390results about How to "Increase heat radiation" patented technology

An LED lighting device comprises: a thermally conducting body having an at least one opening that connects with a cavity within the body and a plurality of LEDs mounted in thermal communication with a face of the body and positioned around the opening. One or more passages pass through the body from the cavity to an outer surface of the body and are configured such that in operation air moves through the cavity by thermal convection thereby to provide cooling of the body. Each passage is configured in a direction that extends in a direction at an angle of about 45° to a line that is parallel with the axis of the body toward the outer surface of the body away from the face. The body can be configured such that its outer surface has a form factor resembling an incandescent light bulb or halogen reflector lamp.

A light emitting device that can provide enhanced heat radiation as well as allowing light from a light emitting diode (LED) chip to be efficiently extracted out of the device. This light emitting device includes a metal plate (11) that is made of aluminum. The metal plate (11) has a projection (11a) projecting forward. The projection (11a) has a front side provided with a housing recess (11b). An LED chip (1) is mounted on the bottom of the housing recess (11b) so that it is thermally coupled to the metal plate (11), thus allowing heat to be radiated efficiently. A printed circuit board (12), having a grass epoxy substrate to be joined to the front surface of the metal plate (11), is provided with an insertion hole (13) into which the projection (11a) is inserted. The LED chip (1) and a bonding wire (W) are encapsulated in a transparent resin seal portion (50). The side wall of the housing recess (11b) that is part of the metal plate (11) functions as a reflector for reflecting forward light emitted from the LED chip (1). Thus, light from the LED chip (1) can be extracted efficiently.

An engine control circuit device which has higher heat resistance and can be installed in a place exposed to severe thermal environments. In an engine control circuit device comprising a circuit board on which a plurality of packaged electronic parts are mounted, and a connector mounted on the circuit board for connection to an external circuit, the device further comprises a resin portion formed of a thermo-setting resin and covering the connector except for a connecting portion thereof and the circuit board, and a cooling pipe integrally molded in the resin portion and allowing a coolant to flow through it, thereby cooling the resin portion.

In order to provide a semiconductor apparatus in which both semiconductor chips and interposers are provided on a carrier tape, electrical properties can be improved using short wiring in a wiring pattern substantially symmetric with respect to the semiconductor chips, production can become easier, and compactness and heat radiation can be improved. Semiconductor chips electrically connected to wiring formed on the carrier tape, and interposers on the carrier tape and surrounding the semiconductor chips, are provided next to each other.

It is an object of this invention to provide an alternator for a vehicle in which all electric conductors forming bridge portions are sufficiently exposed to cooling winds so that the cooling performance is remarkably improved. It is another object of this invention to provide an alternator for a vehicle which is excellent in cooling performance, insulating characteristic, and heat resisting property. An alternator for a vehicle includes a stator. The stator includes an iron core 22, an electric conductor 21, and an insulator 23. The electric conductor 21 forms a winding on the iron core 22. The insulator 23 provides electric insulation between the electric conductor 21 and the iron core 22. The stator is supported by a housing. The dimension of openings of slots in the iron core 22 is smaller than the distance between inner side surfaces of the slots. The electric conductor 21 has accommodated portions accommodated in the slots, and bridge portions connecting the accommodated portions. Pieces of the electric conductor which extend out of the slots are approximately separated into a conductor groups 21f located on outer radial sides of the slots and a conductor group 21g located on inner radial sides of the slots, and form the bridge portions. Predetermined gaps are provided between pieces of the electric conductor in the bridge portions. The bridge portions have ridge portions inclined in a same circumferential direction in each of the outer radial side and the inner radial side, and top portions connecting the ridge portions along an axial and radial direction.

An FPC includes: a base film including a first metal sheet; a first adhesive layer laminated on one of surfaces of the base film; and a conductor pattern bonded by the first adhesive layer; wherein a plurality of planar portions held in a planar shape and bending portions to be bent provided between the planar portions are arranged in a longitudinal direction, and the conductor pattern is covered by a metal support cover film including a second metal sheet and a second adhesive layer at the planar portions and is covered by a solder resist at the bending portions.

