1454results about How to "Improve radiation efficiency" patented technology

The invention discloses a lens antenna with high directivity intended for use in radio-relay communication systems, said antenna providing the capability of electronic steering of the main radiation pattern beam by switching between horn antenna elements placed on a plane focal surface of the lens. Electronic beam steering allows antenna to automatically adjust the beam direction during initial alignment of transmitting and receiving antennas and in case of small antenna orientation changes observed due to the influence of different reasons (wind, vibrations, compression and / or extension of portions of the supporting structures with the temperature changes, etc.). The technical result of the invention is the increase of the antenna directivity with simultaneously provided capability of scanning the beam in a continuous angle range and also the increase of the antenna radiation efficiency and, consequently, the increase of the lens antenna gain. This result is achieved by the implementation of horn antenna elements with optimized geometry.

The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

A light emitting element has: a light emitting layer of semiconductor; and a diffusion layer that has a refractive index equal to or greater than that of the light emitting layer and that diffuses light emitted from the light emitting layer to increase the external radiation efficiency of the light emitting element. The light emitting layer has a refractive index equal to or greater than that of any layers formed between the light emitting layer and the diffusion layer.

An antenna for an RFID tag includes each power feeding parts 11 that is formed of a conductor, meandering parts 13a and 13b that are formed of conductors shaped as a pair of meandering lines, connected to the power feeding parts 11, and extend from the power feeding parts 11 toward both ends of the power feeding parts 11, respectively, a pair of radiating parts 14a and 14b that are formed of conductors and connected to outer ends of the pair of meandering parts 13a and 13b, respectively. The meandering parts 13a and 13b include a plurality of sides arranged in a longitudinal direction where the meandering parts 13a and 13b extend. Further, the lengths of portions, where the ends of the radiating parts 14a and 14b facing the meandering parts 13a and 13b face the sides closest to the radiating parts 14a and 14b among the plurality of sides of the meandering parts 13a and 13b in a direction orthogonal to the longitudinal direction, are smaller than the widths of the widest portions of the radiating parts.

In a multilayer substrate (2), an internal ground layer (11) is provided at a position between insulating layers (4) and (5) and a radiating element (13) is provided at a position between insulating layers (3) and (4). A first coplanar line (7) is connected to an intermediate position of the radiating element (13) in an X-axis direction, and a second coplanar line (9) is connected to an intermediate position of the radiating element (13) in a Y-axis direction. A passive element (16) is laminated on the upper surface of the radiating element (13) through the insulating layer (3). The passive element (16) is formed in a cross shape in which a first patch (16A) extending in the X-axis direction and a second patch (16B) extending in the Y-axis direction are orthogonal to each other.

The embodiment of the invention provides a mobile terminal and a method and device for switching antennas of the mobile terminal. The method includes the steps of receiving first signal intensity received by the first antenna on the mobile terminal and second signal intensity received by the second antenna on the mobile terminal, comparing the first signal intensity with the second signal intensity, and controlling the mobile terminal to use the antenna with the high signal intensity. According to the mobile terminal and the method and device for switching the antennas of the mobile terminal, the problems that the mobile terminal is large in power consumption, short in stand-by time and poor in communication quality can be solved.

A substrate is attached to one edge side of a radiator and a globe is attached covering the substrate. Heat-radiating fins are provided on the other edge side of the radiator and an air-cooling unit is rotatably provided inside the heat-radiating fins which enables to freely rotate. A case storing a circuit part is attached to the other edge side of the radiator and a cap is provided to the case. By the wind blast from the air-cooling unit, the heat-radiating fins are caused to be a part of the ventilation path to allow for ventilation of the inside of the radiator.

The antenna includes a Litz wire loop having a plurality of individually insulated wires braided together and a plurality of splices therein to define distributed capacitors. A magnetically coupled feed loop is provided within the electrically conductive loop, and a feed structure, such as a coaxial feed line, feeds the magnetically coupled feed loop.

An interconnection element and method for making same is disclosed. The interconnection element may include a plurality of metal conductors, a plurality of solid metal bumps and a low melting point (LMP) metal layer. The solid metal bumps overly and project in a first direction away from respective ones of the conductors. Each bump has at least one edge bounding the bump in at least a second direction transverse to the first direction. The low melting point (LMP) metal layer has a first face joined to the respective ones of the conductors and bounded in the second direction by at least one edge and a second face joined to the bumps. The edges of the bumps and the LMP layer are aligned in the first direction, and the LMP metal layer has a melting temperature substantially lower than the conductors.

The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

The invention discloses an orbital angular momentum vortex wave beam generation apparatus and method. According to the technical scheme, an electromagnetic super-surface structure (3) is formed by M lines and N columns of electromagnetic super-surface reflection units (31) and dielectric substrates (32); a phase-shifting network (4) is formed by the electromagnetic super-surface structure (3) and a metal back plate (2); the metal back plate (2) is positioned on the back surface of the electromagnetic super-surface structure (3), and the metal back plate is also used as an earth plate; a feed source (1) is put in the central axial position of the electromagnetic super-surface structure (3); incident wave from the feed source (1) irradiates on the electromagnetic super-surface structure; and after the incident wave obtains compensated phase position from the electromagnetic super-surface structure, the incident wave is reflected by the phase-shifting network (4) to generate the orbital angular momentum vortex wave beam(5) with an intrinsic mode 1. According to the orbital angular momentum vortex wave beam generation apparatus and method, the problems of complex technical structure, high cost, beam divergence and low efficiency in the prior art are solved; and the apparatus and method can be used for information transmitting and receiving in the communication technology, and the communication capacity can be increased.

The invention provides a micro electromechanical cascade millimeter wave antenna, comprising an upper anisotropic substrate, a middle anisotropic substrate and a lower anisotropic substrate. The upper surface deposit of the upper anisotropic substrate is provided with metal and forms a first metal radiation patch by mechanical erosion. The upper surface deposit of the middle anisotropic substrate is provided with metal and forms a second metal radiation patch by mechanical erosion. The upper surface deposit of the lower anisotropic substrate is provided with metal and forms a FGCPW-MS feeder or a MS feeder by mechanical erosion. The upper anisotropic substrate, the middle anisotropic substrate and the lower anisotropic substrate form a unit by MEMS bonding technology. The antenna has small size and light weight, which is also easy for the further integration.