2605 results about "High power leds" patented technology

A light emitting diode lighting device and system that can be used for illuminating the interior and / or exterior of vehicles, aircraft, watercraft, signage or buildings is provided. It includes a voltage feedback constant current power supply circuitry and high power LEDs. The printed circuit assemblies are firmly mounted onto a continuous or semi-continuous mounting channel case that also works as a heat sink. By this means, it not only increases the reliability of the LED lighting tube but also it provides sufficient heat dissipation capability for the heat generated by the LEDs. Since the operating temperature of the LEDs is controlled and stays in cool condition, it dramatically increases the LED's lifetime and efficiency. The end caps of this LED lighting device are fully compatible with existing conventional fluorescent light fixtures and can directly replace those fluorescent lighting tubes in vehicles, mass-transit, watercrafts, aircrafts, signage or buildings with minimal modifications.

A high power light emitting diode (LED) lighting assembly incorporated with heat dissipation module is provided. The LED lighting assembly includes a heat exchange base, at least one LED array, at least one heat pipe and a heat dissipation module. The heat exchange base includes at least one LED configuration plan for mounting of the LED array and at least a hollow part for insertion of the heat pipe. The LED array is arranged at a predetermined projecting angle at the LED configuration plane. The heat pipe includes a heated section, a cooling section and a conducting section, and contains a working fluid therein. The heat exchange base is mounted to the heated section and the heat dissipation module is mounted to the cooling section. The thermal energy generated by the LEDs is conducted from the heat exchange base to the heated section of the heat pipe, whereby allowing the working fluid in the heat pipe to be heated and vaporized, and flows, from the conducting section to the cooling section for dissipation at the heat dissipation module.

Disclosed is a high power LED package. In the LED package, a lower board has a heat radiation member in an LED mounting area and at least one via hole around the heat radiation member. First and second bottom electrodes are formed in the underside of the lower board, and connected to the heat radiation member and the via hole. An insulation layer is formed on the lower board to cover the heat radiation member. First and second electrode patterns on the insulation layer are connected to the first and second bottom electrodes through the via hole.

A light source injects light into a translucent light guide, particularly using high-power LEDs. A core to the light guide contains a homogenous mixture of fluid and a light dispersing agent to effect scattering. Scattered light passes though the light guide and may be used for illumination. A high power LED is provided with a reflector and heat sink to disperse waste heat, increasing the efficiency and life of the LED.

The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

Disclosed is a high power LED package, including an LED; a silicon submount to which the LED is flip chip bonded; a reflective film formed on the silicon submount and electrically connected to the LED to increase light emitting efficiency of the LED; electrical wires connected to the reflective film to connect the LED to an external circuit; an insulating body formed below the silicon submount; a heat sink formed below the insulating body; an insulating substrate formed on the heat sink; and metal lines formed on the insulating substrate and connected to the electrical wires. In the LED package, since the silicon submount having the LED flip chip bonded thereto is directly attached to the heat sink, heat generated upon operation of the LED can be effectively radiated. Also, the LED package has a simple structure, thus having drastically decreased manufacturing costs. The high power LED can be applied to backlight units of LCDs or general illumination fixtures, and as well, to backlight units of conventional PCS phones or LED packages for key pads, therefore increasing the light properties of the LED. In particular, the LED package has an array of two or more submounts each having an LED flip chip bonded thereto, and thus, it can be applied to a module of a backlight unit for LCDs, thus having remarkably reduced manufacturing costs.

LED lamp has LEDs aimed rearwards with either a concave mirror to the rear of each LED, or one concave mirror to the rear of two or more LEDs, collecting the light from the LEDs to form a forward projecting beam. LEDs may be high power types that require heatsinking. LED lamp may have a lens forward of each LED to collimate the radiation produced by the LEDs into a beam, where at least one lens has at least one aspheric curved surface. LED lamp may have a transparent reflective optic to collimate the radiation produced by each LED into a beam. For an inspection lamp, the LEDs typically have a peak wavelength of 395 to 415 naometers for seeing the area being irradiated but not so visible as to overwhelm fluorescence of fluorescent materials to be detected. Other wavelengths may be used. LED inspection lamp has a combination of LEDs of different wavelengths or a combination of at least one LED and at least one other light source such that the lamp produces radiation suitable for detection of materials to be detected and adequately illuminates the area being irradiated. LED lamp has LEDs that produce a beam of suitable radiation with a width of 10 degrees or less without additional optics. LED inspection lamp has head attached to a flexible member, with head serving as heatsink for one or more high power LEDs. Current regulator circuits are also disclosed.