The invention relates to heat insulating and energy saving coating used for the vehicle, and the preparation method thereof. The invention takes organic resin film forming material as the main material, the coating at least includes infrared reflection pigment, hollow ceramic micro-spheres and silicon dioxide aerogel, an organic resin film having low sunlight absorption rate is formed in the coating through the organic resin film forming material with high transparency, the visible light and the near infrared ray in the sunlight are reflected through the infrared reflection pigment, the rutile type titanium dioxide and the hollow ceramic micro-spheres, and simultaneously a compact vacuum layer and an inert gas layer are formed on the surface of a coated object through the hollow ceramic micro-spheres and the silicon dioxide aerogel, so as to effectively isolate the radiant heat of the sun, and to reduce the heat conduction of air, and finally the heat insulating and energy saving coating used for the vehicle is formed, which not only can effectively reflect the energy in the sunlight, but also can effectively isolate the radiant heat of the sun and reduce the heat conduction of air, and simultaneously has good weather resistant performance, chemicals resistant performance, mechanical property and decorative property.

A lighting apparatus including a base with a coupling rim and a supporting plate and a housing coupled to the coupling rim such that the supporting plate is covered. The housing includes a channel part to guide air in and an air introduction hole to introduce the guided air into an inner space of the housing. A cooling fan is included and is disposed on an upper surface of the supporting plate covered by the housing, wherein the cooling fan draws air introduced through the air introduction hole into the inner space of the housing, and discharges the in-drawn air outside through an air discharging hole in the base. A light source module is included and mounted on a lower surface of the supporting plate, wherein the channel part provides a region depressed in a stepped manner along an outer surface of the housing.

Provided is a non-pneumatic wheel (100) for a vehicle, and a wheel (100), suspension (200; 200-1), and tire (300) used therein that are capable of ensuring driving stability because there is no air chamber between a wheel (100) and a tire (300) to blowout. They are also capable of ensuring good road holding, preventing standing waves, reducing brake fade and cornering force, providing good handling and ride comfort, staying quiet when rolling, and are economical and environmentally friendly. The non-pneumatic wheel (100) includes a wheel (100), a shock absorbing member (220; 220-1) coupled to an outer periphery of the wheel (100) and absorbing or attenuating noise and vibration due to external shock, a plurality of resilient members (230; 230-1; 230-2) arranged around and coupled to an outer periphery of the shock absorbing member (220; 220-1) in a radial direction and having a plurality of resilient rings (230-1a) that are resiliently deformed in response to an external force, resilient links (240) respectively coupled to the resilient rings (230-1a) to evenly transmit external shock to the resilient rings (230-1a), rail plates (270) to which sliders (261) formed at both ends of the resilient links (240) are slidably coupled, and a tire (300) having a plurality of coupling grooves (321) formed along an inner periphery such that the rail plates (270) are inserted into the coupling grooves (321).

A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like substrate with a circuit printed on a surface thereof, the substrate having a through hole. The package also includes a light source positioned in the through hole and including a submount and a dome structure made of resin, covering and fixing the light source to the substrate. The invention allows a good heat radiation effect by using the general PCB as the substrate, enabling manufacture of a high quality COB package at low costs. This in turn improves emission efficiency of the light source, ultimately realizing a high quality light source.

A member (12A) for use in an electronic circuit has a thermally conductive layer (22) mounted on a heat sink (20). The thermally conductive layer (22) comprises an insulating substrate (24), a first joint member (26) joining the insulating substrate (24) to the heat sink (20) and containing an active element, a second joint member (28) disposed on the insulating substrate (24), and an electrode (30) disposed on the second joint member (28). The insulating substrate (24) comprises an AlN layer or an Si3N4 layer. Each of the first and second joint members (26, 28) is made of a hard brazing material containing an active element. The heat sink (20) is made of an SiC / Cu composite material or a C / Cu composite material.

