117 results about "Coplanar lines" patented technology

The antenna of said transmitter is a microstrip antenna. A rear edge of its patch is provided with a short circuit by means of which a quarter-wave primary resonance can be excited by a coplanar line formed by two coupling slots in an area. Separator slots separate said area from another area in which a secondary resonance can be established at twice the frequency of the primary resonance from a slotted line extending one slot of the coplanar line. The invention applies in particular to the production of a dual-mode mobile telephone to the GSM and DCS standards.

In a multilayer substrate (2), an internal ground layer (11) is provided at a position between insulating layers (4) and (5) and a radiating element (13) is provided at a position between insulating layers (3) and (4). A first coplanar line (7) is connected to an intermediate position of the radiating element (13) in an X-axis direction, and a second coplanar line (9) is connected to an intermediate position of the radiating element (13) in a Y-axis direction. A passive element (16) is laminated on the upper surface of the radiating element (13) through the insulating layer (3). The passive element (16) is formed in a cross shape in which a first patch (16A) extending in the X-axis direction and a second patch (16B) extending in the Y-axis direction are orthogonal to each other.

The antenna of said transmitter is a microstrip antenna. A rear edge of its patch is provided with a short circuit by means of which a quarter-wave primary resonance can be excited by a coplanar line formed by two coupling slots in an area. Separator slots separate said area from another area in which a secondary resonance can be established at twice the frequency of the primary resonance from a slotted line extending one slot of the coplanar line. The invention applies in particular to the production of a dual-mode mobile telephone to the GSM and DCS standards.

A variable capacitance element includes a coplanar line or signal conduction and a movable body, which are vertically displaced through a supporting bar and which are provided on a substrate. A movable electrode is provided between a first driving electrode and second and third driving electrodes which are movable electrodes. Voltage is applied between the movable electrodes, such that one of the movable electrodes is pressed against the coplanar line through a dielectric film. Thus, high frequency signals conducting through the coplanar line are shut off. When voltage is applied between the other electrodes, the movable electrode and the dielectric film are moved apart from the coplanar line. Thus, high frequency signals are conducted through the coplanar line.

A delay line system able to reduce the microwave loss by reducing the effective dielectric loss and dielectric constant of the system including a signal line, dielectric system with opened trench or slot filled up with the air or lower dielectric loss material, a ground plane, and a system of switches if the line is to be variable. The delay line proposed in this invention could be made of any type of signal line configuration, for example: micro-strip line, strip line, or coplanar line. The signal line can also be made as single ended or differential pairs of any configurations. The delay line systems based on the fundamental techniques provided in this invention can be used for on-chip devices where the delay line is laid on the oxide or dielectric material, or in a traditional PCB implementation such as FR4.

A first wiring layer in a circuit substrate structure is provided with a first inductor and a second inductor. A dielectric layer is provided with a first via and a second via electrically connected to the first inductor and the second inductor, respectively. A second wiring layer is provided with: abridge electrically connecting the first via and the second via; and a conductive pattern provided around the bridge, the outer edge of the conductive pattern being located outside the outer edge of the first wiring pattern and the second wiring pattern in the first wiring layer. The bridge functions as a coplanar line and suppresses generation of electromagnetic field.

An optical module having a flexible substrate having, even after actual manufacturing steps, excellent transmission characteristics of high-frequency signals and an advantage that electromagnetic field radiation is reduced even when it is connected with a package. The flexible substrate used in external connection of the package of the optical module uses a flexible substrate having a coplanar line to which a lead pin is fixedly attached, a grounded coplanar line which is in contact with the coplanar region, and a microstrip line which is in contact with the grounded coplanar line. The flexible substrate has an electrode layout in which an electromagnetic field component of a surface ground line and a signal line is more dominant than an electromagnetic field component of a back-surface ground line and the signal line in a region of the coplanar line adjacent to the grounded coplanar line.

