14641 results about "CMOS" patented technology

A demultiplexer for a two-dimensional array of a plurality of nanometer-scale switches (molecular wire crossbar network) is disclosed. Each switch comprises a pair of crossed wires which form a junction where one wire crosses another and at least one connector species connecting said pair of crossed wires in said junction. The connector species comprises a bi-stable molecule. The demultiplexer comprises a plurality of address lines accessed by a first set of wires in the two-dimensional array by randomly forming contacts between each wire in the first set of wires to at least one of the address lines. The first set of wires crosses a second set of wires to form the junctions. The demultiplexer solves both the problems of data input and output to a molecular electronic system and also bridges the size gap between CMOS and molecules with an architecture that can scale up to extraordinarily large numbers of molecular devices. Further, the demultiplexer is very defect tolerant, and can work despite a large number of defects in the system.

In an embodiment of the present invention, a hierarchical differential sensing approach is effectuated wherein an array of 1T DRAM cells are organized in rows and columns in which the rows represent words and the columns represent bits of the word, each bit column having more than one pair of balanced, true and complement local bit lines, the local bit lines being connected to a pair of balanced, true and complement global bit lines by way of CMOS transistor switches.

A semiconductor process and apparatus provide a high performance CMOS devices (108, 109) with hybrid or dual substrates by etching a deposited oxide layer (62) using inverse slope isolation techniques to form tapered isolation regions (76) and expose underlying semiconductor layers (41, 42) in a bulk wafer structure prior to epitaxially growing the first and second substrates (84, 82) having different surface orientations that may be planarized with a single CMP process. By forming first gate electrodes (104) over a first substrate (84) that is formed by epitaxially growing (100) silicon and forming second gate electrodes (103) over a second substrate (82) that is formed by epitaxially growing (110) silicon, a high performance CMOS device is obtained which includes high-k metal PMOS gate electrodes having improved hole mobility.

Semiconductor structures, devices, and methods of forming the structures and device are disclosed. Exemplary structures include multi-gate or FinFET structures that can include both re-channel MOS (NMOS) and p-channel MOS (PMOS) devices to form CMOS structures and devices on a substrate. The devices can be formed using selective epitaxy and shallow trench isolation techniques.

Described herein are a device utilizing a gate electrode material with a single work function for both the pMOS and nMOS transistors where the magnitude of the transistor threshold voltages is modified by semiconductor band engineering and article made thereby. Further described herein are methods of fabricating a device formed of complementary (pMOS and nMOS) transistors having semiconductor channel regions which have been band gap engineered to achieve a low threshold voltage.

A strained Si CMOS structure is formed by steps which include forming a relaxed SiGe layer on a surface of a substrate; forming isolation regions and well implant regions in said relaxed SiGe layer; and forming a strained Si layer on said relaxed SiGe layer. These processing steps may be used in conjunction with conventional gate processing steps in forming a strained MOSFET structure.

Device-enhancing coatings are deposited on CMOS devices by successively masking with photoresist each one of the sets of N-channel and P-channel devices while unmasking or leaving unmasked the other set, and after each step of successively masking one of the sets of devices, carrying out low temperature CVD steps with a toroidal RF plasma current while applying an RF plasma bias voltage. The temperature of the workpiece is held below a threshold photoresist removal temperature. The RF bias voltage is held at a level at which the coating is deposited with a first stress when the unmasked set consists of the P-channel devices and with a second stress when the unmasked set consists of N-channel devices.

An autonomous vacuum cleaner comprises: obstacle detection sensors; moving means; a cleaning means including a power brush, a suction fan and a nozzle for sucking up dust on a floor surface; floor surface sensors each comprising a passive-type CMOS line sensor to receive light from the floor surface for detecting floor surface conditions. It performs cleaning while autonomously moving. Based on received light signals of the floor surface sensors, distance distributions to floor surface areas within the viewing angle of each sensor are derived. Detection of a step on the floor surface and identification of the material of the floor surface (polished floorboard, tatami or carpet) are performed by analyzing spatial frequency in the distance distribution. Based on the identification, cleaning conditions including at least the moving speed, the dust suction force of the suction fan or the brushing strength of the power brush are changed. With simple structure using one same floor sensor, this autonomous vacuum cleaner can detect a step on a floor surface and can more accurately identify the material of the floor surface, thereby enabling meticulous cleaning.

The disclosure is directed toward an optical excitation / detection device that includes an arrayed plurality of photodetectors and separately formed photoemitters, as well as a method for making such a device. A CMOS fabricated photodetector array including a plurality of individual photoreceptors is selectively etched back between photoreceptor locations to reveal a plurality of recessed regions having a certain geographic profile. A plurality of semiconductor blocks, each having light emitting capability and each having a certain geometric profile that is complementary in size and shape to the certain geometric profile of the recessed regions, are separately fabricated. These blocks are included within a fluid to form a slurry. The slurry is then flowed over the CMOS fabricated photodetector array in accordance with a fluidic self-assembly technique, and the included semiconductor blocks are individually deposited within each of the plurality of recessed regions in the CMOS fabricated photodetector array. The deposited blocks are then attached within the recessed regions to form the optical excitation / detection device from an arrayed plurality of photodetectors and separately formed photoemitters.

A three dimensional (3D) integrated circuit (IC), 3D IC chip and method of fabricating a 3D IC chip. The chip includes multiple layers of circuits, e.g., silicon insulator (SOI) CMOS IC layers, each including circuit elements. The layers may be formed in parallel and one layer attached to another to form a laminated 3D chip.

An enhanced frame buffer pixel circuit with two control transistors and a separate capacitor put in as a memory capacitor before the memory transistor yields a high contrast ratio by removing induced charge and solving a charge sharing problem between the memory capacitor and the liquid crystal display (LCD) capacitor. The memory transistor may be made of either CMOS or PMOS. The frame buffer pixel can be used to drive binary displays which expresses ON and OFF only if a comparator is put in after the pixel electrode circuit to represent gray levels with reduced sub-frame frequency.

Combination imaging and treatment assemblies are described herein which may utilize a deployment catheter in combination with an endoscopic system. The combined system comprises an open architecture to modularly incorporate any number of imaging devices (such as optical fiber, CMOS or CCD endoscopes) to provide high resolution optical images of tissue within an opaque environment. Additional variations may include an imaging hood or balloon member incorporated upon an endoscope or advanced through an endoscope working channel to visualize and treat tissue through blood.

A family of semiconductor devices is formed in a substrate that contains no epitaxial layer. In one embodiment the family includes a 5V CMOS pair, a 12V CMOS pair, a 5V NPN, a 5V PNP, several forms of a lateral trench MOSFET, and a 30V lateral N-channel DMOS. Each of the devices is extremely compact, both laterally and vertically, and can be fully isolated from all other devices in the substrate.