4030results about How to "Heat dissipation fast" patented technology

Prior applications disclosed power supply transmission voltage resulting in reduced line losses, with further energy conservation via luminous intensity control (dimming) of lamp(s) including LEDs. Additionally, an invertible, convertable luminaire, and upgraded control module design (comparable to a computer mainframe) comprised of function components including, for example, a microcontroller with programmable CPU, multiple LED driver(s), multiple independent lamp control(s), variable ON time segmentation(s) and variable ramp speed(s), voice actuation (s), security system(s), battery charge component(s), voltage drop (current) limiter(s), protection, ammeter(s), volt and watt meter(s); and voids for optional modules including but not limited to: clock timer(s); photocell(s); motion detector(s) of various function(s); push button(s); programming and function display(s); microphone(s); wireless transmitter(s) / receiver(s); fiber optic interconnection(s); remote control(s); integration to personal computer(s) or other central control system(s); speaker(s); camera(s); irrigation control(s); luminaire mountable laser module(s) and beacon(s); battery array(s); transmission voltage double isolation for nominal 15 volt maximum wet contact.

An optical illuminator using Vertical Cavity Surface Emitting Laser (VCSEL) is disclosed. Optical modules configured using single VCSEL and VCSEL arrays bonded to a thermal submount to conduct heat away from the VCSEL array, are suited for high power and high speed operation. High speed optical modules are configured using single VCSEL or VCSEL arrays connected to a high speed electronic module on a common thermal submount or on a common Printed Circuit Board (PCB) platform including transmission lines. The electronic module provides low inductance current drive and control functions to operate the VCSEL and VCSEL array. VCSEL apertures are designed for a desired beam shape. Additional beam shaping elements are provided for VCSELs or VCSEL arrays, for desired output beam shapes and / or emission patterns. VCSEL arrays may be operated in continuous wave (CW) or pulse operation modes in a programmable fashion using a built-in or an external controller.

A modular light emitting diode is disclosed. The modular light emitting diode comprises a heat-sinking base, a circuit board, a LED light emitting device, and a waterproofing layer. A protrudent portion and a plurality of trenches are formed on the surface of the heat-sinking base. Waterproof connection terminals are mounted on both sides of the circuit board. The LED light emitting device is mounted on and connected to the circuit board so as to form a complete circuit. Thereafter, the circuit board on which the LED light emitting device is mounted is stacked on the heat-sinking base to allow the LED light emitting device to be mounted on the protrudent portion of the heat-sinking base. These three stacked components are locally packaged by a waterproofing layer to complete the modular light emitting diode having the advantages of good waterproofing, rapid heat sinking, and flexible assembly.

A gas separation process uses a structured particulate bed of adsorbent coated shapes / particles laid down in the bed in an ordered manner to simulate a monolith by providing longitudinally extensive gas passages by which the gas mixture to be separated can access the adsorbent material along the length of the particles. The particles can be laid down either directly in the bed or in locally structured packages / bundles which themselves are similarly oriented such that the bed particles behave similarly to a monolith but without at least some disadvantages. The adsorbent particles can be formed with a solid, non-porous core with the adsorbent formed as a thin, adherent coating on the exposed exterior surface. Particles may be formed as cylinders / hollow shapes to provide ready access to the adsorbent. The separation may be operated as a kinetic or equilibrium controlled process.

The present invention provides a system for conducting heat away from an electrical component wherein the system has an elastically deformable member providing thermal communication with an electrical component. The system for conducting heat energy in an electronic assembly includes an electrical component, an elastically deformable member, and a housing. The elastically deformable member is placed in a compressed position between the electrical component and the housing such that the elastically deformable member is fixed into an assembled location. The elastically deformable member conducts heat energy away from the electrical component into the housing where it is dissipated into the environment. Since the compressed position fixes the location of the elastically deformable member, the system does not require a mechanical fastening to the electrical component thereby reducing thermo-mechanical fatigue. The elastically deformable member is made of a metal material allowing it to easily conduct the heat energy.

The present invention relates to an improved heat radiating device for lamp, comprising an exhaust space configured around the periphery of lamp stand, an exhaust fan disposed at the top of exhaust space, and simultaneously a radiator and a plurality of heat conductors at the back of the printed circuit board of a light emitting diode (LED) lamp set where the heat conductors extend to the peripheral inner wall of lamp stand in the exhaust space. Through such a radiating device, high heat generated by the LED lamp set can be dissipated through the radiator and through the plurality of heat conductors to the periphery of lamp stand in the exhaust space, thereby enlarging the heat dissipation area. In addition, through the exhaust fan disposed at the top of the exhaust space, ventilation can take place continuously to let the heat in the exhaust space be vented rapidly, thereby achieving fast heat dissipation and prolonging the service life of LED lamp.