A light emitting diode lighting device and system that can be used for illuminating the interior and / or exterior of vehicles, aircraft, watercraft, signage or buildings is provided. It includes a voltage feedback constant current power supply circuitry and high power LEDs. The printed circuit assemblies are firmly mounted onto a continuous or semi-continuous mounting channel case that also works as a heat sink. By this means, it not only increases the reliability of the LED lighting tube but also it provides sufficient heat dissipation capability for the heat generated by the LEDs. Since the operating temperature of the LEDs is controlled and stays in cool condition, it dramatically increases the LED's lifetime and efficiency. The end caps of this LED lighting device are fully compatible with existing conventional fluorescent light fixtures and can directly replace those fluorescent lighting tubes in vehicles, mass-transit, watercrafts, aircrafts, signage or buildings with minimal modifications.

The present invention provides a light source module with high efficiency, super bright LEDs featured with efficient heat dissipation. This invention comprises a printed circuit board installed with an LED array which is composed of multiple emitter LEDs. To achieve efficient effect for heat dissipation, there is more than one hole punctured on the printed circuit board right underneath each emitter LED. The surface of each punctured hole is coated with thermal conductive layer such that the accumulative heat generated by the high power LEDs can be effectively dissipated through the conductive layer.

A grow light fixture that may be used for the replacement of high intensity discharge (HID) lamp fixtures used for growing plants includes a housing containing a plurality of both red and blue high power LEDs mounted to a circuit board, and powered by an onboard power supply. Control circuitry may include separate, infinitely variable controls to enable independent adjustment of the red and blue LED light output. A plurality of thermal vias made of copper or other thermally conductive material extend through the circuit board to conduct heat from the LEDs to a heat sink mounted on the back of the circuit board, and a fan may be used to vent the heat to the outside of the housing. The housing is mounted an appropriate distance above a plant in a growth media to provide user-controlled lighting for enhanced plant growth.

A high-power LED lamp uses an LED chip that can be larger than 1mm square. The chip has trenches that can convert light trapped in the semiconductor into light that passes through a major surface of the chip. The trenches include light-reflecting tracks joined to a chip terminal and feeding a semiconductor layer. The chip can have triangular light emitting elements that improve light extraction from the semiconductor. The elements can be fused, resulting in improved manufacture yield of chips. A 25 watt single chip lamp with a heat sink very close to the active region is described.

This invention discloses heat dissipation devices for an LED lamp set with a plate-type heat spreader as the core unit. The plate-type heat spreader is either a flat-plate heat pipe or a metal plate embedded with heat pipes. The high-power LED lamps are thermally connected to the bottom surface of the heat spreader so that the heat generated by the LED lamps is absorbed by the evaporation region of the flat-plate heat pipe or the embedding heat pipes. The heat is spread by internal vapor motion of the working fluid toward different regions of the heat spreader. The top surface of the heat spreader is connected with a finned heat sink, where the heat is delivered to the ambient air. The hot air leaves by buoyancy through the openings on a lamp housing located above the finned heat sink. An alternative design is that the inner surface of the lamp housing is connected with the top surface of the plate-type heat spreader, with the heat dissipated out at the surface of the housing by natural convection.

There is provided a high power LED package and a method of manufacturing the same. The method includes: forming at least one chip mounting part and at least one through hole in a metal plate; forming an insulating layer of a predetermined thickness on an entire outer surface of the metal plate; forming an electrode part to be electrically connected to a light emitting chip mounted on the chip mounting part; and cutting the metal plate along a trimming line to separate the package. The LED package is free from thermal impact resulting from different thermal coefficients among components, thus ensuring stable heat radiation characteristics in a high temperature atmosphere. Also, the LED package is minimized in optical loss to improve optical characteristics. In addition, the LED package is simplified in a manufacturing and assembly process and thus can be manufactured in mass production at a lower cost.

A driver circuit produces variable current output for an LED lighting system providing improved dimming capability and greater power efficiency when responding to industry standard lighting dimmers, through the use of an input voltage monitoring circuit which variably controls the current output of a switching regulator. Output current modulation methods such as analog, PWM, Pulse Frequency Modulation, or other digital modulation, and combination or hybrid methods such as that disclosed in U.S. Pat. No. 7,088,059 B2 may be employed. The current invention marries such output modulation techniques with a control method which is derived through intelligent monitoring of the input voltage waveform. The circuit and method described is adapted to higher current applications such as LED lighting systems using the latest high-power LEDs.

