Inertial sensor production and wafer level package process based on MEMS (micro-electromechanical system)

Abstract

The invention discloses an inertial sensor production and wafer level package process based on an MEMS (micro-electromechanical system). The process includes the steps: 1) forming an E-SOI (engineering-silicon on insulator); 2) performing surface machining on an MEMS wafer; 3) producing an ASIC (application specific integrated circuit) wafer on a standard ASIC foundry; 4) performing metal eutectic bonding for the MEMS wafer and the ASIC wafer; 5) performing WLCSP (wafer level chip size packaging). The area of an ASIC chip is identical with that of an MEMS chip, the effective areas of the MEMS chip and the ASIC chip are sufficiently used, the most effective space is provided for the design of the MEMS chip and the ASIC chip, subsequent package procedures of the chips are omitted by the aid of the wafer level chip size packaging, Flip-Chip of a terminal circuit board is finished directly through a BGA (ball grid array), and the sizes of the chips and production cost are greatly reduced.

Description

technical field [0001] The invention relates to MEMS (micro-electro-mechanical systems) production of inertial sensors, including gyroscopes and accelerators, and in particular to a MEMS (micro-electro-mechanical systems)-based inertial sensor production and wafer-level packaging process. Background technique [0002] In recent years, inertial sensors such as gyroscopes have been more and more widely used in automobiles, smartphones, tablet computers, toy helicopters, and air mice. Gyroscopes and accelerometers based on MEMS are currently mainstream products. Chip design and wafer processing are two key steps in the manufacture of inertial sensors. [0003] However, existing inertial sensors have the following disadvantages on packaged chips and wafers (US Patent No. 7,104,129B2): [0004] (1) Since part of the MEMS (micro-electromechanical system) area must be cut off by a dicing process to expose the metallization area for packaging the leads, part of the MEMS area is was...

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to solve the problems of MEMS area waste, limited ASIC design space, high production cost and large chip size in the prior art, and provide a MEMS-based inertial sensor production and wafer-level packaging process, which can The size is reduced to 2-4 square millimeters, and the production cost can be reduced by 30-40% compared with the traditional process

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