1174results about How to "Reduce package size" patented technology

The present invention provides a method for manufacturing a wafer level chip scale package using a redistribution substrate, which has patterned bump pairs connected by redistribution lines and formed on a transparent insulating substrate. The redistribution substrate is produced separately from a wafer and then bonded to the wafer. One part of each bump pair is in contact with a chip pad on the active surface of the wafer, and the other part coincides with one of holes formed in the wafer. Conductive lines are formed in the holes and on the non-active surface of the wafer. External connection terminals are formed on the conductive lines at the non-active surface.

A rowing machine is constructed to include a sloping angle-adjustable base frame, a foot rack selectively and pivotally mounted on the base frame at the front side, a rocker arm coupled with a detachable handlebar for rowing exercise to stretch elastic cord members, a slide slidably mounted on two parallel rails of the base frame to support a seat and a collapsible back, and two elastic pull cords detachably fastened to the base frame for pulling by the user sitting on the seat.

A semiconductor die package is disclosed. In one embodiment, the semiconductor die package has a substrate. It includes (i) a lead frame structure including a die attach region with a die attach surface and a lead having a lead surface, and (ii) a molding material. The die attach surface and the lead surface are exposed through the molding material. A semiconductor die is on the die attach region, and the semiconductor die is electrically coupled to the lead.

An automatic transmission includes a first planetary gear set including a first sun gear, a first pinion, a second pinion, and a common ring gear, and includes a second planetary gear set including a second sun gear, the second pinion, and the common ring gear. The transmission includes a third planetary gear set including a third sun gear, a third pinion, and a ring gear of the third set, and includes a fourth planetary gear set including a fourth sun gear, a fourth pinion, and a ring gear of the fourth set. The transmission also includes a first planetary carrier rotatably supporting the first pinion, the second pinion, and the third pinion. The common ring gear is directly connected to the ring gear of the fourth set, and a second planetary carrier rotatably supports the fourth pinion and is directly connected to the ring gear of the third set.

An multi-speed automatic transmission providing at least nine forward speeds and one reverse speed, includes four planetary gear sets, six shift control elements, an input shaft, an output shaft, and a transmission case. Each planetary gear set includes a sun gear, a pinion gear set, a carrier that rotatably supports the pinion gear set, and a ring gear. A carrier of a first planetary gear set is connected to the ring gear of a second planetary gear set and a carrier of the second planetary gear set is connected to the ring gear of the first planetary gear set. The first and second planetary gear sets are concentrically arranged in a common plane.

A flat refractive collimator assembly including a light guide and a light source, for example, an LED. The sides of the light guide defines a collimating reflective surface having a paraboloidal shape with a collimating focal point placed on the axis of the light guide. The central portion of the light guide defines a main reflective surface having a virtual focal point, which is substantially similar to the collimating focal point. The collimating reflective surface is a paraboloidal surface or is formed as a plurality of paraboloidal segments having various focal lengths and having a common collimating focal point. The collimating reflective surface can also include spread optics.

A high intensity mutli-wavelength illumination apparatus comprising an array of LEDs each of which has a predetermined spectral output that is emitted over a predetermined solid angle, an array of non-imaging concentrators the individual non-imaging concentrators of which are optically coupled in one-to-one correspondence with the LEDs, each non-imaging concentrator in the array of non-imaging concentrators operating to collect radiation emitted by each of the LEDs and to re-emit substantially all the collected radiation as a beam having a diverging solid angle smaller than said predetermined solid angle over which radiation is emitted by each of the LEDs, the non-imaging concentrators each having an entrance aperture for receiving radiation emitted by a corresponding one of the LEDs and an exit aperture from which the LEDs output emerges spatially and spectrally uniform in the near field of the exit aperture, and a light integrator having an entrance facet optically coupled to each of the exit apertures of the non-imaging concentrators for receiving radiation there through and conducting it to an exit facet thereof from which radiation is emitted for a downstream application, the light integrator being structured and arranged to substantially uniformly mix the individual beams emitted by each concentrator so that radiation emitted from its exit facet is uniformly colored.

