The invention discloses a multi-ring-arranged double-
integrated circuit (IC)
chip packaging piece and a production method thereof. The multi-ring-arranged double-IC
chip packaging piece comprises a multi-ring quad flat no (QFN)
lead frame with a carrier, an internal pin, IC chips and a plastic
package body. The production method comprises the following steps of:
thinning; scribing; adding the chips primarily; performing pressure
welding; inversely adding the chips secondarily; filling the bottom and solidifying; performing
plastic packaging and post solidifying; printing; separating pins;
electroplating; separating products; testing the products; packing; and warehousing. Compared with a single-row
lead frame with the same area as the multi-ring QFN
lead frame, the multi-ring QFN lead frame increases the pins by over 40 percent, so that the requirements of
high density and
multiple input / output (I / O) packages are met; the chips are inversely added, so that the packaging piece has a small number of short
welding lines, a short heat conduction distance and
high radiation capacity; through the inverse addition of the chips, the
capacitance and the
inductance between protruding points and the pins are far lower than those of the
welding lines between a
chip welding disc and the pins, so that the influence on
high frequency application is reduced; and the thickness of a QFN can be reduced to be below 0.5mm, so that the intersection and the open circuit of the welding lines are avoided and testing qualified rate and
testing reliability are improved.