61results about How to "Effective dielectric constant" patented technology

Wirings mainly containing copper are formed on an insulating film on a substrate. Then, after forming insulating films for reservoir pattern and a barrier insulating film, an insulating film for suppressing or preventing diffusion of copper is formed on upper and side surfaces of the wirings, the insulating film on the substrate, and the barrier insulating film. Here, thickness of the insulating film for suppressing or preventing diffusion of copper at the bottom of a narrow inter-wiring space is made smaller than that on the wirings, thereby efficiently reducing wiring capacitance of narrow-line pitches. Then, first and second low dielectric constant insulating films are formed. Here, a deposition rate of the first insulating film at an upper portion of the side surfaces of facing wirings is made higher than that at a lower portion thereof, thereby forming air gaps. Finally, the second insulating film is planarized by interlayer CMP.

A method for forming a multilayer interconnect structure on a substrate that include interconnected conductive wiring and vias spaced apart by a combination of solid or gaseous dielectrics. The inventive method includes the steps of: (a) forming a first planar via plus line level pair embedded in a dielectric matrix formed from one or more solid dielectrics and comprising a via level dielectric and a line level dielectric on a substrate, wherein, at least one of said solid dielectrics is at least partially sacrificial; (b) etching back sacrificial portions of said at least partially sacrificial dielectrics are removed to leave cavities extending into and through said via level, while leaving, at least some of the original via level dielectric as a permanent dielectric under said lines; (c) partially filling or overfilling said cavities with a place-holder material which may or may not be sacrificial; (d) planarizing the structure by removing overfill of said place-holder material; (e) repeating, as necessary, steps (a)-(d); (f) forming a dielectric bridge layer over the planar structure; and (g) forming air gaps by at least partially extracting said place-holder material.

A method for forming a self aligned pattern on an existing pattern on a substrate comprising applying a coating of a solution containing a masking material in a carrier, the masking material having an affinity for portions of the existing pattern; and allowing at least a portion of the masking material to preferentially assemble to the portions of the existing pattern. The pattern may be comprised of a first set of regions of the substrate having a first atomic composition and a second set of regions of the substrate having a second atomic composition different from the first composition. The first set of regions may include one or more metal elements and the second set of regions may include a dielectric. The first and second regions may be treated to have different surface properties. Structures made in accordance with the method. Compositions useful for practicing the method.

High speed printed circuit boards (PCBs) are disclosed comprising a dielectrics systems with the back-side trenches, prepregs, signal lines and ground-plans, wherein the signal line and ground-plan are located on the dielectrics. Using of the open trenches in the substrate help to reduce the microwave loss and dielectric constant and thus increasing the signal carrying speed of the interconnects. Thus, according to the present invention, it is possible to provide a simple high speed PCB using the conventional material and conventional PCB manufacturing which facilitates the design of circuits with controlled bandwidth based on the trench opening in the dielectrics, and affords excellent reliability. According to this present invention, high speed PCB with the interconnect system contains whole portion or portion of interconnects for high speed chips interconnects and that have have the dielectric system with opened trench or slot to reduce the microwave loss.

A wiring board (10) having reduced electromagnetic coupling between electronic devices includes a base board (12) that is adaptable to receive at least one electronic component (14) mounted on the base board (12). At least one hole or void (16) is formed in the base board (12). The hole (16) is separated from the selected electronic component (14) to be isolated against undesired electromagnetic radiation by a portion (18) of the base board (12).

An interconnect structure and fabrication method are provided to form air gaps between interconnect lines and between interconnect layers. A conductive material is deposited and patterned to form a first level of interconnect lines. A first dielectric layer is deposited over the first level of interconnect lines. One or more air gaps are formed in the first dielectric layer to reduce inter-layer capacitance, intra-layer capacitance or both inter-layer and intra-layer capacitance. At least one support pillar remains in the first dielectric layer to promote mechanical strength and thermal conductivity. A sealing layer is deposited over the first insulative layer to seal the air gaps. Via holes are patterned and etched through the sealing layer and the first dielectric layer. A conductive material is deposited to fill the via holes and form conductive plugs therein. Thereafter, a conductive material is deposited and patterned to form a second level of interconnect lines.

Disclosed are multilevel interconnects for integrated circuit devices, especially copper/dual damascene devices, and methods of fabrication. Methylated-oxide type hardmasks are formed over polymeric interlayer dielectric materials. Preferably the hardmasks are materials having a dielectric constant of less than 3 and more preferably 2.7 or less. Advantageously, both the hardmask and the interlayer dielectric can be spincoated.

A delay line system able to reduce the microwave loss by reducing the effective dielectric loss and dielectric constant of the system including a signal line, dielectric system with opened trench or slot filled up with the air or lower dielectric loss material, a ground plane, and a system of switches if the line is to be variable. The delay line proposed in this invention could be made of any type of signal line configuration, for example: micro-strip line, strip line, or coplanar line. The signal line can also be made as single ended or differential pairs of any configurations. The delay line systems based on the fundamental techniques provided in this invention can be used for on-chip devices where the delay line is laid on the oxide or dielectric material, or in a traditional PCB implementation such as FR4.