LED lamp has LEDs aimed rearwards with either a concave mirror to the rear of each LED, or one concave mirror to the rear of two or more LEDs, collecting the light from the LEDs to form a forward projecting beam. LEDs may be high power types that require heatsinking. LED lamp may have a lens forward of each LED to collimate the radiation produced by the LEDs into a beam, where at least one lens has at least one aspheric curved surface. LED lamp may have a transparent reflective optic to collimate the radiation produced by each LED into a beam. For an inspection lamp, the LEDs typically have a peak wavelength of 395 to 415 naometers for seeing the area being irradiated but not so visible as to overwhelm fluorescence of fluorescent materials to be detected. Other wavelengths may be used. LED inspection lamp has a combination of LEDs of different wavelengths or a combination of at least one LED and at least one other light source such that the lamp produces radiation suitable for detection of materials to be detected and adequately illuminates the area being irradiated. LED lamp has LEDs that produce a beam of suitable radiation with a width of 10 degrees or less without additional optics. LED inspection lamp has head attached to a flexible member, with head serving as heatsink for one or more high power LEDs. Current regulator circuits are also disclosed.

A high power LED lamp comprises a container having a cavity to fill with a liquid, a light source module for providing a high power LED source light to penetrate through the liquid, and an axial thermal conductor having a first portion nearby the light source module and a second portion extending in the liquid along an axial direction of the cavity to far away from the light source module to evenly transfer heat from the light source module through the liquid to the container.

A high power LED lamp comprises a cover; a base panel; an LED mounted on the base panel which further includes an insulator; a substrate; a power supply received in the insulator; and a heat sink device disposed between the cover and substrate; wherein the insulator is engaged with the heat sink device, and both the LED and base panel are defined above the heat sink device. In accordance with the present invention, the heat created during work of the LED can be radiated rapidly via the heat sink device and thus ensuring good heat dispersion, high brightness, long life and low temperature.

A high power LED color bulb with infrared remote function has a reflector having front and rear openings and a light guide hole, a light guide bar received inside light guide hole, an LED module with LED chips and a bulb cover with a controlling circuit board. The LED module is mounted on a rear end of the reflector with the LED chips inside the reflector. The controlling circuit board is inside the bulb cover, is connected electronically to the LED module and has an infrared sensor aligned with the light guide bar of the reflector. When an infrared signal comes through the front opening of the reflector, the infrared signal passes through the light guide bar and is received by the infrared sensor. Since the infrared sensor is behind the reflector and the LED chips, the infrared sensor avoids overheating from heat produced by the LED chips and does not have to be replaced simultaneously with the color bulb.

A high power light emitting diode (“LED”) package is disclosed. The high power LED package includes a housing made of an insulating material and having a cavity in its central portion; a lead frame made of a conductive material, including an inner lead exposed by the cavity of the housing and an outer lead extending outside the housing; a heat sink above which the inner lead is placed and having a portion exposed by the cavity of the housing; an LED chip mounted on the exposed portion of the heat sink and electrically connected to the inner lead; a lens portion coupled to the housing to cover the cavity of the housing; and an insulating adhesive sheet interposed between the inner lead and the heat sink for electrically insulating and thermally coupling the inner lead and the heat sink.

A packaging structure and a related fabrication method for high-power LED chip are provided herein, which mainly contains a base made of a metallic material and an electrically insulating material integrated into a single object. The metallic material forms a heat sinking seat in the middle of the base, which is exposed from the top surface of the base, and from the bottom surface or a side surface of the base. The metallic material also forms a plurality of electrodes surrounding the heat sinking seat, which are exposed from the top surface of the base, and from the bottom surface or a side surface of the base, respectively. The electrically insulating material is interposed between the electrodes and the heat sinking seat so that they are adhere together, and so that the heat sinking seat and any one of the electrodes, and any two electrodes are electrically insulated. The packaging structure achieves superior heat dissipation efficiency by separating the electricity and heat dissipation channels and, in another way, is applicable in mass production for a significantly reduced production cost.