An electronic control device comprises a circuit board having a heat generating part mounted thereon; a case for installing therein the circuit board, the case having a heat receiving portion that is in contact with the heat generating part; at least two first fixing units that are constructed and arranged to fix a peripheral portion of the circuit board to the case; and at least one second fixing unit that is arranged to fix a given area of the circuit board to the case while pressing the given area against the heat receiving portion through the heat generating part, the given area being an area where the heat generating part is placed.

To improve the productivity of manufacturing semiconductor devices having a heat sink, the semiconductor device manufacturing method includes: (a) setting an integral heat radiation body set 30 of multiple heat radiation bodies 32 in a mold 40 cavity 42; (b) setting a substrate 10 on which multiple semiconductor chips 20 are mounted in a planar arrangement in the mold 40 so that the multiple semiconductor chips 20 are located inside the cavity 42; and (c) sealing the multiple semiconductor chips 20 and affixing the heat radiation body set 30 by filling the cavity 42 with a sealant.

A bearing for supporting rotation of either of a rotor and a planetary gear is supported by a wall disposed between a motor housing and a gear case room. The wall is provided with an opening allowing lubricating oil splashed by a gear to be splashed onto an upper portion of a stator. Some of the lubricating oil passes through an oil passage placed at a central portion of a shaft and through an oil passage provided at a planetary carrier, and is then splashed through the opening onto an outer periphery of a stator coil. Furthermore, the lubricating oil is also splashed by a pinion gear, and is similarly splashed through the opening onto the stator coil and an inner peripheral wall of the motor housing. Accordingly, the stator coil and the stator core are cooled.

A spread illuminating apparatus includes: a light conductor plate; at least one LED disposed at a side surface of the light conductor plate; an FPC including a substrate and first and second conductive patterns formed respectively at the front ad rear surfaces of the substrate; and a heat radiating plate to hold the FPC. The LED is mounted on electrode pads formed at the first conductive pattern of the FPC, and all the side faces of the LED are covered with an individual thermal conductor enclosure which is connected to the second conductive pattern via an opening formed at the substrate of the FPC. Thus, a heat radiation system is established from the side faces of the LED through to the heat radiating plate which is affixed to the rear surface of the FPC.

An apparatus (100) for transferring heat from a first substrate (140) rotatably mounted to a second substrate (150). The apparatus (100) is comprised of at least a first fin ring (145) disposed concentrically on a first side surface (141) of the first substrate (140). A plurality of heat generating devices (130) is disposed on a second side surface (142) of the first substrate (140). There is at least a second fin ring (155) disposed concentrically on a first side surface (151) of the second substrate (150). The first fin ring (145) interleaves with the second fin ring (155) while allowing the first substrate (140) to rotate unobstructed relative to the second substrate (150). The second substrate (150) has at least a first port (160) for introducing moving air into a gap (G) defined between the first fin ring (145) and the second fin ring (155) for improving heat convection there between.

A semiconductor light emitting device can include a base having a cavity provided for housing an LED chip and a resin spacer therein. The resin spacer can be composed of at least two layers of spacers including a transparent resin spacer and a wavelength conversion spacer mixed with a fluorescent material and formed to have an almost constant thickness. The wavelength conversion spacer can include a metallic radiation mesh or radiation wire disposed therein.

An evaporation source and method for depositing a thin film, including a crucible having a predetermined space for placing a deposition material and at least one baffle, the baffle positioned inside the crucible and parallel to the predetermined space to divide the crucible into a plurality of channels, a heating unit, and at least one spray nozzle in fluid communication with the crucible, the spray nozzle having a plurality of spray orifices.

