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353results about How to "Avoid excessive impact" patented technology

System and method for flexible circuits

InactiveUS6885549B2Reduce problem and difficulty associateReduce resistanceWing accessoriesPrinted circuit aspectsData transmissionGround plane
A flexible printed circuit improves data transfer rates by disposing ground wires in a ground plane proximate to signal wires disposed in a signal channel plane. One or more ground wires is associated with each signal wire pair or each signal wire for imaging of the return currents of the signal pairs. An overlapping alignment minimizes loop area between a ground wire and its associated signal wire. An offset alignment provides a reduced loop area and reduced breakage risk since movement of the flexible circuit does result in compression of the signal wire and its associated ground wire. A combination of overlapping and offset alignment balances signal transfer effectiveness with breakage risk by offsetting ground and signal wires is stress sensitive regions and overlapping ground and signal wires in stress tolerant regions. In one embodiment, the flexible circuit interfaces a portable computer with a display lid to support high-speed display signals with reduced breakage risk from cycling the display lid between an open and closed position.
Owner:DELL PROD LP

Apparatus and method for processing a crop residue

An apparatus and method for processing a crop residue, which includes but is not limited to, destroying weed seeds present in the crop residue. The apparatus (10) comprises an elongate housing (12) having an inlet (20) for receiving crop residue N and an outlet (22) for discharging the crop residue. The apparatus (10) also has one or more rotors (24), (26) located in the elongate housing (12). Each rotor (24), (26) comprises a plurality of radially extending impact members (28a), (28b), (28c), (28d), (28e), (28f) which rotate with the one or more rotors (24), (26) and impact against the crop residue, so that lighter material of the crop residue is subjected to less impacts and denser material of the crop residue is subjected to relatively more impacts.
Owner:TECFARM PTY LTD
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