In regard to a semiconductor device having a multilayered wiring board where a semiconductor chip is embedded inside, a technology which allows the multilayered wiring board to be made thinner is provided. A feature of the present invention is that, in a semiconductor device where bump electrodes are formed over a main surface (element forming surface) of a semiconductor chip embedded in a chip-embedded wiring board, an insulating film is formed over a back surface (a surface on the side opposite to the main surface) of the semiconductor chip. As a result, it becomes unnecessary to form a prepreg over the back surface of the semiconductor chip. Therefore, an effect of thinning the chip-embedded wiring board in which the semiconductor chip is embedded is obtained.

Compact narrow angle lens systems that may be used in small form factor cameras. The lens system may include six lens elements with refractive power, and may provide lower F-numbers while maintaining or improving imaging quality and package size when compared to other compact lens systems. Total track length of the lens system may be 6.5 millimeters or less, for example 5.9 or 6 millimeters. Focal length of the lens system may be 7.0 millimeters or less, for example 6.6 millimeters. The lens system may include an aperture stop located behind the front vertex of the lens system, for example between the first and second lens elements, that effectively moves the ideal principal point of the camera to in front of the front vertex. The lens system may provide a focal ratio of 2.8 or less, for example 2.6 or 2.4.

Embodiments disclosed herein provide packaged LED devices in which the majority of the emitted light comes out the top of each LED chip with very little side emissions. Because light only comes out from the top, phosphor deposition and color temperature control can be significantly simplified. A package LED may include a housing positioned on a supporting submount, sized and dimensioned to accommodate a single LED chip or an array of LED chips. The LED chip(s) may be attached to the submount utilizing the Gold-to-Gold Interconnect (GGI) process or solder-based approaches. In some embodiments, phosphor may be deposited on top of the LED chip(s) or sandwiched between glass plates on top of the LED chip(s). The phosphor layer may be inside or on top of the housing and be secured to the housing utilizing an adhesive. The housing may be adhered to the submount utilizing a thermal epoxy.

An illuminator with blue and red LEDs, a reflector upstream of the LEDs for capturing upstream light emitted out of the back surfaces of the LEDs and redirecting downstream as useful illumination, a band pass filter for conditioning the downstream light, a phosphor layer for changing the spectral properties of light from the LEDs, and a non-imaging concentrator for creating a beam of illumination over a predetermined solid angle, uniformity, and spectral content.

A folded telephoto lens system may include multiple lenses with refractive power and a light path folding element. Light entering the camera through lens(es) on a first path is refracted to the folding element, which changes direction of the light on to a second path with lens(es) that refract the light to form an image plane at a photosensor. At least one of the object side and image side surfaces of at least one of the lens elements may be aspheric. Total track length (TTL) of the lens system may be 14.0 mm or less. The lens system may be configured so that the telephoto ration (TTL / f) is less than or equal to 1.0. Materials, radii of curvature, shapes, sizes, spacing, and aspheric coefficients of the optical elements may be selected to achieve quality optical performance and high image resolution in a small form factor camera.

The invention provides an LED lighting device and method that produces high intensity, spatially uniform, white light in the near and far fields in a reduced package size that does not significantly heat the surrounding environment, wherein the white light is produced by using a phosphor layer in conjunction with at least one LED.

An exhaust heat recovery heat exchanger assembly for use along a main exhaust flow path of an exhaust system for an engine, and a method of operation, is disclosed. The exhaust heat recovery heat exchanger includes a sealed vacuum chamber, including a hydride pellet mounted in the chamber, and electrical leads extending from the hydride pellet. An exhaust chamber along the main exhaust flow path is located along an inner wall of the vacuum chamber. A housing surrounds the vacuum chamber and defines a heat receiving medium chamber. A heat receiving medium flows through the heat receiving medium chamber and absorbs heat from the exhaust flowing through the exhaust chamber when an electric current is applied to the hydride pellet.

A semiconductor device (10) includes a first leadframe (18) having a perimeter (20) that defines a cavity (22) and leads (14) extending inwardly from the perimeter, and a second leadframe (32) having top and bottom surfaces and a die paddle surrounding a die receiving area (36). An integrated circuit (12) is placed within the die receiving area of the second leadframe. The IC has bonding pads (44) located on a peripheral portion of its top surface. The second leadframe and the IC are in facing relation with the first leadframe such that the leads of the first leadframe are electrically connected to respective ones of the bonding pads. A mold compound (50) is injected between the first and second leadframes and covers the second leadframe top surface and a central area of the first surface of the IC. At least the bottom surfaces of the leads are exposed.