2985results about How to "Control flow" patented technology

The present invention provides a flexible, low profile vascular occlusion device having large volume filling capability and high metal content for fast occlusion, of the type fabricated from braided tubular metal fabric having an expanded preset configuration and an elongated collapsed reduced diameter configuration for delivery through a catheter to a treatment site and shaped to create an occlusion of an abnormal opening in a body organ or vessel, the woven metal fabric having a memory property whereby the medical device tends to return to said expanded preset configuration when unconstrained. The device further includes a first shape formed from the braided tubular fabric consisting of a repeating pattern of expanded volume segments separated by small diameter articulation segments and a second overall device shape comprised of the first shape formed about itself in various shapes to occlude a vessel. In one embodiment a shaping wire contained coaxially within the tubular braid, provides or assists in the formation of the second overall device shape.

A clot retrieval device may include an elongate member and an expandable clot engaging element configured to extend across the clot in its expanded state. The expandable clot engaging element may include a first monolithic structure and a second monolithic structure. The first monolithic structure may encircle the second monolithic structure over at least a portion of its length. The second monolithic structure may include a proximal section, an intermediate section, and a distal section. The distal section may include an expansion.

In one embodiment of the present inventions, an exhaust outlet in a vacuum processing chamber includes a nonsealing flow restrictor which can facilitate rapid opening and closing of the flow restrictor in some applications. Because the flow restrictor is a nonsealing flow restrictor, the conductance of the flow restrictor in the closed position may not be zero. However, the flow restrictor can restrict the flow of an exhaust gas from the chamber to permit the retention of sufficient processing gas in the chamber to deposit a film on the substrate or otherwise react with the substrate. After a film has been deposited, typically in a thin atomic layer, the exhaust flow restrictor may be opened such that the flow restrictor conductance is significantly increased to a second, higher flow rate to facilitate exhausting residue gas from the chamber. The nonsealing flow restrictor may be closed again to deposit a second layer, typically of a different material onto the substrate. The nonsealing flow restrictor may be rapidly opened and closed to deposit alternating layers of a variety of materials onto the substrate.