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178results about How to "Increase reflective area" patented technology

Backlight apparatus

A backlight apparatus includes a guiding element and a light source disposed at one side of the guiding element. There is a plurality of reflective patterns at the bottom surface of the guiding element. Each reflective pattern is composed of at least one concavity and at least one convexity. The concavity is disposed at the rim around the convexity. As the light source emits light to the guiding element, the reflective area is increased by the concavity of the reflective pattern for increasing the reflecting effect and for distributing the brightness more uniformly, and thereby higher brightness and uniformity can be achieved.
Owner:NANO PRECISION TAIWAN LTD

Backlight apparatus

A backlight apparatus includes a guiding element and a light source disposed at one side of the guiding element. There is a plurality of reflective patterns at the bottom surface of the guiding element. Each reflective pattern is composed of at least one concavity and at least one convexity. The concavity is disposed at the rim around the convexity. As the light source emits light to the guiding element, the reflective area is increased by the concavity of the reflective pattern for increasing the reflecting effect and for distributing the brightness more uniformly, and thereby higher brightness and uniformity can be achieved.
Owner:NANO PRECISION TAIWAN LTD

Display apparatus

The present invention relates to a display apparatus comprising front display unit (10) and rear display unit (50), wherein the front display unit (10) and the rear display unit (50) are arranged such that an image on the rear display unit (50) is visible through a portion of the front display unit (10). The front display unit (10) comprise: a display panel (20); a front backlight (30) which is arranged behind the display panel (20), and which includes a first light guide plate (36) having a projection window (16) through which an image on the rear display unit (50) is visible, first light sources (38) arranged along the circumference of the first light guide plate (36), and a reflection sheet (39) arranged at the rear surface of the first light guide plate (36) to reflect light and having an image hole (18) formed at the region thereof that corresponds to the projection window (16); a rear backlight (40) arranged behind the front backlight (30) and including a second light guide plate (42) corresponding to the projection window (16) and second light sources (44) arranged along the circumference of the second light guide plate (42); and a rear optical shutter (48) arranged behind the second light guide plate (24). The rear optical shutter (48) is made of a transparent material, such that the rear display unit and the front display unit cooperate with one another to display a combined image. The entire screen of the front display unit is capable of displaying an image, without any disconnection of the image, when the rear optical shutter is closed.
Owner:KORTEK CORP

Light emitting diode, method for manufacturing the same, and light emitting device module having the same

ActiveUS20180145224A1Good current spreading performanceImprove performanceVehicle headlampsSolid-state devicesPhysicsReflectivity
A light emitting diode having improved light efficiency and enhanced reflectivity of a device by forming an insulating reflective part on a reflective electrode formed on the upper surface of a mesa. A mesa exposing part is formed on the outer periphery and / or in the interior region of the reflective electrode to expose a predetermined area of the upper surface of the mesa such that reflection at the mesa exposing part is performed by the insulating reflective part.
Owner:SEOUL VIOSYS CO LTD

Method for producing advanced triple-wire double-calcination pure cotton fabrics

The invention provides a method for producing advanced triple-wire double-calcination pure cotton fabrics, comprising the working procedures of yarn dyeing, weaving, fabrics singeing, desizing, alkali mercerization, tenter setting and preshrinking. The method is characterized in that before being dyed, grey yarns are mercerized and singed, and a liquid ammonia working procedure is added between alkali mercerization and tenter setting, thereby forming the whole processing steps sequentially including yarn mercerization, yarn singeing, yarn dyeing, weaving, fabrics singeing, desizing, alkali mercerization, liquid ammonia, tentering and preshrinking. Compared with the traditional mercerized pure cotton fabrics, the triple-mercerization pure cotton fabrics obtained by the method have the advantages of higher lustre and high tinctorial yieldof yarns, fresher color of fabrics, good moisture absorption and ventilation, soft handle and high resilience, and the triple-wire double-calcination pure cotton fabrics are softer after being washed and maintain other excellent performances thereof.
Owner:LUTAI TEXTILE

Flip LED (light-emitting diode) chip with high luminous efficiency and good heat radiating performance and preparation method thereof

