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1145 results about "Light attenuation" patented technology

Multiple-wavelength spectroscopic quantitation of light-absorbing species in scattering media

An oxygen concentration measurement system for blood hemoglobin comprises a multiple-wavelength low-coherence optical light source that is coupled by single mode fibers through a splitter and combiner and focused on both a target tissue sample and a reference mirror. Reflections from both the reference mirror and from the depths of the target tissue sample are carried back and mixed to produce interference fringes in the splitter and combiner. The reference mirror is set such that the distance traversed in the reference path is the same as the distance traversed into and back from the target tissue sample at some depth in the sample that will provide light attenuation information that is dependent on the oxygen in blood hemoglobin in the target tissue sample. Two wavelengths of light are used to obtain concentrations. The method can be used to measure total hemoglobin concentration [Hb.sub.deoxy +Hb.sub.oxy ] or total blood volume in tissue and in conjunction with oxygen saturation measurements from pulse oximetry can be used to absolutely quantify oxyhemoglobin [HbO.sub.2 ] in tissue. The apparatus and method provide a general means for absolute quantitation of an absorber dispersed in a highly scattering medium.
Owner:LAWRENCE LIVERMORE NAT SECURITY LLC

Second, third and fourth near-infrared spectral windows for deep optical imaging of tissue with less scattering

Light at wavelengths in the near-infrared (NIR) region in the second NIR spectral window from 1,100 nm to 1,350 nm and a new spectral window from 1,600 nm to 1,870 nm, known as the third NIR optical window, and fourth at 2200 cm−1 are disclosed. Optical attenuation from thin tissue slices of normal and malignant breast and prostate tissue, and pig brain were measured in the spectral range from 400 nm to 2,500 nm. Optical images of chicken tissue overlying three black wires were also obtained using the second and third spectral windows. Due to a reduction in scattering and minimal absorption, longer attenuation and clearer images can be seen in the second, third and fourth NIR windows compared to the conventional first NIR window. The second and third spectral windows will have uses in microscope imaging arteries, bones, breast, cells, cracks, teeth, and blood due to less scattering of light.
Owner:ALFANO ROBERT R

Exposure apparatus, microdevice, photomask, method of exposure, and method of production of device

A stitching type exposure apparatus for successively exposing an image of a pattern of a reticle (Ri) on different areas of a surface of a substrate (4) while overlaying parts of the same, wherein a density filter (Fj) having a light attenuating part for reducing the amount of light of overlaid parts of the image of the pattern in a sloping manner is provided in the vicinity of the reticle (Ri), the density filter (Fj) is held at a filter stage (FS) for adjusting the posture, the posture of the density filter (Fj) is detected by an illumination uniformity sensor (126) on the substrate stage (6), and the posture of the density filter (Fj) is matched with the posture of the reticle (Ri) by the filter stage (FS).
Owner:NIKON CORP

LED (Light Emitting Diode) lamp filament and manufacturing method thereof

The invention provides an LED (Light Emitting Diode) lamp filament and a manufacturing method thereof. An LED chip is encapsulated on the edge top surface of a thin and long sheet metal support of the LED filament innovatively, meanwhile the sheet metal is inserted into a preformed transparent plastic model frame to produce a light source, and accordingly the automated continuous production of the LED lamp filament is implemented and the problem of the facing direction strength caused by the too thin and too long metal support is solved due to the transparent plastic model frame; meanwhile the lateral direction strength of the metal support is effectively utilized and accordingly the integral mechanical strength of the LED lamp filament is ensured; the heat dissipation characteristics of the metal is directly utilized, meanwhile the heat dissipation efficiency of the LED chip is maximized through the innovative encapsulation of thermal conductive coatings, and accordingly the problem of a heat dissipation bottleneck of the LED lamp filament is effectively solved, the LED lamp filament can work at the rated power for a long time, and the cost is reduced; the LED light extraction efficiency is improved, the light attenuation is reduced, the high lighting effect and ambient light of lamp filament light emission is implemented, and the market vacancy of the existing LED lamp filament is filled through innovative fluorescence encapsulation materials.
Owner:DONGGUAN RIWEI ELECTRONICS

Selective light attenuation system

A system for selectively attenuating light from a source of light, such as the sun, to a person's eyes in a vehicle. The system includes an electro-optical element (10) interposed between the source of light (16) and the person's eyes (14). The element (10) has pixels (18) that are operable to individually attenuate (38) light passing therethrough. A navigation system (28) determines a location and direction of travel of the vehicle. A memory (24) contains a general location for the person's eyes within the vehicle. Information (32) is made available for determining a position of the source of light. A controller (24) operates to determine those pixels of the elements that are calculated (38) to be between the person's eyes and the source of light, and to reduce the light transmittivity of those pixels (38) to attenuate the light from the source (16) to the person's eyes (14).
Owner:CONTINENTAL AUTOMOTIVE SYST INC

Light attenuation in defective pixel in organic EL panel

ActiveUS20030222861A1Increase in the resistance of the organic layersElectroluminescent light sourcesSolid-state devicesOrganic layerLaser light
An organic EL element of one pixel is selectively irradiated with laser light. With the laser irradiation, the functionality of the organic layer of the organic EL element is selectively degraded and the light emission capability is removed without damaging the cathode.
Owner:SANYO ELECTRIC CO LTD