To provide an antenna element having a radiation electrode formed mainly on one surface of a dielectric substrate. The radiation electrode is substantially symmetric in form with respect to the center thereof, and has a first half and a second half with the same direction of main polarization of radiation emitted therefrom. Each of the halves of the radiation electrode may be a quarter-wave antenna for a wavelength of the emitted radiation. A power supply conductor to be connected to a high frequency signal source is connected to the first half of the radiation electrode, and a ground conductor to be connected to a ground is connected to the second half. A total impedance of the first half of the radiation electrode and the power supply conductor and a total impedance of the second half of the radiation electrode and the ground conductor can substantially match to one another, so that resonance between the halves of the radiation electrode can be enhanced and a wider bandwidth can be realized.

The invention allows the fabrication of small, dense beads of dielectric materials with selected compositions, which are incorporated into a polymeric matrix for use in capacitors, filters, and the like. A porous, generally spherical bead of hydrous metal oxide containing titanium or zirconium is made by a sol-gel process to form a substantially rigid bead having a generally fine crystallite size and correspondingly finely distributed internal porosity. The resulting gel bead may be washed and hydrothermally reacted with a soluble alkaline earth salt (typically Ba or Sr) at elevated temperature and pressure to convert the bead into a mixed hydrous titanium- or zirconium-alkaline earth oxide while retaining the generally spherical shape. Alternatively, the gel bead may be made by coprecipitation. This mixed oxide bead is then washed, dried and calcined to produce the desired (BaTiO3, PbTiO3, SrZrO3) structure. The sintered beads are incorporated into a selected polymer matrix. The resulting dielectric composite material may be electrically "poled" if desired.

High speed flex printed circuit boards (FLEX-PCBs) are disclosed comprising a dielectrics systems with the back-side trenches, adhesives, signal lines and ground-plans, wherein the signal line and ground-plan are located on the dielectrics. Using of the open trenches in the substrate help to reduce the microwave loss and dielectric constant and thus increasing the signal carrying speed of the interconnects. Thus, according to the present invention, it is possible to provide a simply constructed high speed FLEX-PCB using the conventional material and conventional FLEX-PCB manufacturing which facilitates the design of circuits with controlled bandwidth based on the trench opening in the dielectrics, and affords excellent connection reliability. As the effective dielectric constant is reduced, the signal width is required to make wider or the dielectric thickness is required to make thinner keeping fixed characteristics impedance. The fundamental techniques disclosed here can also be used for high-speed packaging.

Provided is a semiconductor device, which includes an interlayer insulating film formed on a semiconductor substrate, a wiring layer filled in a recess formed in the interlayer insulating film, and a cap insulating film. The interlayer insulating film includes a first SiOCH film and a surface modification layer including an SiOCH film formed by modifying a surface layer of the first SiOCH film, the SiOCH film having a lower carbon concentration and a higher oxygen concentration than the first SiOCH film has. The cap insulating film contacts with surfaces of the metal wiring and the surface modification layer.

The invention relates to a cable (10) having an elongate core (20) made of a first dielectric material and having a core outer surface (25); and a plurality of elongate conducting elements (30) arranged about the elongate core (20). The elongate conducting elements (30) have an inner conductor (40) surrounded by an insulating layer (50) which is made of a second dielectric material. The outer surface of the inner conductor (40) is divided into a first outer surface area (60) and a second outer surface are a (70) and the first outer surface area (60) is attached, for example by sintering, to the core outer surface (25). The first and second dielectric materials are preferably expanded PTFE. The cable (10) finds application in a streamer (100) for use in seismographic surveys of the ocean bottom sub surface.

A multi-layer circuit structure (110) has multiple layers stacked along a vertical direction. Further, at least one cavity region (120) is formed at an edge of the multi-layer circuit structure (110). The at least one cavity region (120) is formed of multiple non-conductive vias from which a dielectric substrate material of the multi-layer circuit structure (120) is removed. Further, the device comprises at least one vertical antenna patch (130) arranged in the at least one cavity region (120).

In a dual damascene process for forming a multi-layer low-k dielectric interconnect, the formation of each layer of interconnect comprises deposition of a first low-k dielectric layer, etching of the first low-k dielectric layer to form two dual damascene vias, formation of two Cu conductor plugs enclosed with barrier layers in the two dual damascene vias, etching of the first low-k dielectric layer between the two dual damascene vias to form a trench, and spin-on of a second low-k dielectric layer filled in the trench. The spin-on low-k dielectric layer is selected to have a dielectric constant smaller than that of the first low-k dielectric layer to reduce the equivalent dielectric constant in the layer of interconnect.

A stacked spacer structure and process adapted for a stacked layer on a semiconductor substrate is described. The stacked spacer structure is formed on the sidewalls of the stacked layer which comprise a conductive layer and a cap layer thereon. A dielectric layer made of a material with low dielectric constant lower than that of silicon nitride is formed on the semiconductor substrate. A first silicon nitride layer is then formed over the substrate. The first silicon nitride layer and dielectric layer are etched sequentially to form an inner spacer on the sidewalls of the stacked layer. A second silicon nitride layer is formed over the substrate and is etched to form an outer spacer on the sidewalls of the inner spacer. By forming the stacked spacer structure of the present invention embedded in low dielectric material, the coupling capacitance produced therein will be greatly reduced.

A dielectric resonator comprising a resonator section and a supporting base section which are made of the same dielectric material as a single unit. The resonator section and the supporting base section have substantially the same outside diameter. A concave section having a trapezoidal cross-sectional shape is provided within the supporting base section such that the inside diameter of the supporting base section becomes smaller in the direction from the end face, which is used as a mounting face, and toward the resonator section.