The invention provides a flip LED (light-emitting diode) chip with high luminous efficiency and good heat radiating performance and a preparation method thereof. The LED chip comprises an epitaxial substrate, wherein an N type epitaxial layer, a light-emitting layer and a P type epitaxial layer are sequentially laminated on the upper surface of the epitaxial substrate; a concave hole is formed in the P type epitaxial layer, downwards penetrates through the light-emitting layer and extends to the N type epitaxial layer; a P contact metal layer, a P baffle protecting layer and a P surface electrode layer are sequentially laminated on the upper surface of the P type epitaxial layer; the lower surface of the P baffle protecting layer and the upper surface of the P contact metal layer are overlapped; an N contact metal layer and an N surface electrode layer are sequentially laminated on the upper surface of the N type epitaxial layer corresponding to the bottom of the concave hole; a clearance is reserved between the N contact metal layer and the edge of the concave hole; an insulating layer is arranged on the wall surface of the clearance. The flip LED chip provided by the invention has high heat-conducting property and conductivity, and improvement of the luminous efficiency of the LED chip is facilitated by the structure.
Owner:APT ELECTRONICS

Illuminator and method for producing such illuminator

The present invention relates to an illuminator (10) comprising a substrate (12), a structured conductive layer (16) applied to one surface of the substrate, and at least one light source (18, 26) connected to the structured conductive layer. The illuminator is characterized in that it further comprises an unstructured reflective layer (24) applied on top of said structured conductive layer, which unstructured reflective layer has an essentially continuous extension at least in a surrounding of the at least one light source. Due to the unstructured reflective layer, the optical efficiency of the illuminator can be improved. The invention also relates to a method for producing such illuminator.
Owner:LUMILEDS HLDG BV

Inverted LED chip with high light emitting efficiency and LED device and manufacturing method of inverted LED chip with high light emitting efficiency

The invention provides an inverted LED chip, a manufacturing method of the inverted LED chip and an LED device comprising the inverted LED chip. A first concave hole is formed in a P-type epitaxial layer of the inverted LED chip; a P-type contact metal layer is overlapped to the upper surface of the P-type epitaxial layer; a P-type blocking protective layer is overlapped to the upper surface of a first overlapping structure, and the coverage area of the lower surface of the P-type blocking protective layer is coincident with the area of the upper surface of the P-type epitaxial layer; an insulating layer is arranged on the exposed surface of a second overlapping structure, a first through hole is formed in the part, corresponding to the position of the bottom of the first concave hole, of the insulating layer of the second overlapping structure, and a second through hole is formed in the part, corresponding to the upper surface of the P-type blocking protective layer, of the insulating layer of the second overlapping structure; an N-type surface electrode is electrically connected with an N-type epitaxial layer through the first through hole, and a P-type surface electrode is electrically connected with the P-type blocking protective layer through the second through hole. By means of the inverted LED chip, the heat conduction capacity and the electric conduction capacity are good, and the light emitting efficiency is easily improved.
Owner:APT ELECTRONICS

LED (Light Emitting Diode) light source, manufacturing method thereof and backlight module

The invention provides an LED (Light Emitting Diode) light source, a manufacturing method thereof and a backlight module. The LED light source comprises a substrate, an LED chip, fluorescent glue and a white-light reflecting layer, wherein the LED chip is coated and packaged on the substrate by the fluorescent glue; the white-light reflecting layer is used for reflecting light outgoing from the fluorescent glue to the white-light reflecting layer; and the forward projection of the fluorescent glue on the substrate is positioned in the forward projection of the white-light reflecting layer on the substrate. Based on the design, the light-color consistency of light emitted from the four surfaces can be improved, the incoming Bin rate of the LED can be improved and the backlight cost can be reduced.
Owner:TCL CHINA STAR OPTOELECTRONICS TECH CO LTD

Bird repelling device

The invention provides a bird repelling device, and belongs to the technical field of bird repelling devices for electricity power. The device comprises a bottom plate, a self-rotating device, a reflecting body, a control system and a bird repelling mechanism; the self-rotating device comprises a rotary shaft, a shaft sleeve and multiple wind bowls; the reflecting body is of an umbrella-shaped structure enclosed by multiple arc blades; the reflecting body is connected with the rotary shaft; the control system comprises a photovoltaic assembly, a controller, a storage battery and an infrared sensor; the output end of the photovoltaic assembly is connected with the storage battery through a charge discharge module; the output end of the charge discharge module is connected with the input endof the controller, and the output end of the infrared sensor is connected with the input end of controller; the bird repelling device comprises an acousto-optic alarming device, a sound generating plate and a smell dispersing assembly. According to the bird repelling device, three manners of optical reflection, noise and flash light can be utilized by the device to repel birds, the nest buildingand activities in the periphery of a power transmission pole of the birds can be effectively avoided to reduce problems of short circuit, grounding fault and the like caused by the activities of the birds are reduced, and the safety running of power transmission wires is ensured.
Owner:SHIJIAZHUANG JINNENG ELECTRIC EQUIP CO LTD

