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690results about How to "Improve heat dissipation" patented technology

LED retrofit luminaire

A retrofit light emitting diode (LED) lighting luminaire designed to have detachable and replaceable components for convenience and low cost in the luminaire maintenance including a heat dissipation member that includes detachable upper and lower sections with aligned radially extending fins, and a driver retained within the luminaire. The LED chip is retained against a surface of the lower heat dissipation member so that heat from the LED is transmitted to the radially extending fins to thereby effectively cool the LED lighting source and driver.
Owner:RASHIDI HAMID

Stackable electronic assembly

On implementation of the invention provides a stackable chip-scale package for improving memory density that may be mounted within a limited area or module. A novel staggered routing scheme enables the use of the same trace routing at every level of the stacked architecture for efficiently accessing individual memory devices in a chip-scale package stack. The use of a ball grid array chip-scale package architecture in combination with thermally compatible materials decreases the risk of thermal cracking while improving heat dissipation. Moreover, this architecture permits mounting support components, such as capacitors and resistors, on the chip-scale package.
Owner:SANMINA-SCI CORPORATION

Solid-state lighting device

A solid-state lighting device (500) includes a plurality of light-emitting elements (510, 525, 530) configured for generating light that are thermally coupled to a heat spreading chassis configured for coupling to one or more heat sinks (520). The lighting device further includes a mixing chamber which is optically coupled to the plurality of light-emitting elements and configured to mix the light emitted by the plurality of light-emitting elements. A control system is operatively coupled to the plurality of light-emitting elements, and configured to control operation of the plurality of light-emitting elements.
Owner:SIGNIFY HOLDING B V

Package structure of compound semiconductor device and fabricating method thereof

A package structure of a compound semiconductor device comprises a thin film substrate, a die, at least one metal wire and a transparent encapsulation material. The thin film substrate comprises a first conductive film, a second conductive film, and an insulating dielectric material. The die is mounted on the surface of the first conductive film, and is electrically connected to the first conductive film and the second conductive film through the metal wire. The transparent encapsulation material overlays the first conductive film, second conductive film, and die. The surfaces of the first conductive film and second conductive film which is opposite the transparent encapsulation material act as electrodes. The insulating dielectric material is between the first conductive film and second conductive film.
Owner:ADVANCED OPTOELECTRONICS TECH

Semiconductor package device, semiconductor package structure, and fabrication methods thereof

A semiconductor package device, a semiconductor package structure, and fabrication methods thereof are provided, which mainly includes disposing a plurality of semiconductor chips on a wafer formed with TSVs (Through Silicon Vias) and electrically connecting the semiconductor chips to the TSVs; encapsulating the semiconductor chips with an encapsulant; and disposing a hard component on the encapsulant. The hard component ensures flatness of the wafer during a solder bump process and provides support to the wafer during a singulation process such that the wafer can firmly lie on a singulation carrier, thereby overcoming the drawbacks of the prior art, namely difficulty in mounting of solder bumps, and difficulty in cutting of the wafer.
Owner:SILICONWARE PRECISION IND CO LTD

Photoactivation device and method

A photoactivation apparatus (200) separately delivers light to a plurality of wells of a multiwell plate (110). The device-includes a plurality of light emitting diodes (210) attached to a first surface of a substrate (220) such that when the photoactivation apparatus is positioned on the multiwell plate each of the light emitting diodes delivers light to one corresponding well. The light emitting diodes (210) may extend at least partially into the wells of the multiwell plate. A heat sink (250) and fan may be provided on the device to dissipate heat generated by the light emitting diodes. The components are preferably enclosed in a conveniently-sized housing (270). The housing may include one or more grips and air vents. The apparatus includes an interlocking lip (230) defining a recess which is sized to receive at least a portion of the multiwell plate. A power supply connected to the apparatus and configured to provide an equal voltage across each of the light emitting diodes.
Owner:VIROLOGIC INCORPORATED