The current methods for reconnecting intestinal tissues, suturing, or metallic staples, can result in a leaky anastomosis that may result in post-operative infections in the patient's abdominal cavity. By utilizing electrical current to bond or weld the intestinal tissue, this potential for leaky anastomosis can be significantly reduced. This invention provides tools and processes that allow electrical tissue bonding to be used on a hollow tissue, such as an intestine. This invention also discloses a means for further reducing the inherent problem of tissue sticking to the electrodes, by introducing a superior electrode design that uses a composite material, copper-molybdenum (CuMo).

A heat dissipation device includes a heat sink (22), a first fan (24) disposed on one part of the heat sink, a second fan (26) disposed on another part of the heat sink and a cover (30) disposed to enclose the heat sink, the first fan and the second fan. The second fan draws the air produced by the first fan and flowing through the heat sink to quickly leave the heat sink.

A vapor-liquid separating type heat pipe device includes a heat sink member mountable on a heat source, tubular outer and inner bodies, a heat transfer fluid, a top vapor passage, and a bottom liquid passage. The outer body has an outer peripheral wall defining an inner chamber. The inner body is disposed in the inner chamber, and has an inner peripheral wall defining thereinside an evaporating space and cooperating with the outer peripheral wall to define a condensing space therebetween. The fluid is introduced into the inner chamber. The vapor passage is provided between and is in fluid communication with the evaporating and condensing spaces. The liquid passage is provided between and is in fluid communication with the condensing space and the heat sink member. The vapor and liquid passages are located proximate to the top and bottom ends of the inner and outer bodies, respectively.

A heat sink module includes a base having a metal heat dissipating fin set, and the base includes a planar base member comprised of a plurality of graphite layers, and said planar base member embeds a vertical insert having a high thermal conductivity, and the insert comprises a graphite compound disposed vertically with the base member for conducting heat or an isotropic thermal conductive metal compound, or a thermal conductive material compound that produces a phase change by heat, and the base member includes a thermal conductive frame having an isotropic high thermal conductivity and disposed at the periphery, and the thermal conductive frame and the base member are combined to form a heat dissipating base. When the heat sink module is in use, the area proximate to the inserts is attached to the core of a heat source core, so that the inserts can absorb and conduct the heat produced by the heat source quickly. Since the graphite layer is anisotropic when conducting heat, therefore the heat is conducted from the periphery to the thermal conductive frame by the horizontal graphite layer when the heat is conducted to the insert, and then the heat is dissipated to the outside via the thermal conductive frame quickly by the heat dissipating fin.

The invention is directed at devices, systems, and processes for managing the temperature of an electrochemical call including a device 10 comprising an inlet for receiving a heat transfer fluid; one or more electrochemical cell compartments 12 for receiving one or more electrochemical calls 20; one or more thermal energy storage material compartments 14 containing one or more thermal energy storage materials 18; and one or more heat transfer fluid compartments 16 for flowing the heat transfer fluid through the device; wherein the space between the one or more heat transfer fluid compartments 16 and the one or more electrochemical cell compartments 12 preferably includes one or more first regions 22 (i.e. portion) that are substantially free of the thermal energy storage material 18; and the space between the one or more heat transfer fluid compartments 16 and the one or more thermal energy storage material compartments 14 preferably includes one or more second regions 24 (i.e. portion) that are substantially free of an electrochemical cell 20; so that the heat transfer fluid compartment 16 is in direct thermal communication with both the thermal energy storage material compartment 14 and the electrochemical cell compartment 12.

A method and apparatus for intrastromal refractive surgery is disclosed wherein tissue at selected locations within the stroma of the cornea is photoablated using a pulsed laser beam. The apparatus includes an optical system for forming a shaped laser beam having a waist at a predetermined distance from the optical system. The pulse duration and pulse energy of the laser beam are selected to cause ablation to occur in front of the waist (i.e. between the waist and the optical system). To achieve this, a pulse energy is used that exceeds the minimum pulse energy required for ablation at the waist. By ablating in front of the waist, a relatively large ablation zone (per pulse) is created (compared to ablation at the waist). Furthermore, while the laser is scanned through the cornea to effectuate a refractive change, the optical system maintains a uniform waist for the laser beam.

The invention relates to the technical field of novel coating preparation and in particular relates to an aqueous coating with high heat-dissipation performance which comprises the following components: 30-60 parts of aqueous resin, 1-10 parts of graphene, 10-30 parts of packing, 10-20 parts of an aid and 30-60 parts of a solvent, wherein the radial size of the graphene is 1-100 microns; and the graphene consists of 1-3 layers. The high heat-dissipation performance aqueous coating provided by the invention is good in heat dissipation effect, environmentally friendly and low in cost.

