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764results about How to "Enhanced radiation" patented technology

Reconfigurable data path processor

A reconfigurable data path processor comprises a plurality of independent processing elements. Each of the processing elements advantageously comprising an identical architecture. Each processing element comprises a plurality of data processing means for generating a potential output. Each processor is also capable of through-putting an input as a potential output with little or no processing. Each processing element comprises a conditional multiplexer having a first conditional multiplexer input, a second conditional multiplexer input and a conditional multiplexer output. A first potential output value is transmitted to the first conditional multiplexer input, and a second potential output value is transmitted to the second conditional multiplexer output. The conditional multiplexer couples either the first conditional multiplexer input or the second conditional multiplexer input to the conditional multiplexer output, according to an output control command. The output control command is generated by processing a set of arithmetic status-bits through a logical mask. The conditional multiplexer output is coupled to a first processing element output. A first set of arithmetic bits are generated according to the processing of the first processable value. A second set of arithmetic bits may be generated from a second processing operation. The selection of the arithmetic status-bits is performed by an arithmetic-status bit multiplexer selects the desired set of arithmetic status bits from among the first and second set of arithmetic status bits. The conditional multiplexer evaluates the select arithmetic status bits according to logical mask defining an algorithm for evaluating the arithmetic status bits.
Owner:STC UNM +1

Low voltage drop and high thermal perfor mance ball grid array package

An apparatus and method for a low voltage drop and thermally enhanced integrated circuit (IC) package are described. A substantially planar substrate having a plurality of contact pads on a first surface is electrically connected through the substrate to a plurality of solder ball pads on a second surface of the substrate. An IC die having a first surface is mounted to the first surface of the substrate. The IC die has a plurality of I / O pads electrically connected to the plurality of contact pads on the first surface of the substrate. A heat sink assembly is coupled to a second surface of the IC die and to a first contact pad on the first surface of the substrate to provide a thermal path from the IC die to the first surface of the substrate. The heat sink assembly can also provide an electrical path from the IC die to the first surface of the substrate. The heat sink assembly may have one or two heat sink elements to provide thermal and / or electrical connectivity between the IC die and the substrate.
Owner:AVAGO TECH INT SALES PTE LTD

Operating systems for an RFID tag

In embodiments of the present invention improved capabilities are described for a wireless computing device, comprising an antenna; an analog block for receiving and transmitting an RF signal through the antenna, wherein the energy from the received RF signal provides power to the wireless computing device; and a data processing and controller block for data management, wherein the data processing and controller block comprises: (i) a first program memory adapted to store a first set of instructions comprising a system call adapted to perform at least one function, and (ii) a second program memory adapted to store a second set of instructions comprising an instruction to call the system call, wherein the data processing and controller block is adapted to execute the first set of instructions and the second set of instructions,wherein the antenna, analog block, and data processing and controller block are mounted on a single substrate.
Owner:TEGO INC

Antenna device and wireless communication device

An antenna device includes a feed coil and a sheet conductor. The feed coil includes a magnetic core and a coil-shaped conductor, which is provided around the magnetic core. An RFIC is connected to the feed coil. The sheet conductor has a larger area than the feed coil. A slit that extends from a portion of the edge of the sheet conductor toward the inner side of the sheet conductor is provided in the sheet conductor. The feed coil is arranged such that the direction of the axis around which the feed coil is disposed is parallel or substantially parallel to the directions in which the sheet conductor extends. The feed coil is arranged such that the feed coil is close to the slit and one of coil openings at the ends of the feed coil faces the slit.
Owner:MURATA MFG CO LTD
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