Tape carrier package and display device including tape carrier package

Heat dissipation, is improved, of a semiconductor device on a tape carrier package, in which the number of outputs of the semiconductor device has been increased for implementing a multi-channel configuration and narrower pitches are employed. There are included a tape carrier 20 having lead patterns 21 to 24 formed on a tape base 28 thereof, and a semiconductor device 10 mounted on the tape carrier 20 and having electrode patterns 11 to 14 disposed thereon. The semiconductor device 10 includes heat dissipating electrode patterns 15 to 17 at positions where the heat dissipating electrode patterns 15 to 17 do not interfere with the electrode patterns 11 to 14. The lead patterns 21 to 24 are electrically connected to the corresponding electrode patterns 11 to 14, respectively. On the tape carrier 20, heat dissipation patterns are formed. The heat dissipation patterns are disposed at positions where the heat dissipation patterns do not interfere with the lead patterns 21 to 24 and are also electrically and thermally connected to the corresponding heat dissipating electrode patterns 15 to 17, respectively.
Owner:RENESAS ELECTRONICS CORP

Lighting device with a LED and an improved reflective collimator

The invention relates to a lighting device (1) comprising a housing (8) with a light source connector for a LED (11) and a reflective collimator (3) and a refractive collimator (9) as well as to a method for their manufacture. The reflective collimator (3) comprises a plurality of reflective segments (4, 4′, 5, 5′, 6, 6′, 7, 7′), which are spaced apart from each other by means of air slits suitable for dissipation of heated air. The segments (4, 4′, 5, 5′, 6, 6′, 7, 7′) are adapted to reflect laterally emitted light generated by the light source (11) towards a direction which is substantially parallel to said main direction. Lighting devices according to this invention may have a compact design and an improved dissipation of the heat generated by the LEDs.
Owner:KONINKLIJKE PHILIPS ELECTRONICS NV

Heat dissipation power distribution cabinet

The invention discloses a heat dissipation power distribution cabinet comprising a cabinet body of heat dissipation power distribution cabinet, wherein an air inlet of heat dissipation power distribution cabinet is formed in the top of the cabinet body of heat dissipation power distribution cabinet, an air inlet cover is arranged at the air inlet, heat dissipation windows of heat dissipation powerdistribution cabinet are arranged on two side walls of the cabinet body of heat dissipation power distribution cabinet, heat dissipation window covers are arranged at the heat dissipation windows, afan of heat dissipation power distribution cabinet is arranged at the heat dissipation window of heat dissipation power distribution cabinet on one side, the fan of heat dissipation power distributioncabinet is located in the cabinet body of heat dissipation power distribution cabinet, an air outlet of heat dissipation power distribution cabinet is formed in the bottom of the cabinet body of heatdissipation power distribution cabinet, a metal screen of heat dissipation power distribution cabinet is arranged at the air outlet of heat dissipation power distribution cabinet, and a cabinet doorheat dissipation power distribution cabinet is arranged on the cabinet body of heat dissipation power distribution cabinet. The heat dissipation power distribution cabinet disclosed by the invention can solve the problem that the service lives of circuit components in the power distribution cabinet are shortened due to poor heat dissipation.
Owner:湖州旭源电气科技有限公司

Ejector assisted slab-type loop heat pipe

The invention discloses an ejector assisted slab-type loop heat pipe which comprises a main loop and a bypath loop; in the main loop, a capillary core in an evaporator is connected with a gas collection channel; an overheating gaseous working medium at an outlet of the gas collection channel injects a saturated gaseous working medium from a compensating chamber through an ejector; the mixed gaseous working medium is connected with an inlet of a condenser by a gas line pipeline; an outlet of the condenser is connected with an inlet of the compensating chamber by a liquid line pipeline; the compensating chamber and the capillary core are longitudinally processed together; the capillary core, the gas collection channel and the compensating chamber are wrapped in a housing of the evaporator; in the bypass loop, a saturated gaseous working medium generated from liquid gasification by absorption of heat leakage in the compensating chamber passes through a regulating valve and then enters the ejector; and through changing the opening of the regulating valve, the flow of the saturated gaseous working medium gasified in the compensating chamber due to different heat leakage quantity is ensured to be led away. The ejector assisted slab-type loop heat pipe is an economical, effective, and feasible improvement scheme, and the performance of the loop heat pipe can be improved effectively.
Owner:XI AN JIAOTONG UNIV

