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228results about How to "Resist formation" patented technology

Applications of light-emitting nanoparticles

A method for the production of a robust, chemically stable, crystalline, passivated nanoparticle and composition containing the same, that emit light with high efficiencies and size-tunable and excitation energy tunable color. The methods include the thermal degradation of a precursor molecule in the presence of a capping agent at high temperature and elevated pressure. A particular composition prepared by the methods is a passivated silicon nanoparticle composition displaying discrete optical transitions.
Owner:KORGEL BRIAN A +1

Effervescence injector for an aero-mechanical system for injecting air/fuel mixture into a turbomachine combustion chamber

A fuel injector for an aero-mechanical injection system for injecting an air / fuel mixture into a turbomachine combustion chamber, the injector comprising a main tubular structure of axis XX′ opening out at a downstream end for delivering the air / fuel mixture, a tubular fuel duct that is disposed inside the main structure and that opens out into the main structure via a fuel atomizer plug so as to introduce fuel into the main structure at a pressure PC into the main structure, at least one air feed channel that opens out into the main structure so as to introduce air at a pressure PA therein, and means for injecting into the fuel duct a gas at a pressure PG that is greater than PA and greater than or equal to PC so as to create effervescence in the fuel on being introduced into the main structure.
Owner:SN DETUDE & DE CONSTR DE MOTEURS DAVIATION S N E C M A

Method using multi-component colloidal abrasives for CMP processing of semiconductor and optical materials

A method is provide for using abrasive colloidal particles having multi-component composition comprising mixed 1) metal or metalloid oxides, 2) oxyfluorides, or 3) oxynitrides, each grouping (1, 2, or 3) individually alone or in combination thereof, in a chemical-mechanical manufacturing process for planarizing or polishing metal, semiconductor, dielectric, glass, polymer, optical, and ceramic materials. The particles exhibit a modified surface chemistry performance and have an isoelectric point (pH.sub.IEP) greater than the pH of the dispersed particles in solution, and with a stabilized particle dispersion at pH values of interest for CMP operations. The composition of the multi-component particles may be adjusted as desired, in regard to their chemical or physical properties such as surface chemistry, hardness, solubility, or degree of compatibility with the workpiece material being planarized or polished. Also provided is a chemical-mechanical planarization slurry mixture incorporating such multi-component particles and with a solution chemistry that enhances the CMP effects by in-part adjusting the pH of the solution away from the pH.sub.IEP of the media to maximize dispersion.
Owner:CORNING INC
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