The coaxial line comprises a coaxial inner conductor and a first dielectric layer encompassing the coaxial inner conductor and which is surrounded by a coaxial outer conductor. The coplanar line comprises a second dielectric layer with a coplanar inner conductor and a first and second coplanar outer conductor applied to the front side thereof and with a metallization layer followed by a substrate carrier layer on the rear side thereof. The first and second coplanar outer conductors are separated from the coplanar inner conductor by the second dielectric layer and the coaxial inner conductor is connected to the coplanar inner conductor and the coaxial outer conductor is connected to the first and second coplanar outer conductors. When high bit rate data signals are transmitted via the connecting point of the coaxial line and the coplanar line, the capacitative power is increased and undesirable reflections occur. In order to avoid this, a recess is provided in the metallization layer, beginning at the point of connection between the coaxial line and the coplanar line and extending in an approximately symmetrical manner with respect to the coplanar inner conductor, tapering in the direction of the coplanar inner conductor as the distance from the point of connection increases.

In a transmission line, protrusions extend in line one after another in a direction perpendicular to the cross section in a part of a dielectric substrate, with a discontinuous portion therebetween. A lower-surface electrode is formed on a main surface of the dielectric substrate provided with the protrusions and on the outer surfaces of the protrusions. An upper-surface electrode is formed on substantially the whole area of the surface opposite to the lower-surface electrode. Further, a plurality of through-holes for connecting the lower-surface electrode and the upper-surface electrode, which are formed on both surfaces of the dielectric substrate, are aligned on both sides of the protrusions along the direction in which the protrusions extend. Also, coplanar lines and a circuit element are mounted on the upper-surface electrode. The coplanar lines are coupled at a predetermined position to a transmission path formed by the protrusions.

In a transmission line, protrusions extend in line one after another in a direction perpendicular to the cross section in a part of a dielectric substrate, with a discontinuous portion therebetween. A lower-surface electrode is formed on a main surface of the dielectric substrate provided with the protrusions and on the outer surfaces of the protrusions. An upper-surface electrode is formed on substantially the whole area of the surface opposite to the lower-surface electrode. Further, a plurality of through-holes for connecting the lower-surface electrode and the upper-surface electrode, which are formed on both surfaces of the dielectric substrate, are aligned on both sides of the protrusions along the direction in which the protrusions extend. Also, coplanar lines and a circuit element are mounted on the upper-surface electrode. The coplanar lines are coupled at a predetermined position to a transmission path formed by the protrusions.

The present invention provides a high frequency coupler(2) comprising first and second coupler patterns(11, 12) each having an annular shape broken at one location and formed, facing each other, on the front and rear surfaces of a circuit board(10) consisting of a dielectric and being t thick. The terminals(11a, 11b) of the first coupler pattern(11) serve as unbalanced terminals, and the terminals(12a, 12b) of the second coupler pattern(12) serve as unbalanced terminals from which coplanar lines(41, 42) are led out along the rear surface and connected with a balanced antenna(5). Since the first and second coupler patterns(11, 12) are kept in an electrostatic capacity coupling state as well as in a magnetic induction coupling state, the coupler high in transmission efficiency in a broad band can be realized.

In a multilayer substrate (2), an internal ground layer (11) is provided at a position between insulating layers (4) and (5) and a radiating element (13) is provided at a position between insulating layers (3) and (4). A first coplanar line (7) is connected to an intermediate position of the radiating element (13) in an X-axis direction, and a second coplanar line (9) is connected to an intermediate position of the radiating element (13) in a Y-axis direction. A passive element (16) is laminated on the upper surface of the radiating element (13) through the insulating layer (3). The passive element (16) is formed in a cross shape in which a first patch (16A) extending in the X-axis direction and a second patch (16B) extending in the Y-axis direction are orthogonal to each other.

The present invention provides a filter exhibiting excellent filter characteristics and having less number of stages. A dielectric substrate (1) has one surface connected to a top conductor (2) and an opposite surface connected to a bottom conductor (3). A pair of rows of via-holes connecting together the top conductor (2) and the bottom conductor (3) are formed along the signal transfer direction. A slit (6) is formed in a portion of the top conductor (2) overlying the central resonator among a plurality of resonators. The slit (6) extends in a direction perpendicular to the signal transfer direction. Slits (7, 8) are formed in each of portions of the top conductor (2) overlying resonators disposed at both ends. A coplanar waveguide (9) mounted on the top conductor (2) is connected to the slit (7).