1086results about How to "Improve light uniformity" patented technology

Light beams emitted from a blue LED light source of a light source unit are condensed by a condenser lens to enter an entrance end face of a rod lens, and the light beams progress through while being repeatedly reflected several times inside the rod lens. Accordingly, the unevenness of brightness is reduced, and the light enters an fluorescent material sheet bonded to an exit end of the rod lens from the exit end as blue light which is uniformed in illuminance, and white light whose color is seen as the same color viewed in any direction of the fluorescent material sheet is emitted from the fluorescent material sheet.

A light guide assembly as a linear light source for enhancing the uniformity of beaming light within the beaming light's effective focal range comprising a light guide bar connected to a light source assembly and a reflective housing encasing the light guide bar. One surface of the light guide bar is a light-scattering / light-emission surface, and other surfaces are all reflective. The emission plane has gradually changing indentations for adjusting the light refractive and reflecting indexes to ensure the light uniformity. The reflective housing covering the light guide bar is used for enhancing the light reflection and intensity. An opening is formed in the reflective housing corresponding to the emission plane of the light guide bar, and a reflecting flange is formed at one side of the opening. Combined with the sloping and notched emission plane, light with high intensity and uniformity can be obtained, and the uniformity of beaming light within the beaming light's effective focal range can also be improved.

The invention discloses a packaging method of an LED filament. The packaging method of the LED filament includes the steps that a liquid silicon resin and fluorescent powder mixture is injected into a mould, and a metal conductive pin is arranged at one end of the silicon resin and fluorescent powder mixture inside the mould; the mould is removed after being heated and solidified, and silicon resin and fluorescent powder colloid with the metal conductive pin at one end is obtained; a plurality of LED chips are installed on the silicon resin and fluorescent powder colloid, and the LED chips are mutually connected through a wire and then connected to the metal conductive pin to form a conductive path; the silicon resin and fluorescent powder colloid with the LED chips is put into the mould, and a liquid silicon resin and fluorescent powder mixture is injected into the mould to cover the LED chips and the wire; the mould is removed after being heated and solidified, and the packaged LED filament finished product with a supporting frame is obtained. The LED filament is packaged without the supporting frame, and the quality problems of low yield, low light transmittance of the supporting frame and the like are resolved.

A semiconductor light emitting device includes a base substrate, lead electrodes provided on the base substrate, at least one semiconductor light emitting element loaded on the base substrate so as to be spaced apart from the lead electrodes and radiating blue light, a connection member for electrically interconnecting the electrodes and the semiconductor light emitting element, a reflector extended from a bottom of the base substrate to a predetermined height for surrounding the semiconductor light emitting element, and a translucent cover layer formed in the receiving space for housing the light emitting element, the translucent cover layer containing a color-shifting substance for absorbing at least a part of blue light radiated from the light emitting element to radiate a light having a different wavelength. The reflector is made of a material having high translucency and high thermal conductivity on a surface thereof so as to reflect the light radiated from the light emitting element and form a uniform planar light, and the reflector radiates the heat radiated from the light emitting element to outside so as to cool an inside of a receiving space for receiving the light emitting element. Thus, the device emits white light outside by combination of the blue light radiated from the light emitting element and the light having a different wavelength.

A light source package module with a wavelength converting structure is provided. The light source package module comprises a frame having a substrate and sidewalls formed on the substrate. A plurality of LED dice is disposed on the substrate, and there is a space between each of the LED dice. A wavelength converting structure is disposed on above the plurality of LED dice and the sidewalls. The light source package can provide a flat light source with a large emitting area can be made in simply as well. Additionally, the present invention further relates to the application of a backlight module.

Concatenatable lighting fixtures, each comprising a unitary cover member having a circuit board mounting platform integrally formed with suitable heat sinking and which mounts onto a cooperating base chassis. In one embodiment, the circuit board mounting platform extends farther from one end of the cover member than the other so as to facilitate placement of LEDs in a fashion which enhances lighting uniformity and minimizes dark spots. In one embodiment, first and second guide members may be positioned in respective opposite ends of adjacent fixtures, each guide member having a plurality of extending fingers with a flexible electrical conductor-carrying conduit disposed between the respective opposite ends and retained in position by the fingers.