Improved electrochromic device

The invention relates to an improved electrochromic device. The improved electrochromic device is characterized in that the edge of the substrate bonds a metal electrode used for connecting a transparent conductive layer or conductive reflecting layer in the electrochromic device with positive and negative anodes of an external power source, and can be applied to intelligent allochroic mirrors, allochroic windows and other fields. The improved electrochromic device has the advantages that the reflecting area or transmission area of the electrochromic device can be enlarged, the use of insoluble particles in seal gum can be reduced or omitted, and the influence of the insoluble particles on the properties of the electrochromic device is reduced.
Owner:NINGBO MI RUO ELECTRONICS TECH CO LTD

Manufacturing method for LED chip

The invention provides a manufacturing method for an LED chip by utilizing the laser scribing technology, the etching technology and the reflective layer back-plating technology. Two times of laser light are adopted for deflecting back scribing, so that scribing width and scribing depth are increased, and a U-shaped gap is formed; due to etching, scraps caused by laser scribing can be removed, and the surface of the U-shaped gap is more flat; a locally tilted side face is formed on a sapphire substrate through the U-shaped gap, after the side face and the obverse side of the substrate form a high-reflectance layer, rays emitted from a light-emitting layer can be reflected upward to a greater degree, and therefore the light-emitting efficiency of the LED chip is enhanced.
Owner:ANHUI SANAN OPTOELECTRONICS CO LTD

Police helmet with intelligent temperature sensing and adjusting functions

The invention provides a police helmet with intelligent temperature sensing and adjusting functions, belongs to the technical field of helmets, and aims to solve the problem of low on-duty efficiency caused by inconvenience in use of existing police helmets. The police helmet comprises a helmet shell and a fastening strip structure which is mounted on the helmet shell and used for being fastened on the neck. The police helmet is characterized in that an intelligent luminance sensing and adjusting device is mounted on the helmet shell and comprises an intelligent processor, a photosensitive sensor and a lamp set with lighting lamps; the photosensitive sensor and the lamp set are connected with the intelligent processor and mounted at the front end of the helmet shell; the photosensitive sensor can detect light ray intensity at the front end of the helmet body in real time and transmit converted voltage signals to the intelligent processor; the intelligent processor controls on or off of the lighting lamps according to the received voltage signals. The police helmet has the advantage of improving on-duty efficiency.
Owner:浙江帅孚安全科技有限公司

High power LED (light-emitting diode) daylight lamp and heat rejection method

The invention relates to a high power LED (light-emitting diode) daylight lamp and a heat rejection method. The daylight lamp comprises a light source and a lamp shell, wherein the light source is produced in a way that a plurality of LED chips are directly arranged on the frontage of a circuit baseplate in a crystal fixing manner, and a copper foil is covered on the whole back of the circuit baseplate; the frontal copper foil is divided into a plurality of crystal fixing regions and current channels, the current channels are connected with the LED chips of the crystal fixing regions by gold threads, and the crystal fixing regions are provided with heat conduction holes; and the lamp shell is of a rod shape, the section of the lamp shell is composed of a semicircular aluminum pipe, a transparent cover and two end covers, the light source is arranged outside the aluminum pipe, and the back copper foil of the circuit baseplate is closely contacted with the bottom wall of the aluminum pipe. The production of the high power LED daylight lamp is simple, the light effect is high, a thermal resistor interface is less, and the heat rejection effect is good.
Owner:XIZHUO ELECTRONICS TECH SHANGHAI

Reflection type display device and method for producing the same

A reflection-type display device 200 includes: an active switch layer 201s including a plurality of switching elements 201t; a plurality of pixel electrodes 207 each connected to a corresponding one of the plurality of switching elements 201t; a reflective layer 205 formed between the active switch layer 201s and the plurality of pixel electrodes 207; and a modulation layer 213 provided at a side of the pixel electrodes 207 facing a viewer, the modulation layer 213 being capable of switching between a first state and a second state of respectively different optical characteristics. The reflective layer 205 is connected to neither the plurality of switching elements 201t nor the plurality of pixel electrodes 207.
Owner:SHARP KK