Junction box for solar modules

The invention relates to a junction box which safely dissipates heat produced by electrical / electronic components assembled in the box. The junction box has a housing with cover and at least one component chamber that juts out from a side wall of the housing. The component chamber has cooling fins. An electric or electronic component, sheathed in insulation, is inserted into the component chamber, such that it fits firmly against the walls of the chamber. The cover has cooling fins and overhangs the body of the housing and the component chamber in several areas. The construction of the junction box with the component chambers that jut out from the body and the housing cover with overhang enhance heat dissipation and allow the box to be used with solar modules in which bypass flows up to 16 A and greater occur.
Owner:FPE FISCHER GMBH

Projection lighting apparatus for marking and demarcation

A projection lighting apparatus is disclosed for marking and demarcation applications in airports, waterways, and industrial environments. The lighting apparatus comprises a plurality of high intensity LEDs with their output coupled to the input ends of a plurality of optical fibers. The output ends of the optical fibers are packaged to form a desired illumination pattern. The illumination pattern is projected onto the target surface through a secondary optical system for marking and demarcation enhancement.
Owner:BWT PROPERTY

Stator used for motor, motor and ventilation cooling method of motor

The invention provides a stator used for a motor, the motor and a ventilation cooling method of the motor. The stator used for the motor comprises concentrated windings and at least two wedge blocks arranged at the gaps between the adjacent concentrated windings. The at least two wedge blocks are distributed on the concentrated windings in a staggered mode to form a first ventilation path. According to the stator used for the motor, the motor and the ventilation cooling method of the motor, the concentrated windings can be cooled effectively, the concentrated windings are effectively constrained in the circumferential direction through the at least two wedge blocks, the service life of the motor is further prolonged, and the reliability of the motor is improved.
Owner:XINJIANG GOLDWIND SCI & TECH

Terahertz quantum cascade laser device structure and production method thereof

The invention provides a terahertz quantum cascade laser device structure and a production method thereof. The terahertz quantum cascade laser device structure at least comprises a ridge waveguide structure, wherein the ridge waveguide structure comprises a semi-insulating GaAs substrate, a GaAs buffer layer, a lower contact layer, an active region, an upper contact layer, a heat-conducting insulating layer, an upper metal layer and a lower metal layer. By depositing the heat-conducting insulating layer and covering metal on the side surface of the device, a transverse heat dissipation channel is provided for a device, so that the device has stronger heat dissipation capability compared with THz QCL uncovered by metal on the sidewall. A flip chip packaging method is adopted, and a supporting substrate adopts a high heat-conductivity material such as silicon, so that the heat dissipation capability of the supporting substrate is improved compared with the normal semi-insulating GaAs substrate for packaging the device, and the supporting substrate has a relatively large electrode area and also is favorable for the heat dissipation of the device. The novel structure is used for improving the temperature characteristics and the energy efficiency of THz QCL, thus being favorable for working in a continuous or high-duty-cycle pulse state; the device can be produced by a standard semiconductor process, and the production method of the device is suitable for industrial mass production.
Owner:SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

Wheeled crane and hydraulic oil cooling system and control method thereof

The invention discloses a wheeled crane and a hydraulic oil cooling system and control method thereof. The disclosed cooling system comprises a radiator, a power part driving the radiator, a detection part, a control part and an execution part, wherein the detection part is used for detecting the temperature of hydraulic oil; the control part receives a temperature signal of the hydraulic oil, compares the temperature with the preset temperature, and generates a control signal according to the comparison information; and the execution part controls the power part to work or stop according to the control signal. By the coordinated operation of the detection part, the control part and the execution part, the radiator can be automatically started or stopped, so as to enable the temperature of the hydraulic oil to be always maintained in the preset temperature range, reduce the possibility of super high temperature, simultaneously prolong the service life of the hydraulic elements of the system and give play to the optimum heat dissipation function of the cooling system. At the same time, the start or stop of the radiator can be automatically controlled, thus the work of operators can be reduced, the dependence of the system safety on the manual operation can be reduced and the safe reliability of the system can be improved.
Owner:XUZHOU HEAVY MASCH CO LTD

