and added inductance in the form of a tuning inductor. The microcoil is an electrical coil having an inductance of about 25 nanohenries (nH) or less. Because additional inductance is purposefully added, the capacitance required for resonance and apparatus function is proportionally and helpfully reduced. The apparatus and method permit the resonant circuit and the magnet to be made extremely small, which is crucial for new applications in portable magnetic resonance imaging, for example.

A busbar assembly for an inverter module has a power module, a capacitor module with at least one capacitor, and a battery all interconnected by a busbar. The busbar includes a base busbar portion that is electrically coupled to the battery and a branch busbar portion that extends from the base busbar to the power module and that electrically connects to the capacitor module at points located between the base node and the power module.

An inductively coupled plasma source is provided with a peripheral ionization source for producing a high-density plasma in a vacuum chamber for semiconductor wafer coating or etching. The source includes a segmented configuration having high and low radiation segments and produces a generally ring-shaped array of energy concentrations in the plasma around the periphery of the chamber. Energy is coupled from a segmented low inductance antenna through a dielectric window or array of windows and through a segmented shield or baffle. The antenna has concentrated conductor segments through which current flows in one or more small cross-section conductors to produce high magnetic fields that couple through the high-transparency shield segments into the chamber, while alternating distributed conductor segments, formed of large cross-section conductor portions or diverging small conductor sections, permit magnetic fields to pass through or between the conductors and deliver only weak fields, which are aligned with opaque shield sections and couple insignificant energy to the plasma. The source provides spatial control of plasma energy distribution, which aids in control of the uniformity of plasma processing across the surface of the semiconductor being processed.

The present invention relates to a device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor layer containing at least one embedded singulated capacitor; and at least one planar capacitor laminate; wherein said planar capacitor laminate serves as a low inductance path to supply a charge to said at least one embedded singulated capacitor; and wherein said at least one embedded singulated capacitor is connected in parallel to at least one of the said planar capacitor laminates; and wherein said power core is interconnected to at least one signal layer.

A method for fabricating a low resistance, low inductance device for high current semiconductor flip-chip products. A structure is produced, which comprises a semiconductor chip with metallization traces, copper lines in contact with the traces, and copper bumps located in an orderly and repetitive arrangement on each line so that the bumps of one line are positioned about midway between the corresponding bumps of the neighboring lines. A substrate is provided which has elongated copper leads with first and second surfaces, the leads oriented at right angles to the lines. The first surface of each lead is connected to the corresponding bumps of alternating lines using solder elements. Finally, the assembly is encapsulated in molding compound so that the second lead surfaces remain un-encapsulated.