Heat-dissipation type LED (Light Emitting Diode) lamp

The invention relates to the field of lamps and discloses a heat-dissipation type LED (Light Emitting Diode) lamp. The heat-dissipation type LED lamp comprises a lamp body, a lamp cap, a lamp holder and a lamp shade, wherein the lamp body is connected to the lamp cap; the lamp cap is in threaded connection with the lamp holder; the lamp shade covers the lamp body; foldable memory metal is connected between the lamp holder and the lamp shade; a plurality of holes are formed in the foldable memory metal; a first elastic sleeve is connected onto the lamp holder in a sliding manner; a second elastic sleeve sleeves the first elastic sleeve in the sliding manner; the second elastic sleeve is connected to the lamp shade; an expansion block is arranged between the second elastic sleeve and the lamp shade; a spring is connected between the first elastic sleeve and the memory metal; a first through hole is formed in the first elastic sleeve; a second through hole is formed in the second elastic sleeve; the first through hole and the second through hole are formed in a staggered manner; the first elastic sleeve is positioned on the outer side of the memory metal; the lamp shade is a transparent heating expansion body. Compared with the prior art, the heat-dissipation type LED lamp has the advantages of better heat dissipation effect, better illumination brightness, low production cost and long service life; the heat-dissipation type LED lamp can be popularized and used.
Owner:广东蓝云照明工程有限公司

Light emitting component

A light emitting component includes an epitaxial structure, an adhesive layer, a first reflective layer, a second reflective layer, a block layer, a first electrode and a second electrode. The epitaxial structure includes a substrate, a first semiconductor layer, a light emitting layer and a second semiconductor layer. The adhesive layer is disposed on the second semiconductor layer of the epitaxial structure. The first reflective layer is disposed on the adhesive layer. The second reflective layer is disposed on the first reflective layer and extended onto the adhesive layer. A projection area of the second reflective layer is larger than a projection area of the first reflective layer. The block layer is disposed on the second reflective layer. The first electrode is electrically connected to the first semiconductor layer. The second electrode is electrically connected to the second semiconductor layer.
Owner:GENESIS PHOTONICS

Light emitting diode structure

A light emitting diode structure including a substrate, a semiconductor epitaxial layer and a reflective conductive structure layer is provided. The semiconductor epitaxial layer is disposed on the substrate and exposes a portion of the substrate. The reflective conductive structure layer covers a part of the semiconductor epitaxial layer and the portion of the substrate exposed by the semiconductor epitaxial layer.
Owner:GENESIS PHOTONICS

Backlight plate device

The present invention relates to a backlight plate device. It includes a frame body with recessed groove, a lamp source group, a diffusion plate and at least an elastic element, in which inner wall surface of the recessed groove is equipped with reflecting layer, and the lamp source group is formed from several cold-cathode fluorescence lamps which are arranged in the recessed groove, one end of the elastic element is fixed in the bottom surface of the recessed groove, and its another end is placed against the diffusion plate. It utilizes the elastic element to absorb partial diffusion plate deformation energy to reduce its deformation, said elastic element also has buffer effect so as to make the diffusion plate have optimum planeness, so that it can provide hight luminance and luminance uniformly-distributed light source for liquid crystal panel.
Owner:CORETRONIC

Photoacoustic and ultrasonic dual-mode endoscopic imaging device and method based on light reflection

The invention relates to a photoacoustic and ultrasonic bimodal endoscopic imaging device and method based on light reflection, wherein the device comprises a probe housing provided with a transmitting and receiving surface; at least one group of a light transmitting module and a light reflecting module disposed outside the probe housing, with the light transmitting module being arranged on the transmitting and receiving surface, the light reflecting module reflecting the light beam to the light transmitting module, and the light transmitting module shaping the light beam and sending the lightbeam to the outside; and an ultrasonic phased array transmitting and receiving module located in the probe housing and one side is arranged on the transmitting and receiving surface for transmittingultrasonic signals and receiving ultrasonic signals and photoacoustic signals. Compared with the prior art, the device and method achieve simultaneous detection of photoacoustic and ultrasonic signalsby combining a laser module and a multi-channel ultrasonic probe, and simultaneously obtains ultrasonic and photoacoustic information of the same scanning plane by adopting the same probe device fordetection.
Owner:TONGJI UNIV

Reflective film capable of improving photovoltaic conversion efficiency and preparation method thereof

