1267 results about "Foundry" patented technology

A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.

A set of tools is provided herein that produces useful, proven, and correct integrated semiconductor chips. Having as input either a customer's requirements for a chip, or a design specification for a partially manufactured semiconductor chip, the tools generate the RTL for control plane interconnect; memory composition, test, and manufacture; embedded logic analysis, trace interconnection, and utilization of spare resources on the chip; I / O qualification, JTAG, boundary scan, and SSO analysis; testable clock generation, control, and distribution; interconnection of all of the shared logic in a testable manner from a transistor fabric and / or configurable blocks in the slice. The input customer requirements are first conditioned by RTL analysis tools to quickly implement its logic. The slice definition and the RTL shell provides the correct logic for a set of logic interfaces for the design specification to connect. The tools share a common database so that logical interactions do not require multiple entries. The designs are qualified, tested, and verified by other tools. The tools further optimize the placement and timing of the blocks on the chip with respect to each other and with respect to placement on a board. The suite may be run as batch processes or can be driven interactively through a common graphical user interface. The tools also have an iterative mode and a global mode. In the iterative mode, one or more of the selected tools can generate the blocks or modify a design incrementally and then look at the consequences of the addition, or change. In the global mode, the semiconductor product is designed all at once in a batch process as above and then optimized altogether. This suite of generation tools generates design views including a qualified netlist for a foundry to manufacture.

A water meter housing assembly (10) comprises a cylindrical, plastic housing body (11), a non-cast housing bottom (13) of hydroformable or stamped brass, a single-piece strainer and sealing member (40) that is disposed in the housing bottom (13) and portions of non-cast hydroformable or stamped brass tubing (15) with spud ends (16, 17) for connection in a water supply line. The brass consists essentially of lead-free material. The assembly (10) is designed to provide a lower cost alternative to foundry cast meter housings. The assembly (10) also provides advantages in a method of vertical assembly that saves manufacturing cost.