756results about How to "Good heat dissipation" patented technology

A semiconductor device and package has a heat spreader directly disposed on the reverse surface of the semiconductor device. This heat spreader includes a diamond layer or a layer containing diamond and ceramics such as silicon carbide and aluminum nitride. The heat spreader is directly formed on a substrate for the semiconductor device. In particular, the heat spreader is composed of a diamond layer and one or two metal or ceramic members, which are bonded to the diamond layer with one or two polymer adhesive layers. This diamond layer has a fiber structure across the thickness or a microcrystalline structure. Cilia are formed on a surface of the diamond layer facing the one or two metal or ceramic members.

A light emission apparatus that can restrict deterioration of resin used for the light emission apparatus, and that has a reasonable structure fit for actual use is provided, in which a light reflective layer is provided to cover the side surfaces of the chips 26 provided in the concave 2a. According to this, excitation light reflected by the phosphor layer 32, such as ultraviolet light, is reflected again by the light reflective layer 27. Therefore, the excitation light will not reach the resin layer 21, thereby restraining the deterioration of the resin. Moreover, the light reflective layer 27 covers the side surfaces of the chips 26, thereby efficiently conducting the heat emitted from the chips 26 to the metal substrate 20 via the resin layer 21. This improves the heat-dissipation efficiency of the chips 26.

A substrate includes a plurality of through electrodes. The through electrode has a nanocomposite structure including a nm-sized carbon nanotube and is a casting formed by using a via formed in the substrate as a mold.

In a method for manufacturing a compound semiconductor device, a principal surface of a SiC wafer, on which a compound semiconductor device is located, is bonded to a support substrate with an adhesive having a softening point higher than 200° C. A via hole is formed dry etching, including supplying a fluorine-containing etching gas to a rear side of the SiC wafer. Thereafter, the support substrate and the adhesive are removed. Preferably, the adhesive is formed by reacting one material coating the principal surface of the SiC wafer, and another material coating the support substrate.

In a shielded reflective LED, each of light sources can be surface-mounted substantially without being influenced by heat distortion based on the difference in thermal expansion coefficient between resin and metal because the light source is so small-sized that only one light-emitting element is sealed with a resin. Moreover, variations in luminous intensity and chromaticity of each of light-emitting elements used in three-color light sources can be examined in advance. Hence, well-matched three-color light sources can be mounted in combination so that display unevenness of a full color display can be reduced greatly. Further, the surface of the substrate portion on which the light source is fixed is silk-screen-printed in black. Hence, external light which enters the device through the optical opening portion when the device is turned off is reflected by the reflecting mirror and absorbed to the surface of the substrate portion. As a result, pseudo-lighting in which external light is radiated out again through the optical opening portion can be prevented thoroughly, so that contrast between light when the device is turned on and light when the device is turned off can be made high.

A heat dissipation device with a fluid cavity that utilizes a hybrid of star pins with concave surfaces and sharp edges, and truncated dimples, which creates turbulence and a vortex phenomenon perpendicular to fluid flow transmission, and increases the heat transfer coefficient without increasing restriction of fluid flow through the device. This process increases the heat transfer along local pins which are located around each truncated dimple. This effect allows the use of taller pins than previous devices thus increasing the surface of heat transfer and thus these pins have a more efficient heat transfer coefficient along the total length of the pin, not possible previously. Star pins with sharp edges prevent the distortion of the highly efficient vortex flow which increases fluid flow and simultaneously intensifies the desired phenomena of extraordinary turbulence.

The invention provides a fabrication method of an LED package for easily fabricating LED packages of excellent heat radiation characteristics. In the method, a metallic package substrate having a recess and a reflecting surface formed in the recess is prepared, and the package substrate is selectively anodized and divided into two package electrode parts divided from each other. Then, an light emitting device is mounted on the bottom of the recess. Preferably, the package substrate is a metal substrate made of Al or Al-based metal.

The storage cell comprises a flat roll electrode that includes a strip of positive electrode having a positive electrode current collector foil and a positive electrode layer formed thereon, a strip of negative electrode having an electrode current collector foil and a negative electrode layer formed, and a strip of electrically insulated separator, the strip of positive electrode and the strip of negative electrode being wound into a flat roll configuration with the strip of electrically insulated separator sandwiched therebetween; a sealed casing that hermetically seals the flat roll electrode impregnated with an electrolyte; a positive terminal and a negative terminal each electrically insulated from the sealed casing, connected to the positive current collector foil and the negative current collector foil, respectively.