Solar cell with composite dielectric passivation layer structure and preparation process thereof

The invention discloses a solar cell with a composite dielectric passivation layer structure and a preparation process thereof. A silicon oxide film, an alumina film and a silicon nitride or silicon oxynitride film are deposited in turn on the front, back and sides of a p-type silicon substrate to form a composite dielectric film on the whole surface, and windows are opened locally to lead electrodes out. Through aluminum oxide, silicon dioxide, silicon oxynitride, silicon nitride with different refractive indexes and a back surface passivation layer with a laminated structure of the materials, the back surface recombination rate is greatly reduced, the back reflectivity is improved, the CTM of a module is reduced, and the light attenuation and heat-assisted light attenuation and the anti-PID performance of the cell are improved. The structure can be made on a boron/gallium-doped p-type monocrystalline silicon, p-type polycrystalline silicon or p-type monocrystalline-silicon-like substrate, and a passivation method based on the composite dielectric film passivation structure can be used to manufacture PERC cells, double-sided PERC+ cells and imbricate PERC cells. Based on the preparation process steps and sequence, the corresponding preparation mode and the process parameter range of the laminated structure, the making of the cell can be well completed.
Owner:TONGWEI SOLAR ENERGY CHENGDU CO LID +2

Compound optical and electrical conductors, and connectors therefor

A compound optical and electrical conductor includes a fiberoptic light transmitting element (multiple fibers or single solid rod) with at least one solar cell with LED therewith. The electrical conductor or conductors may be imbedded or otherwise secured within the optically conducting element or its surrounding jacket or sheath, or may be contained in a separate elongate retainer which may be provided to hold the optically conducting element in place as desired. The conductors may include a jacket or retainer which is optically open along one side thereof, allowing the optical conductor to emit light laterally therefrom subtending an angle defined by the optical gap in the jacket or retainer. One or more compound connectors may be provided, for linking two or more such compound conductors together as desired. The connectors provide for both the concentric alignment of the optical conductors, and also the electrical connection of the electrical conductors of the compound devices. The connectors preferably each include one or more lighting elements (halogen, high output LED, etc.) to compensate for light attenuation along the lengths of the attached optical conductors. The electrically conducting elements of the compound conductors provide electrical power to the lighting elements enclosed within the connectors, to provide an increase in light power at points along the length of an assembly. Different colors of lights may be provided, with the electrical conductors providing for the selective illumination of each as desired.
Owner:PLASTICS INVENTIONS & PATENTS INC

Gallium and indium doped single crystal silicon material for solar battery and preparation method thereof

The invention discloses a gallium and indium doped single crystal silicon material for a solar battery, which consists of the following components according to atom number per cubic centimeter of the single crystal silicon material: 1.0X10<14> to 1.0X10<18> gallium, 5.0X10<12> to 5.0x10<16> indium and the balance of single crystal silicon. The invention also discloses a method for preparing the gallium and indium doped single crystal silicon material for the solar battery, which is implemented by the following steps of: dismantling a furnace by using a regular method, cleaning a hearth and assembling the furnace; vacuumizing the inside of a single crystal furnace and detecting the leakage of the single crystal furnace by using a regular method; pressuring materials and smelting the materials; stabilizing the melt; seeding crystals; performing shouldering; performing shoulder rotation; performing isodiametric growth; performing ending and cooling the obtained product; and stopping the furnace. The gallium and indium doped single crystal silicon material for the solar battery has the advantages of high conversion efficiency, low light attenuation, low oxide content in the single crystal silicon and uniform radial distribution in a single crystal silicon rod; and the preparation method of the invention effectively controls the thermal conversion of silicon melt and grows the high-quality gallium and indium doped single crystal silicon material for the solar battery.
Owner:LONGI GREEN ENERGY TECH CO LTD

Optical multiplex communication system, optical transmission apparatus, and control method of optical multiplex communication

An optical multiplex communication system includes a transmission part and a receiving part, wherein the transmission part includes a transmission quality detecting part which measures and transmits a transmission quality information for the channels based on a request from the transmission part; the receiving part includes a variable optical attenuation part controls the optical signal level for the channels, an optical level setting part controls the variable optical attenuation part based on a setting value, a setting control part adding the setting value to the optical level setting part based on a request for setting.
Owner:FUJITSU LTD

LED module fabrication method

InactiveUS20100311193A1Eliminates deflection and total reflection and light attenuationAssures uniform distributionSolid-state devicesSemiconductor/solid-state device manufacturingEngineeringBrightness perception
A method of fabricating a LED module by: bonding one or multiple LED chips and multiple conducting terminals to a circuit substrate, and then molding a packing cup on the circuit substrate over by over molding for enabling the LED chip(s) and the conducting terminals to be exposed to the outside of the packing cup, and then molding a lens on the packing cup and the LED chip(s) by over-molding. By means of directly molding the lens on the packing cup and the LED chip(s), no any gap is left in the lens, avoiding deflection, total reflection or light attenuation and enhancing luminous brightness and assuring uniform distribution of output light.
Owner:KWO GER METAL TECH
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