2475 results about "Radiation effect" patented technology

The present invention provides methods of using metal nanoparticles 0.5 to 400 nm in diameter to enhance the dose and effectiveness of x-rays or of other kinds of radiation in therapeutic regimes of ablating a target tissue such as tumor. The metal nanoparticles can be administered intravenously, intra-arterially, or locally to achieve specific loading in and around the target tissue. The metal nanoparticles can also be linked to chemical and / or biochemical moieties which bind specifically to the target tissue. The enhanced radiation methods can also be applied to ablate unwanted tissues or cells ex vivo.

A virtual grid imaging method capable of eliminating scattered radiation effect and an imaging system thereof for imaging with high energy rays, in which scattered rays reaching a surface of a detector are not filtered, and data of the scattered rays and straight rays are all sampled. The method includes decomposing a digital image into multi-band images from high to low according to frequencies; performing de-scattering process for low-frequency band images; performing contrast enhancement process for high-frequency band images; and merging the images of various frequency bands processed in the second and third steps, and forming an output image. In digital X-ray imaging the scattered radiation effect is eliminated. Significant reduction of the dosage of the rays, in which only one third of the required dosage of a common grid is used to obtain the same image brightness.

The invention relates to an LED (Light Emitting Diode) surface patch type encapsulating structure based on a silicon base plate, which comprises the silicon base plate, an LED chip, a circular ring convex wall and a lens, wherein the upper surface of the silicon base plate is a plane structure, an oxidation layer is covered on the upper surface of the silicon base plate, a metal electrode layer is arranged on the upper surface of the oxidation layer, the upper surface of the metal electrode layer is provided with metal convex points, a through hole penetrating through the silicon base plate is arranged below the metal electrode layer, an insulation layer covers the inner wall of the through hole and the partial lower surface of the silicon base plate, a metal connecting layer covers the surface of the insulation layer in the through hole, two electric conducting metal welding discs are respectively arranged at the lower surface of the silicon base plate and are insulated from the silicon base plate, a heat conducting metal welding disc is arranged at the lower surface of the silicon base plate, the LED chip is inversely arranged on the silicon base plate, and the LED chip and the metal electrode layer in the LED chip are isolated from the outside through the circular ring convex wall and the lens. The encapsulating structure has the advantages of good heat radiation effect and small size, also has high reliability because of no gold thread encapsulation, realizes the wafer level mass production encapsulation and hereby reduces the encapsulation cost.

A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.