The invention relates to the technical field of reflective films and in particular to a reflective film capable of improving photovoltaic conversion efficiency and a preparation method thereof. The reflective film comprises a base material layer, an adhesive layer disposed under the substrate layer, a microstructure layer disposed above the substrate layer, a reflective layer disposed above the microstructure layer, wherein the microstructure layer consists of a plurality of triangular prisms which are successively arranged in parallel. The reflective film capable of improving the photovoltaicconversion efficiency can reduce the light reflected outside the photovoltaic glass and improve the solar energy utilization rate.
Owner:CHANGZHOU HUAWEI ADVANCED MATERIAL

Light guide plate and manufacture method thereof

A manufacture method of a light guide plate comprises the following steps of providing a substrate; forming first order dots, wherein the first order dots are formed by utilizing different positions of a laser on the substrate; forming at least one second order dot so as to form a mold insert, wherein the second order dots are formed in the first order dots by utilizing the laser, and the radius of each second order dot is smaller than that of each first order dot; and utilizing the mold insert to form the light guide plate, wherein the power of the laser forming the second order dots is 55%-85% of the power of the laser forming the first order dots. The dots can be manufactured to be two-order or multiple-order dots, depend on a processing power range of the laser, and the range is larger, the more formed dot orders are. The light guide plate manufactured by means of the manufacture method has high outgoing light brightness and good outgoing light uniformity.
Owner:YANGXIN TECH SUZHOU

Composite salivate method light reflection sheet and manufacturing method thereof

The invention discloses a composite salivate method light reflection sheet. The sheet is characterized in that the sheet is manufactured by sequentially extruding and shaping three layers such as an anti-ultraviolet antistatic mixed upper layer, a bulb-in-bulb layer and an anti-ultraviolet antistatic mixed lower layer; the bulb-in-bulb layer is formed by mixing 30 weight parts of components A, and 60-80 weight parts of components B; the anti-ultraviolet antistatic mixed upper layer and the anti-ultraviolet antistatic mixed lower layer are both formed by components C; the components A are formed by mixing 3-48 weight parts of inorganic particles and 5-50 weight parts of resin A; the components B are formed by mixing 50-70 weight parts of resin B and 1-20 weight parts of compatilizers; the components C are formed by mixing 1-5 weight parts of components D and 95-99 weight parts resin B; and the components D are formed by mixing organic ultraviolet absorbents and antistatic agents. The sheet can be processed into light reflection board components in devices for LED (light emitting diode) illumination, common daylight illumination, and advertisement display board light boxes by means of cutting, folding, plastic adsorption or punching forming.
Owner:四川东方绝缘材料股份有限公司

Packaging method for light source used in LED fluorescent lamp and light source

The invention provides a packaging method for a light source used in an LED fluorescent lamp. The light source uses a two-sided copper-clad plate as a substrate, and copper foil on a front side of the substrate is divided into a plurality of solid crystal areas and current channels. Gold wire welding zones are disposed closed to the solid crystal areas on the current channels. The solid crystal areas are provided with thermal vias throughout the substrate to conduct heat of the solid crystal areas to the copper foil on a back side of the substrate. The packaging method comprises: first, coating solid crystal glue on the solid crystal areas, placing LED chips on the solid crystal glue of the solid crystal areas and pressing the LED chips; then, welding gold wires; and at last, packaging hemispheric fluorescent sillca gel on the LED chips and the gold wires. The invention also discloses a light source used in a high power LED fluorescent lamp manufactured by the above packaging method. The light source manufactured by the above packaging method is characterized by little thermal resistance interface, high heat dissipation efficiency, etc.
Owner:XIZHUO ELECTRONICS TECH SHANGHAI

Monolayer two-way stretch light reflection polypropylene film and manufacturing method thereof

The invention discloses a monolayer two-way stretch light reflection polypropylene film, which is characterized by being manufactured by mixing, extruding, two-way stretching and forming of 30 parts of first component, 60-80 parts of second component and 1-5 parts of third component by mass, wherein the first component comprises 3-48 parts of inorganic particle and 5-50 parts of A resin by mass which are mixed; the second component comprises 50-70 parts of polypropylene resin and 1-20 parts of compatilizer by mass which are mixed; and the third component comprises 0.05-1 part of organic ultraviolet absorbent and 0.5-5 parts of antistat by mass which are mixed. The monolayer two-way stretch light reflection polypropylene film is manufactured by the steps of extruding by an extruder at first, longitudinally stretching, horizontally stretching, thermoforming and forming in a drying tunnel, and can be used for manufacturing light reflection film members with flexibility requirements.
Owner:四川东方绝缘材料股份有限公司