The invention is directed at devices, systems, and processes for managing the temperature of an electrochemical call including a device (10) comprising an inlet for receiving a heat transfer fluid; one or more electrochemical cell compartments (12) for receiving one or more electrochemical calls (20); one or more thermal energy storage material compartments (14) containing one or more thermal energy storage materials (18); and one or more heat transfer fluid compartments (16) for flowing the heat transfer fluid through the device; wherein the space between the one or more heat transfer fluid compartments (16) and the one or more electrochemical cell compartments (12) preferably includes one or more first regions (22) (i.e. portion) that are substantially free of the thermal energy storage material (18): and the space between the one or more heat transfer fluid compartments (18) and the one or more thermal energy storage material compartments (14) preferably includes one or more second regions (24) (i.e. portion) that are substantially free of an electrochemical cell (20); so that the heat transfer fluid compartment (16) is in direct thermal communication with both the thermal energy storage material compartment (14) and the electrochemical cell compartment (12).

A compact vapor chamber configured to thermally conduct heat of an electronic heat-generating element includes a flat sealed casing; a wick structure arranged on inner walls of the flat sealed casing; a working fluid filled inside the flat sealed casing; and an evaporating section formed on a portion of the vapor chamber. An outer surface of the flat sealed casing on the evaporating section has a recess for covering the electronic heat-generating element. The recess is brought into thermal contact with the electronic heat-generating element. With this arrangement, when the compact vapor chamber is brought into thermal contact the electronic heat-generating element for heat dissipation, the distance of the electronic heat-generating element protruding from the compact vapor chamber is reduced, thereby facilitating the compact design of an electronic product. Further, the present invention provides a heat-dissipating module having such a compact vapor chamber.

According to one embodiment of the present invention, a battery assembly comprises: a battery module comprising a plurality of unit batteries; an exterior case for housing the battery module in an internal space; and a heat-dissipating film which is inserted between the plurality of unit batteries and fitted tightly against each of the plurality of unit batteries, and is attached to the inside surface of the exterior case; and the heat-dissipating film comprises: first and second heat-dissipating layers which are formed of a thermally conductive material and discharge the heat of the unit batteries; and an adhesive layer which is formed between the first and second heat-dissipating layers and adheres the first and second heat-dissipating layers.

A semiconductor integrated circuit package having a leadframe (108) that includes a leadframe pad (103a) disposed under a die (100) and a bonding metal area (101a) that is disposed over at least two adjacent sides of the die. The increase in the bonding metal area (101a) increases the number of interconnections between the metal area (101a) and the die (100) to reduce the electric resistance and inductance. Furthermore, the surface area of the external terminals radiating from the package's plastic body (106) is increased if not maximized so that heat can be dissipated quicker and external terminal resistances reduced. The integrated circuit is applicable for MOSFET devices and the bonding metal area (101a) is used for the source terminal (101). The bonding metal area may have a “L” shape, a “C” shape, a “J” shape, an “I” shape or any combination thereof.

A semiconductor device using a TFT structure with high reliability is realized. As an insulating film used for the TFT, for example, a gate insulating film, a protecting film, an under film, an interlayer insulating film, or the like, a silicon nitride oxide film (SiNXBYOZ) containing boron is formed by a sputtering method. As a result, the internal stress of this film becomes −5×1010 dyn / cm2 to 5×1010 dyn / cm2, preferably −1010 dyn / cm2 to 1010 dyn / cm2, and the film has high thermal conductivity, so that it typically becomes possible to prevent deterioration due to heat generated at the time of an on operation of the TFT.

A heat sink module includes a heat transfer tube, a plurality of radiation fins respectively riveted to locating grooves around the periphery of the heat transfer tube, and a heat transfer panel fastened to the bottom side of the heat transfer tube and the radiation fin set and kept in contact with a heat source, such as a CPU or a light emitting unit of a LED lamp for transferring heat from the heat source to the radiation fins for quick dissipation.

A computer heat dissipating structure of the invention is mounted over a computer main board inside a computer principal unit to dissipate the heat irradiated by at least a principal heat source and a secondary heat source. The computer heat dissipating structure comprises a heat sink that is mounted on the principal heat source, and a fan that is mounted at one lateral side of the heat sink. The fan includes an outer casing that has a lower casing body made of a material having good thermal conduction characteristics. The outer casing further includes an airflow inlet and an airflow outlet that is connected to the heat sink, the lower casing body being placed on the secondary heat source. Via a separate mount of the heat sink and the fan, a lateral blow vis-à-vis the heat sink is thereby achieved to improve the simultaneous heat dissipation of two heat sources.