To provide a display device with high reliability, which is capable of supporting a display panel well even when the display panel is enlarged, and capable of radiating the heat generated in the display panel well. A display device 100 of the present invention has an organic EL panel (display panel) 150 and a reinforcing structure 160 provided on the backside of the display panel 150. The reinforcing structure 160 comprises a base plate 161 forming a part adhered to a back face of the organic EL panel 150, and a heat radiation member 170 provided on the base plate 161.

The invention relates to a multiple-disc type magnetorheological brake which mainly comprises a transmission shaft, a wheel hub, a drive friction plate group, a driven friction plate group, inner and outer magnetic isolation rings, an exciting coil with a U-shaped iron core, magnetic-conducting side plates and a magnetic isolation casing. A sealing ring is used for sealing magnetorheological fluid between the drive friction plate group and the driven friction plate group; the drive friction plate group and the driven friction plate group are respectively sleeved on the magnetic isolation rings and the wheel hub through splines; the drive friction plate group is separated from the driven friction plate group by the inner magnetic isolation ring and the outer magnetic isolation ring; the exciting coil with the U-shaped iron core is directly spliced in iron core jacks of the magnetic conducting side plates; and the braking torque can be changed through changing the current intensity of the coil. When the braking torque is not enough, the quantity of friction plates can be increased or the quantity of the exciting coil with the U-shaped iron core can be increased to adapt to the big torque braking. The multiple-disc type magnetorheological brake has the advantages that the structure is compact, the braking torque is big, the assembly and the disassembly are convenient, the coil is easily used for radiating the heat, and the number of turns wounded by the coil is more.

A surface light source system 50 capable of emitting light without producing non-uniform luminance and non-uniform color distributions is provided. The surface light source system 50 comprises a lenticular lens sheet 14-1 having unit lenses 141-1 with convexity on the light-exiting side, and a light source unit 100 having emission sources 101 of two types or more that are different in the wavelength range of light they emit. The unit lenses are arranged in one direction at approximately regular intervals. Emission sources of each type are arranged in the one direction at approximately regular intervals. The intervals at which the respective emission sources of two types or more arranged in the one direction are nearly the same in length.

The present invention is to provide a double-sided thermally enhanced IC chip package which includes a chip being received in an opening of a substrate and electrically connected to a conductive circuit pattern on a top surface of the substrate through bonding wires. A thermally and electrically conductive planar member is attached to an inactive side of the chip through a thermally and electrically conductive adhesive layer. A portion of an active side of the chip to which the bonding wires are connected is encapsulated by a dielectric encapsulant, and the other portion of the active side of the chip is covered by a thermally and electrically conductive encapsulant. Thus, heat generated by the chip can be efficiently dissipated through the planar member and the thermally and electrically conductive encapsulant. The present invention also discloses a stacked chip package with double-sided heat dissipation capability.

Provided is a heat conductive silicone grease composition including (A) 100 parts by mass of an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing 2 or more hydrogen atoms bonded to silicon atoms within each molecule, in sufficient quantity to provide from 0.1 to 5.0 hydrogen atoms bonded to silicon atoms within the component (B) for each alkenyl group within the component (A), (C) 100 to 2,200 parts by mass of a heat conductive filler, (D) an effective quantity of a platinum-based catalyst, and (E) an effective quantity of an addition reaction retarder, in which the component (C) includes more than 90% by mass and no more than 100% by mass of an indium powder with an average particle size of 0.1 to 100 μm. Also provided is a heat conductive silicone cured product obtained by curing the above composition by heating at a temperature equal to, or greater than, the melting point of the indium powder. Further provided is an electronic device including an electronic component, a heat radiating member, and a heat conductive member including the above cured product disposed between the electronic component and the heat radiating member. Still further provided is a method of curing the above composition. Even further provided is a method of forming a heat conductive member between an electronic component and a heat radiating member. The above heat conductive silicone grease composition generates a suitably thin cured product with excellent thermal conductivity that prevents problems such as the contamination of components other than the coated component, and the leakage of oily materials from the product if used over extended periods.

A light emitting device comprises:

• • a light emitting element (20);
  • a first metal board (11) that includes a mount portion (111) on which the light emitting element (20) is mounted and a reflection portion (112) which is formed outside the mount portion (111) to reflect light from the light emitting element (20);
  • a second metal board (12) that is electrically connected to the light emitting element (20) via a wire (50);
  • a metal plated layer (15) that is formed on a surface of the metal boards (11), (12); and
  • a seal resin (40) that is formed on the metal boards (11), (12) to seal at least the light emitting element (20); wherein
  • at least the reflection portion (112) is provided with a protection layer (35) which is lower than the seal resin (40) in gas permeability, is transparent or has a reflectance near the metal plated layer (15).