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286results about How to "Improve manufacturing speed" patented technology

Apparatus for manufacturing stacked type electronic part

An object of the present invention is to provide an apparatus for manufacturing a stacked type electronic part which can manufacture a stacked type electronic part dried at low temperature for a product by increasing a manufacturing speed. A base plate is placed in a predetermined linear section path to be moved back and forth and be moved vertically. Above the section path are juxtaposed one or more insulator layer forming means discharging an insulating resin paste, conductor layer forming means jetting a conductor paste by an ink jet system and drying means drying the pastes. A thin film layer having a predetermined conductor pattern placed on an insulator layer while the base plate is moved back and forth one or more times. Those steps are repeated to form a stacked type electronic part.
Owner:UHT CORP

Connectors manufactured by three-dimensional printing

A hollow conduit is provided. In another aspect, a quick connector, suitable to carry fluid therethrough, is made of layers of material, a light curable material and / or multiple built-up materials. Another aspect uses a three-dimensional printing machine to emit material from an ink jet printing head to build up a conduit.
Owner:A RAYMOND & CO

IEC61850-based CAD electric power graphic generation analysis method

The invention discloses an IEC61850-based CAD electric power graphic generation analysis method, which comprises the steps of: defining more than one connecting terminal graphic block for equipment primitives and position regions calculated via supporting positions of connecting terminal graphic blocks according to an IEC61850 standard, and defining the actual information represented by the equipment primitives in the graphic blocks subordinative to the equipment primitives as an attribute; calculating the number of connecting terminals on the two ends of virtual terminals in a selected SCD file, calculating the spatial dimensions of the equipment primitives, arranging the primitives of the virtual terminals, and drawing connecting lines of the arranged primitives of the virtual terminals; acquiring terminals included by the primitives and absolute positions of the terminals according to the primitives of the virtual terminals, acquiring the connecting relation of the terminals, and outputting an SSD file according to the IEC61850 standard. The invention has the advantages of avoiding an error due to manual primitive connection, improving the making speed and level of intelligent transformer substation SCD and enhancing the design efficiency of a CAD electric power graphic.
Owner:CHINA ENERGY ENG GRP GUANGDONG ELECTRIC POWER DESIGN INST CO LTD

Ultrasonic and micro-forging composite device for improving microstructure and performance of additively manufactured metal and additive manufacturing method

The invention provides an ultrasonic and micro-forging composite device for improving the microstructure and performance of additively manufactured metal and an additive manufacturing method. The ultrasonic and micro-forging composite device comprises an energy converter, a pneumatic slider, a pneumatic slider connection frame, an amplitude transformer, a tool head and a roller. The energy converter is arranged in an energy converter shell, the energy converter shell is provided with an inserting piece and a pipeline connector, the amplitude transformer is connected to the lower end of the energy converter, the tool head is connected below the energy converter, the roller is located between the tool head and a workpiece, and the pneumatic slider is connected with the energy converter shell and the amplitude transformer through the pneumatic slider connection frame. By means of the ultrasonic and micro-forging composite device, the advantages that ultrasonic impact frequency is high and deformation generated by mechanical rolling is large are combined, the composite effect of ultrasonic impact and continuous rolling micro-forging can be achieved, and the purpose of improving the microstructure of the additively manufactured metal and the mechanical performance of parts is achieved. Through organic combination of the ultrasonic and micro-forging composite device and the additive manufacturing method with an existing additive manufacturing technology, the technical bottleneck that structure control is easy while performance control is difficult in existing metal additive manufacturing is solved, and innovation and development of metal rapid forming and manufacturing technologies are induced.
Owner:HARBIN ENG UNIV +1

Method for making ceramic work piece and cermet work piece

Method for making ceramic work piece or cermet work piece is realized by utilizing a multi-layer processing method. Several kinds of materials are mixed to form slurry. Then the slurry is formed into a thin green layer, which will be dried by infrared light, so that the thin green layer will be hardened. Next, the thin green layer exposed under a high-energy beam is sintered to bond together locally due to heat effect at different temperature levels, respectively. After multiple repetitions of this procedure a three-dimensional ceramic part or cermet part can be fabricated layer upon layer. The green portion, which is not scanned by the high-energy beam, can be removed with suitable methods, such as submerged in water or sodium hydroxide water solution, due to disparate characteristics of scanned and unscanned portions. A ceramic part or a cermet part can be rapidly produced in this way.
Owner:NAT TAIPEI UNIV OF TECH

Run to run control process for controlling critical dimensions

It has been discovered that all causes of critical dimension variation, both known and unknown, are compensated by adjusting the time of photoresist etch. Accordingly, a control method employs a control system using photoresist etch time as a manipulated variable in either a feedforward or a feedback control configuration to control critical dimension variation during semiconductor fabrication. By controlling critical dimensions through the adjustment of photoresist etch time, many advantages are achieved including a reduced lot-to-lot variation, an increased yield, and increased speed of the fabricated circuits. In one embodiment these advantages are achieved for polysilicon gate critical dimension control in microprocessor circuits. Polysilicon gate linewidth variability is reduced using a control method using either feedforward and feedback or feedback alone. In some embodiments, feedback control is implemented for controlling critical dimensions using photoresist each time as a manipulated variable. In an alternative embodiment, critical dimensions are controlled using RF power as a manipulated variable. A run-to-run control technique is used to drive the critical dimensions of integrated circuits to a set specification. In a run-to-run control technique a wafer test or measurement is made and a process control recipe is adjusted based on the result of the test or measurement on a run-by-run basis. The run-to-run control technique is applied to drive the critical dimensions of a polysilicon gate structure to a target specification. The run-to-run control technique is applied to drive the critical dimensions in an integrated circuit to a defined specification using photoresist etch time as a manipulated variable.
Owner:LONE STAR SILICON INNOVATIONS LLC
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