In a pulley assembly, an annular joint member made of a high polymer material is disposed between an outer ring of a bearing and a light metal pulley. The joint member has a coefficient of thermal expansion larger than that of the pulley. The outer ring has a coefficient of thermal expansion smaller than that of the pulley. The pulley has an annular boss, an annular rim, and a plurality of spokes which have side faces each consisting of a surface parallel to an axial direction of the pulley. Front faces of the spokes are positioned on one identical imaginary surface of revolution, and rear faces of the spokes are also positioned on one identical imaginary surface of revolution.

A secondary battery includes an electrode assembly in which a first electrode plate, a separator, and a second electrode assembly are sequentially stacked forming a stack and is wound about one edge of the stack, and a plurality of finishing tapes attached to the outer surface of the electrode assembly and spaced apart from each other along the winding direction of the electrode assembly.

A cooling system is equipped with a circulation flow path arranged to flow a coolant into an engine, a motor drive system flow path branched off from the circulation flow path and arranged to flow the coolant into a motor drive system, a flow rate distribution regulator provided at a junction of the circulation flow path and the motor drive system flow path, and an electric pump configured to pressure-feed the coolant through the circulation flow path. In the cooling system, the procedure of flow rate control sets an engine flow rate demand Vwe based on a rotation speed Ne and a torque te of the engine and a coolant temperature Te (step S110), while setting a motor flow rate demand Vwm based on an inverter current Iinv of the motor drive system and the coolant temperature Te (step S120). The flow rate distribution regulator and the electric pump are then controlled to make a flow rate of the coolant flowed into the engine and a flow rate of the coolant flowed into motors and inverters included in the motor drive system respectively equal to the set engine flow rate demand Vwe and the set motor flow rate demand Vwm (steps S130 and S140).

A resin-sealed type semiconductor device has a mount stage, a semiconductor chip mounted on the stage such that a rear surface of the chip is in contact with the stage, a heat spreader associated with the stage and the chip, and a molded resin package encapsulating the stage, chip, and heat spreader. The stage is configured such that the rear surface of the chip is partially covered with the stage, whereby uncovered areas are defined on the rear surface of the electronic component. The heat spreader is complementarily configured with respect to the stage so as to be in direct contact with the uncovered areas of the rear surface of the electronic component, whereby an entire thickness of both the mount stage and the heat spreader is smaller than a total of a thickness of the mount stage and a thickness of the heat spreader.

A semiconductor laser device includes a semiconductor device layer having an emission layer and formed with a current path on a semiconductor layer in the vicinity of the emission layer, a current blocking layer formed in the vicinity of the current path, and a heat-radiation layer formed to be provided at least in the vicinity of a region formed with a cavity facet of the semiconductor device layer and be located above the current path, and having thermal conductivity larger than that of the current blocking layer.

A cooler for a semiconductor-module includes: a heat sink which has an appearance of a cuboid structure to one side of which a flow rate control plate is fixed; a thermal radiation plate on an outer surface of which semiconductor devices are bonded; and a tray-shaped cooling jacket having: a coolant introduction channel; a coolant extraction channel extending in parallel to the coolant introduction channel; and a cooling channel provided between the coolant introduction and extraction channels. The heat sink is provided in the cooling channel of the cooling jacket so that the flow rate control plate extends in a boundary between the coolant extraction channel and the cooling channel, and channels provided for the heat sink extend orthogonally to the coolant introduction and extraction channels. The thermal radiation plate is fixed so as to close an opening the cooling jacket.

The present invention relates to a production method of foundry shaped coke and its equipment system for producing said foundry shaped coke. Said method includes the procedures of preparing material,pulverizing, cold stirring, hot stirring, forming and carbonization and coking, and its equipment system includes material-preparing chamber, pulverizing machine, cold stirring machine, hot stirring machine, forming machine and carbonizing furnace, etc.

An electronic control unit (ECU) includes onboard type electronic components and non-onboard type electronic components inside an aluminum case. The ECU has a circuit board for mounting the onboard type electronic component in a first portion of a bottom surface, and a concavity for installing the non-onboard type electronic components in a second portion of the bottom surface. A resinous frame is provided in the concavity to house and hold the non-onboard type electronic components.