A thermal interface material and methods for preparing the same are disclosed. The thermal interface material comprises a copper mesh and a slurry. The copper mesh is impregnated and coated with the slurry. The slurry comprises a liquid metal alloy mixed with a plurality of thermal conductive particles. The methods include methods for preparing the thermal interface material, preparing the slurry, preparing the mesh, preparing the device for receiving the material, and for applying the thermal interface to the device.

A LED module includes a heat sink, which is partially oxidized to provide an oxidation layer and has a groove in a top recess thereof, and a plurality of mounting through holes cut through the top and bottom sides, a LED mounted in the groove of the heat sink, metal conduction plates fastened to the mounting through holes and extended to the outside of the heat sink, lead wires respectively connected between the metal conduction plates and positive and negative terminals of the LED, a light transmittance resin molded on the groove over the LED, and a lens holder fastened to the heat sink to hold an optical lens over the light transmittance resin.

A semiconductor device using a TFT structure with high reliability is realized. As an insulating film used for the TFT, for example, a gate insulating film, a protecting film, an under film, an interlayer insulating film, or the like, a silicon nitride oxide film (SiNXBYOz) containing boron is formed by a sputtering method. As a result, the internal stress of this film becomes −5×1010 dyn / cm2 to 5×1010 dyn / cm2, preferably −1010 dyn / cm2 to 1010 dyn / cm2, and the film has high thermal conductivity, so that it typically becomes possible to prevent deterioration due to heat generated at the time of an on operation of the TFT.

The invention relates to a life-cycle water-free cooling solution which is characterized by comprising the following components in percent by weight: 10-50 percent of propylene glycol, 50-80 percent of ethylene glycol, 0.1-10 percent of triazole compounds, 0.5-3.0 percent of sebacic acid, 0.2-1.0 percent of adipic acid, 0.5-1.5 percent of sodium benzoate, 0.3-5 percent of inorganic base, 0.01-0.1 percent of antifoaming agent and 0.01-0.1 percent of colouring agent. The cooling solution has a freezing point of below -50 DEG C and a boiling point of 166-191 DEG C; and because the cooling solution does not contain water, problems of boiling, gas etching, evaporating, scaling, rusting and the like caused by water existing in the cooling solution are thoroughly eliminated, a steam air resistance layer seriously influencing heat radiation is avoided from generating, power of an engine can be effectively improved and fuel is saved. Because the cooling solution does not contain water and has a reasonable corrosion inhibition system, the problem of corrosion is thoroughly solved; and the cooling solution has a service life of reaching up to 8 hundred thousand kilometers, is added once without replacement, is a life-cycle cooling solution, is especially suitable for military vehicles, high-end vehicles and high-power heavy-loading trucks and passenger cars, and can ensure that the vehicles safely run under extremely hot weather, severe cold weather, and severe environments such as desert, plateau, snowfield and the like.

The invention relates to a fabric with a double-sided composite structure interweaved by cooling ice-cold fibers and cotton yarns. The inner layer of the fabric is formed by the ice-cold fibers and has a mesh-like tissue structure; and the outer layer of the fabric has a plain weave tissue structure. Australia AS / NZS 4399:1996 Evaluation and Classification of Ultraviolet Protective Fabric' standard tests show that the ultraviolet protection factor UPF level of the fabric reaches 50 +. A method for manufacturing the fabric comprises the following steps of: weaving, preprocessing, dyeing and scotching forming. The dyeing step comprises cotton dyeing, water washing, dewatering, polyamide fiber dyeing, water washing, color fixing and water washing in sequence. A coolfresh auxiliary agent and an uvioresistant auxiliary agent are added in one bath during dyeing, and the coolfresh auxiliary agent is added again by squeezing when scotching forming. The fabric combines the multiple functions of ice cooling, temperature reduction, coolfresh and uvioresistance into the whole fabric and is an ideal outdoor sportswear fabric.

An LED streetlight with heat-dissipating structure. The LED streetlight includes a light housing composed of an upper cover and a lower cover connected therewith to define an opening, a common rail assembly fixedly attached to an inner face of a bottom of the light housing, and a gas-permeable shade. The common rail assembly includes multiple common rail base seats connected with multiple LED light bulbs and multiple circuit boards. The gas-permeable shade is fitted with the end of the light housing to seal the opening thereof. The heat generated by the LED light bulbs are conducted by the common rail base seats and dissipated to internal space and outer side of the light housing. The heat on outer side of the light housing is carried away by external cold air. The heat in the internal space of the light housing is quickly dissipated through the gas-permeable shade to outer side of the light housing by way of thermal convection.