395 results about "Photoacid" patented technology

The present invention relates to a novel photoresist composition that can be developed with an aqueous alkaline solution, and is capable of being imaged at exposure wavelengths in the deep ultraviolet. The invention also relates to a process for imaging the novel photoresist as well as novel photoacid generators.The novel photoresist comprises a) a polymer containing an acid labile group, and b) a novel mixture of photoactive compounds, where the mixture comprises a lower absorbing compound selected from structure 1 and 2, and a higher absorbing compound selected from structure 4 and 5, where, R1 and R2 R5, R6, R7, R8, and R9 are defined herein; m=1–5; X− is an anion, and Ar is selected from naphthyl, anthracyl, and structure 3, where R30, R31, R32, R33, and R34 are defined herein.

Photoacid generators generate sulfonic acids of formula (1a) or (1c) upon exposure to high-energy radiation.R1—COOCH(CF3)CF2SO3+H+  (1a)R1—O—COOCH(CF3)CF2SO3−H+  (1c)R1 is a C20-C50 hydrocarbon group having a steroid structure. The photoacid generators are compatible with resins and can control acid diffusion and are thus suited for use in chemically amplified resist compositions.

A photoactive compound is used in combination with a photosensitizer, represented by the following formula (1): A-[(J)m-(X-Pro)]n (1) wherein A represents a hydrophobic unit comprising at least one kind of hydrophobic groups selected from a hydrocarbon group and a heterocyclic group, J represents a connecting group, X-Pro represents a hydrophilic group protected by a protective group Pro which is removable by light exposure, m represents 0 or 1, and n represents an integer of not less than 1. The protective group Pro may be removable by light exposure in association with the photosensitizer (especially, a photo acid generator), or may be a hydrophobic protective group. The hydrophilic group may be a hydroxyl group or a carboxyl group. The photoactive compound has high sensitivity to a light source of short wavelength beams, for resist application, therefore, the photoactive compound is advantageously used for forming a pattern with high resolution.

A chemically amplified positive resist composition contains (A) an organic solvent, (B) a base resin, (C) a photoacid generator, and optionally, (D) a dissolution rate regulator. The base resin (B) is a hydroxystyrene copolymer having different acid labile groups and Mw of 3,000-300,000. The resist composition is highly sensitive to actinic radiation such as deep-UV, electron beam and X-ray, can be developed with aqueous base to form a pattern, and is thus suitable for use in a fine patterning technique.

Disclosed is a fluorinated sulfonic acid salt or fluorinated sulfonic acid group-containing compound having a structure represented by the following general formula (A).In the formula, n indicates an integer of 1 to 10; R indicates a substituted or unsubstituted C1-C20 linear, branched or cyclic alkyl group, a substituted or unsubstituted C1-C20 linear, branched or cyclic alkenyl group, a substituted or unsubstituted C6-C15 aryl group, or a C4-C15 heteroaryl group; and a indicates 1 or 0. A photoacid generator containing the above fluorinated sulfonic acid salt or fluorinated sulfonic acid group-containing compound shows high sensitivity to an ArF excimer laser or the like, presents no concerns about human body accumulation, can generate an acid (photoacid) of sufficiently high acidity, and exhibits high solubility in a resist solvent and good compatibility with a resist resin.

The present invention relates to a photoresist composition comprising a photoacid generator and at least one novel polymer comprising at least one unit as described by structure 1, where, either (i) R1 is an aliphatic cyclic unit of a polymer, R2 is selected from H, F, (C1-C8)alkyl, (C1-C8)fluoroalkyl, cycloalkyl, cyclofluoroalkyl, and (CR3R4)p(CO)OR5, and Rf is selected from F, H, (C1-C8)alkyl, or a fully or partially fluorinated alkyl, and cyclofluoroalkyl, or (ii) R1 and R2 combine to form an aliphatic cyclic unit of a polymer, and Rf is selected from F, H, (C1-C8)alkyl and a fully or partially fluorinated alkyl, and cyclofluoroalkyl, or (ii) R1 and Rf combine to form an aliphatic cyclic unit of a polymer, and R2 is selected from H, F, (C1-C8)alkyl, (C1-C8)fluoroalkyl, cycloalkyl, cyclofluoroalkyl, and (CR3R4)p(CO)OR5; and, R3 and R4 are independently H, F, (C1-C8)alkyl, (C1-C8)fluoroalkyl, cycloalkyl, cyclofluoroalkyl, (CR3R4)p(CO)OR5, R3 and R4 may combine to form an alkylspirocyclic or a fluoroalkylspirocyclic group, X is selected from (C1-C8)alkylene, (C1-C8)fluoroalkylene, O(C1-C8)alkylene, O(C1-C8)fluoroalkylene, cycloalkyl and fluorinatedcycloalkyl, R5 is H or an acid labile group, m=0-1, and p=1-4. The invention also relates to a process for imaging the photoresist composition of the present invention.

The present invention relates to a photocurable resin composition, wherein the composition comprises:(A) a polyimide resin having one or more primary alcoholic groups with an alcoholic equivalent equal to or less than 3500, said polyimide being soluble in an organic solvent and having a weight average molecular weight of from 5,000 to 500,000; (B) at least one selected from the group consisting of a condensate of an amino compound modified with formalin, optionally further with alcohol, preferably a melamine resin modified with formalin, optionally further with alcohol, and a urea resin with formalin, optionally further with alcohol, and a phenolic compound having, on average, at least two selected from the group consisting of a methylol group and an alkoxy methylol group, and (C) a photoacid generator capable of generating an acid upon irradiation with light of a wavelength of from 240 nm to 500 nm.