A lighting fixture is presented comprising a plurality of modular apparatuses wherein each modular apparatus comprises one or more light sources and one or more light directing or light redirecting devices. Methods of adjusting one or more components of said lighting fixture about one, two, or three axes are presented whereby the lighting needs of a target area—even one of complex shape—may be addressed and in a manner that promotes compact fixture design with low effective projected area (EPA) without sacrificing transmission efficiency of the light sources.

Light emitting LEDs devices comprised of LED chips that emit light at a first wavelength, and a thin film layer over the LED chip that changes the color of the emitted light. For example, a blue LED chip can be used to produce white light. The thin film layer beneficially consists of a fluorescent material, such as a phosphor, and / or includes tin. The thin film layer is beneficially deposited using chemical vapor deposition.

A light emitting sign comprising a light emitting display surface including at least one phosphor, and at least one radiation source configured to irradiate the display surface with excitation energy such that the phosphor emits light of a selected color. The sign further comprises a filter which is substantially transparent to light emitted by the display surface, filtering other colors of light. The display surface may be configured into a shape of a character, a symbol, or a device. Alternatively, a mask having at least one window substantially transparent to the emitted light and / or at least one light blocking region may be provided in which the window and / or light blocking region define a character, a symbol, or a device.

A lighting fixture is presented comprising a plurality of modular apparatuses wherein each modular apparatus comprises one or more light sources and one or more light directing or light redirecting devices. Methods of adjusting one or more components of said lighting fixture about one, two, or three axes are presented whereby the lighting needs of a target area—even one of complex shape—may be addressed and in a manner that promotes compact fixture design with low effective projected area (EPA) without sacrificing transmission efficiency of the light sources.

A light guide module includes a light guide plate and a diffuse reflector. The light guide plate has a light incidence surface, a light exiting surface, and a bottom surface, wherein the light exiting surface is opposite to the bottom surface, and the light incidence surface is connected with the light exiting surface and the bottom surface. The diffuse reflector is secured to the bottom surface of the light guide plate by an adhesive pattern layer, wherein the adhesive pattern layer is formed by a plurality of light-transmissive adhesive gels, and these light-transmissive adhesive gels do not contain any diffusive particles. A backlight module using the light guide module mentioned above and a fabricating method for the light guide module are also provided.

An illumination apparatus is disclosed and includes a light-guiding module and a light source module. The light-guiding module has a light-in surface, which is annular surface inside the light-guiding module. The light source module includes a plurality of light-emitting devices. Each light-emitting device is disposed toward the light-in surface and can emit light through the light-in surface into the light-guiding module. The light-guiding module can be a light-guiding plate with a through hole, a sidewall of which is treated as the light-in surface. The light source module can use an annular circuit board disposed in the through hole. The light-emitting devices are disposed on an outer annular surface of the annular circuit board toward the sidewall. Thereby, the invention can provide illumination of radially guiding light.

A bendable LED planar light source structure, a flexible substrate therefore, and a manufacturing method thereof are provided. The flexible substrate has metal layers on both sides, where the metal layer on one side has a circuit layout, and the metal layer on the other side has a pattern structure or a whole metal coating with reflecting and scattering characteristics. Meanwhile, bonding pads are provided on the same side or opposite side as the metal layer with the circuit layout, and an array of LED dies is bonded with the bonding pads through wire bonding or flip chip bonding, such that the LED dies are conducted with current through the circuit layout on the flexible substrate, so as to form a planar light source.

A bendable LED planar light source structure, a flexible substrate therefore, and a manufacturing method thereof are provided. The flexible substrate has metal layers on both sides, where the metal layer on one side has a circuit layout, and the metal layer on the other side has a pattern structure or a whole metal coating with reflecting and scattering characteristics. Meanwhile, bonding pads are provided on the same side or opposite side as the metal layer with the circuit layout, and an array of LED dies is bonded with the bonding pads through wire bonding or flip chip bonding, such that the LED dies are conducted with current through the circuit layout on the flexible substrate, so as to form a planar light source.