Reflection type display device and method with pixel electrodes having predetermined dimensions and relationships to each other as to gap width therebetween on both short and long sides and pitch of cubic corner cubes

A reflection-type display device 200 includes: an active switch layer 201s including a plurality of switching elements 201t; a plurality of pixel electrodes 207 each connected to a corresponding one of the plurality of switching elements 201t; a reflective layer 205 formed between the active switch layer 201s and the plurality of pixel electrodes 207; and a modulation layer 213 provided at a side of the pixel electrodes 207 facing a viewer, the modulation layer 213 being capable of switching between a first state and a second state of respectively different optical characteristics. The reflective layer 205 is connected to neither the plurality of switching elements 201t nor the plurality of pixel electrodes 207.
Owner:SHARP KK

High-power LED chip and manufacturing method thereof

The invention provides a high-power LED chip and a manufacturing method thereof. The high-power LED chip comprises an epitaxial layer, an ITO layer, a first reflection layer, a barrier layer, a passivation layer, a second reflection layer, a bonding layer, a Si substrate layer, a protection layer, a P electrode and an N electrode. Round holes are formed in the epitaxial layer, the inner side wallsof the round holes are covered with a contact layer, and the surface of the contact layer and the surface of the passivation layer are evaporated with the second reflection layer, so that the reflection area of light in the high-power LED chip is increased, and the lighting effect and the photoelectric reliability of the chip are improved. According to the manufacturing method provided by the invention, through the method of forming the uniform groove array on the edge of the barrier layer and then plating the passivation layer and the second reflection layer in sequence, light absorption ofthe metal of the barrier layer can be reduced; the reflection effect is improved through the second reflection layer; and meanwhile, the uniform groove array is arranged to facilitate uniform conduction of current and improve the luminous efficiency on the premise of ensuring the stability of a device.
Owner:HGC (WUHAN) TECH CO LTD

Light emitting diode structure

The invention provides a light emitting diode structure. The light emitting diode structure comprises a substrate, a semiconductor epitaxial layer and a reflection conducting structure layer. The semiconductor epitaxial layer is configured on the substrate and exposes a part of the substrate. The reflection conducting structure covers a part of the semiconductor epitaxial layer and the portion, which is exposed by of the semiconductor epitaxial layer, of the substrate.
Owner:GENESIS PHOTONICS

Light emitting diode having full mirror surface structure and manufacturing method therefor

The invention provides a light emitting diode having a full mirror surface structure and a manufacturing method therefor. A DBR layer which is epitaxially grown in advance is used, the DBR layer corresponding to an Ohmic contact layer is reserved via chip technologies, an Ohmic contact electrode zone is enabled to have Ohmic contact effects and reflecting layer effects, the Ohmic contact electrode zone and an ODR mirror surface system can jointly form a full mirror surface structure, and no reflecting mirror surface area loss can be caused. Specifically, the light emitting diode having the full mirror surface structure comprises a light emitting epitaxial layer and a mirror surface system positioned below the light emitting epitaxial layer, the mirror surface system comprises a metal reflecting layer and a light transmitting layer positioned above the metal reflecting layer, the light transmitting layer comprises a light transmitting zone and a Ohmic contact zone, the light transmitting zone is made of light transmitting dielectric material, the light transmitting layer and the metal reflecting layer form an ODR reflecting mirror, the Ohmic contact zone orderly comprises the Ohmic contact layer and the DBR layer in a from bottom to top manner, the DBR layer is formed by at least alternately stacking first semiconductor layers and second semiconductor layers, and therefore an uninterrupted reflecting mirror surface system can be formed.
Owner:TIANJIN SANAN OPTOELECTRONICS

Reflective display screen and preparation method thereof and display device

The invention discloses a reflective display screen and a preparation method thereof and a display device. In order to solve the technical problems that in the prior art, a reflective display device is low in reflectivity, the reflective display screen comprises an array substrate, an opposite substrate and a liquid crystal layer, wherein the array substrate is opposite to the opposite substrate,and the liquid crystal layer is located between the array substrate and the opposite substrate; a display surface is arranged on one side of the array substrate; a transparent pixel electrode layer isarranged on the side, facing the liquid crystal layer, of the array substrate; a reflective common electrode layer is arranged on the side, facing the liquid crystal layer, of the opposite substrate.
Owner:BOE TECH GRP CO LTD +1
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