Vertical convector radiator and vertical convector radiating down lamp

The invention discloses a vertical convector radiator and comprises a vertical convector radiating down lamp of the vertical convector radiator. The vertical convector radiator comprises light source installation parts and a plurality of heat radiating fins of which the lower ends are connected with the light source installation parts in a heat conducting mode, wherein the vertical convector radiator comprises a plurality of convection passageways which penetrates through and is vertical to the upper surface and the lower surface of the convector radiator. When the vertical convector radiator in the technical scheme adopted operates, the lower end of the heat dissipation rectangular fin continuously heats the neighbouring air and the air rises, simultaneously, the neighbouring cold air can continuously complement to generate convection, thus the vertical convector radiator of the specific implement method can form a higher air velocity field even under the passive voice radiating condition, full heat exchange is generated between the cold air and the heat dissipation rectangular fin surface of the vertical convector radiator, the heat is rapidly take away, thereby avoiding the generation of the heat island effect in the bottom of the radiator, and the heat dissipation capacity is greatly improved.
Owner:KINGSUN OPTOELECTRONIC CO LTD

Display device with improved heat dissipation

A display device comprising a display panel for displaying an image, a chassis base coupled to the display panel to support the display panel, the chassis base having at least one chassis base hole, and at least one reinforcing member formed on the chassis base such that the at least one reinforcing member covers the at least one chassis base hole.
Owner:SAMSUNG SDI CO LTD

Motor for dust collector

The present invention provides a vacuum cleaner motor which comprises a housing, a stator core, a rotor core, fixed impeller, wind cover, dynamic impeller, stator winding, rotor winding and a heat radiation fan, wherein the heat radiation fan is fixed on a output shaft between bearing and a commutator; gap is left between outer edge of the excircle of fan blade of the heat radiation fan and wall of inner circumference. The design proposal can, on one hand, blow cold wind to the commutator, the rotor winding, the stator winding and a carbon brush assembly directly, on the other hand make the rotor winding, the commutator and the heat radiation fan move in dynamic balance with heat radiation structure simple and heat radiation effect very good, also service life and use security of the dry & wet vacuum cleaner can be effectively enhanced.
Owner:CINDERSON TECH (SUZHOU) CO LTD

Semiconductor packaging structure and forming method thereof

The invention discloses a semiconductor packaging structure and a forming method thereof. The semiconductor packaging structure comprises a radiating fin frame and a lead frame, wherein the radiating fin frame is connected with a radiating fin, a chip is stuck on a chip holder of the lead frame, the radiating fin is connected with the chip through a combining material, the lead frame is provided with a first pin, and second pins and a third pin are arranged on the radiating fin frame. The forming method of the semiconductor packaging structure comprises the following steps: the second pins and the third pin are arranged on the radiating fin, the first pin is connected with a bottom electrode of the chip holder as a current input end; three second pins on the radiating fin frame are connected with an electrode on the upper surface of the chip as current output ends; the third pin on the radiating fin frame is welded with a lead as a current control end, so that application of the lead is greatly reduced, a work flow is reduced and the heat dissipation is accelerated; after injection molding, colloids are exposed on the two faces of a semiconductor, so that the double-faced heat dissipation is realized, and a radiating function of the semiconductor is improved.
Owner:GREAT TEAM BACKEND FOUNDRY (DONGGUAN) LTD

Oil bath-based natural circulation and heat pipe-coupled battery pack thermal management system

An oil bath-based natural circulation and heat pipe-coupled battery pack thermal management system relates to an automotive battery thermal management system. The invention aims to solve the problem that overlying heating and dried-up electrolyte of a present power battery pack lead to swelling, fire breakout and explosion of the power battery pack. The oil bath-based natural circulation and heat pipe-coupled battery pack thermal management system contains multiple heat pipes and multiple circulating pipes. A single battery adopts vacuum seal. An evaporator section of each heat pipe is arranged inside a power battery box, and a condensation section of the heat pipe passes through the top cap of the box body to be arranged outside the power battery box. A phase-change material is arranged inside the heat pipe. Residual space of the power battery box is filled with transformer oil. Left and right walls of a housing are both provided with multiple circulating pipes. One end of each circulating pipe is communicated with the upper part of the housing, and the other end of the circulating pipe is communicated with the lower part of the housing. Thus, natural circulation of transformer oil is formed. The system provided by the invention is used for power battery thermal management.
Owner:HARBIN INST OF TECH AT WEIHAI
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