A high power light emitting diode (LED) lighting assembly incorporated with heat dissipation module is provided. The LED lighting assembly includes a heat exchange base, at least one LED array, at least one heat pipe and a heat dissipation module. The heat exchange base includes at least one LED configuration plan for mounting of the LED array and at least a hollow part for insertion of the heat pipe. The LED array is arranged at a predetermined projecting angle at the LED configuration plane. The heat pipe includes a heated section, a cooling section and a conducting section, and contains a working fluid therein. The heat exchange base is mounted to the heated section and the heat dissipation module is mounted to the cooling section. The thermal energy generated by the LEDs is conducted from the heat exchange base to the heated section of the heat pipe, whereby allowing the working fluid in the heat pipe to be heated and vaporized, and flows, from the conducting section to the cooling section for dissipation at the heat dissipation module.

A high power LED lamp has a GaN chip placed over an AlGaInP chip. A reflector is placed between the two chips. Each of the chips has trenches diverting light for output. The chip pair can be arranged to produce white light having a spectral distribution in the red to blue region that is close to that of daylight. Also, the chip pair can be used to provide an RGB lamp or a red-amber-green traffic lamp. The active regions of both chips can be less than 50 microns away from a heat sink.

A lighting device has a light-bar mount and multiple light bars. The light-bar mount is integrally formed from a board. The light bars are mounted on the light-bar mount and each light bar has a heat sink, a circuit board and multiple high-power LED modules. The heat sink is detachably mounted in the light-bar mount. The circuit board is mounted in the heat sink. The high-power LED modules are mounted on the heat sink and electrically connected to the circuit board for providing outward illumination.

The invention provides an LED atmosphere illumination control system, which adopts the standard DMX512 control protocol and a bus type network structure. A controller intensively controls all LED lamps. The system comprises an embedded light synchronous controller, an indoor atmosphere illumination controller, a general high-power LED drive, a transmission medium and the LED lamps. The system canperform scene mode control by network control mode, remote control mode, automatic control mode, manual control mode and various control modes; no less than nine scene modes are preset or can be freely set according to individual preference; digital diming can be achieved by an embedded program, and the illumination and the color tone of the light can be controlled precisely; and each lamp can beindependently controlled or can be controlled by networking. The system can ensure the evenness of the illumination effect while achieving the energy-saving illumination control and is widely applicable to local intensive illumination control of public places and families.

The invention relates to a high power LED package having excellent light efficiency and heat dissipating characteristics. The LED package includes a base member, a reflector unit arranged on the base member and having a plurality of first reflectors, a plurality of LED chips mounted on the base member and surrounded by the first reflectors, and a connection unit arranged on the base member, for electrically connecting the LED chips to an outside. The reflector unit also includes a second reflector surrounding the first reflectors. The second reflector is arranged to surround the first reflectors in order to completely prevent any interference of emission lights and collect the emission lights together, thereby enabling excellent light efficiency. Furthermore, with the first reflectors surrounding the individual LED chips, it is possible to maximize heat dissipating efficiency of the lead frame, thereby stabilizing operating characteristics of the package.

A high power LED lamp and method for retrofitting conventional traffic signal lamps. The LED lamp includes a housing, a power supply disposed in the housing, a plurality of LEDs mounted to a substantially planar mounting surface in the housing and electrically connected to the power supply for producing diverging light, and a threaded electrical connector extending from the housing. The method includes replacing a conventional incandescent light bulb with the LED lamp, and installing a Fresnel lens inside the traffic signal lamp that collimates and just fills and illuminates the outer lens of the traffic signal lamp.

A step down switching regulator circuit that is particularly well-suited to drive high power LEDs includes a crossover conduction mode (XCM) control circuit that maintains operation at the crossover point between continuous conduction mode (CCM) and discontinuous conduction mode (DCM). This XCM operation provides an inductor current waveform that ramps up and down between zero and a desired maximum current. One or more comparators in the XCM control circuit can be used to control switching between the inductor current ramp up and ramp down phases. In this manner, complex feedback loop logic and PID controlled PWM signal generation logic can be avoided, and the need for external sense resistors and associated interface pins can be eliminated.

An even luminance, high heat dissipation efficiency, high power LED lamp structure includes an aluminum extrusion body, an aluminum die cast front casing and an aluminum die cast rear casing respectively provided at two distal ends of the aluminum extrusion body, a PC board mounted inside the aluminum extrusion body, LEDs mounted in different LED mounting faces of the PC board at different angles, an inner cover plate decorating the inside of the aluminum die cast front casing, a transparent outer cover covering the bottom side of the aluminum extrusion body and sealed with a water seal, and a retaining device fastened to the aluminum extrusion body to secure the transparent outer cover in place.