Packaging method for light source used in LED fluorescent lamp and light source

Abstract

The invention provides a packaging method for a light source used in an LED fluorescent lamp. The light source uses a two-sided copper-clad plate as a substrate, and copper foil on a front side of the substrate is divided into a plurality of solid crystal areas and current channels. Gold wire welding zones are disposed closed to the solid crystal areas on the current channels. The solid crystal areas are provided with thermal vias throughout the substrate to conduct heat of the solid crystal areas to the copper foil on a back side of the substrate. The packaging method comprises: first, coating solid crystal glue on the solid crystal areas, placing LED chips on the solid crystal glue of the solid crystal areas and pressing the LED chips; then, welding gold wires; and at last, packaging hemispheric fluorescent sillca gel on the LED chips and the gold wires. The invention also discloses a light source used in a high power LED fluorescent lamp manufactured by the above packaging method. The light source manufactured by the above packaging method is characterized by little thermal resistance interface, high heat dissipation efficiency, etc.

Description

technical field [0001] The invention relates to an LED fluorescent lamp for illumination, in particular to a packaging method of a light source for the LED fluorescent lamp and a light source manufactured by the packaging method. Background technique [0002] Traditional fluorescent lamps commonly used in indoor lighting have the disadvantages of short life, high energy consumption, mercury pollution, and flickering. Therefore, people have developed LED fluorescent lamps for solid-state lighting. The existing high-power LED fluorescent lamps have serious heat dissipation problems. , light field, and light attenuation have not been truly resolved. Especially high-power LED fluorescent lamps that use urea board or fiberboard as the circuit board are more serious. High-power LED fluorescent lamps on the market use the following two light sources: 1. The LED plug-in of single-particle bead-shaped packaging is inserted into the urea board or fiberboard. The circuit board is used...

AI Technical Summary

Problems solved by technology

Regardless of one or two, the packaged LEDs are installed on the circuit board, and there are multiple layers of thermal resistance interfaces for heat conduction and heat dissipation, resulting in poor heat dissipation

At present, the design scheme of using double-sided copper foil urea or fiberboard or semi-fiberboard as the bracket and circuit substrate for LED die-bonding, and directly packaging it into a light source for high-power LED fluorescent lamps has not been disclosed in relevant literature.

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