126results about How to "Lower substrate cost" patented technology

A drainage system is provided for a synthetic grass turf assembly having a flexible and water permeable sheet backing for installation on a supporting soil substrate to provide a game playing surface. The draining system of the present invention prevents water from accumulating on the turf surface, which could cause the top-dressing layer to “float” and be moved by inundation. The draining system of the present invention includes a spacing grid disposed between the backing of the turf. The spacing grid is structured to permit water not only to be drained vertically through the spacing grid, but also to be drained horizontally through the spacing grid to the edges of the field. The spacing grid is made from one or more types of geotextile or plastics material with an adequate flexibility to improve the impact absorption capabilities and resilience of the synthetic grass turf assembly.

An electroluminescent display includes a display substrate, a plurality of patterned first electrodes formed over the display substrate, one or more layers of light-emitting material formed over the plurality of first electrodes, at least one second electrode formed over the one or more layers of light-emitting material, and a plurality of chiplets. Each chiplet is electrically connected to a first electrode. Each chiplet further includes a light detector and a light emitter separate from the one-or-more layers of light-emitting material connected to the chiplet circuitry. The chiplet circuitry includes a modulating circuit for modulating light emitted by the light emitter and a demodulating circuit for demodulating light detected by the light detector so that light emitted by the light emitter of a first chiplet is received by the light detector of a second chiplet.

An optical semiconductor package comprises a substrate, a chip, a plurality of bonding wires, a window, a supporter, and an encapsulant. The chip is disposed on the substrate and has an optical element. The bonding wires are used for electrically connecting the chip to the substrate. The window is supported on the supporter and positioned over the optical element of the chip. The encapsulant is overmolded on the substrate for fixing the window and encapsulating the chip and the bonding wires.

Methods for fabricating solar cells without the need to perform gasification of metallurgical-grade silicon are disclosed. Consequently, the costs and health and environmental hazards involved in fabricating the solar or silicon grade silicon are being avoided. A solar cell structure comprises a metallurgical grade doped silicon substrate and a thin-film structure formed over the substrate to form a p-i-n junction with the substrate. The substrate may be doped p-type, and the thin film structure may be an intrinsic amorphous layer formed over the substrate and an n-type amorphous layer formed over the intrinsic layer.

There is provided a semiconductor device including corundum crystal films of good quality. There is provided a semiconductor device including a base substrate, a semiconductor layer, and an insulating film each having a corundum crystal structure. Materials having a corundum crystal structure include many types of oxide films capable of functioning as an insulating film. Since all the base substrate, the semiconductor layer, and the insulating film have a corundum crystal structure, it is possible to achieve a semiconductor layer and an insulating film of good quality on the base substrate.

The invention discloses improved structures of light-processing (e.g. light-emitting and light-absorbing/sensing) devices, in particular Vertical Cavity Surface Emitting Lasers (VCSELs), such as may find use in telecommunications applications. The disclosed VSCAL devices and production methods provide for an active region having a quantum well structure grown on GaAs-containing substrates, thus providing processing compatibility for light having wavelength in the range 1.0 to 1.6 μm. The active region structure combines strain-compensating barriers with different band alignments in the quantum wells to achieve a long emission wavelength while at the same time decreasing the strain in the structure. The improved functioning of the devices disclosed results from building them with multicomponent alloy layers having a large number of constituents. The invention discloses as a key constituent in the proposed alloy layers for the active region a substance, such as nitrogen (N), suitable for reducing bandgap energy (i.e., increasing light wavelength) associated with the layers while at the same time lowering the lattice constant associated with the structure and hence lowering strain.

The invention discloses a preparation method of lactic acid, which takes lignocellulose as raw material, and is low in cost and high in efficiency, wherein the preparation method specifically comprises the following steps of: separating from lignocellulose to store pediococcus acidilactici, carrying out liquid culture on the pediococcus acidilactici to obtain cell bacteria taken as seeds, inoculating into a reactor with high lignocellulose content, adding cellulase, and synchronously carrying out saccharification and high-temperature fermentation to generate the lactic acid; or firstly saccharifying the cellulase of the lignocellulose to obtain sugar-containing hydrolysate, then carrying out high-temperature lactic acid fermentation by the hydrolysate to obtain the lactic acid; or uniformly blending the pediococcus acidilactici and the lignocellulose raw material, carrying out solid state cultivation, adding the pediococcus acidilactici-containing lignocellulose raw material into a fermentation tank, adding the cellulase, and synchronously carrying out saccharification and high-temperature fermentation to prepare the lactic acid. By adopting unique fermentation technology and microorganism, the preparation method is high in product concentration, simple in process, and low in cost; and particularly by taking the lignocellulose as raw material, the preparation method is wide in production space and development prospect.

A method for preparing a substrate with periodical structure, comprising the following steps: (A) providing a substrate and plural nano-sized balls, wherein the nano-sized balls are arranged on the surface of the substrate; (B) depositing a cladding layer on partial surface of the substrate and the gaps between the nano-sized balls; (C) removing the nano-sized balls; (D) etching the substrate by using the cladding layer as a mask; and (E) removing the mask to form a periodical structure on the surface of the substrate. In the present invention, the nano-sized balls are used as a template for forming the mask. Hence, compared with the lithography, when the method of the present invention is used to prepare a substrate with a periodical structure, the duration of the process and the manufacturing cost can be decreased.

A substrate, a smart card module having the substrate and methods for fabricating the same are provided. A substrate having metal patterns formed on both sides and applicable to both wire bonding and flip chip bonding, a smart card module having the same and methods of fabricating the same are also provided. The substrate may include an insulating layer, an upper metal pattern, a bottom metal pattern, a first plating layer, a second plating layer and a substrate. The insulating layer may have a plurality of via holes. The upper metal pattern may be formed on the insulating layer and side surfaces of the plurality of via holes. The bottom metal pattern may be formed on the bottom of the insulating layer and electrically connected to the upper metal pattern. The first plating layer may be formed on the upper metal pattern and the upper surface of the bottom metal pattern. The second plating layer may be formed on the bottom of the bottom metal pattern. The substrate may include contact holes having side surfaces of the plurality of via holes covered by the upper metal pattern and the first plating layer. The bottom surface of the insulating layer may be supported by the bottom metal pattern and the first plating layer.

The invention discloses a novel substrate for simple roof greening by applying greening wastes and a preparation method thereof. The novel substrate for simple roof greening is prepared from greeningwaste decomposed compost, grass carbon, volcanic rock and vermiculite. The preparation method comprises the following steps: selecting the greening waste decomposed compost with a particle size of less than 5 mm, and mixing the greening waste decomposed compost with the grass carbon, the volcanic rock and the vermiculite according to a volume ratio of (40-70%): (0-25%): (18-36%): (12-24%). The novel substrate provided by the invention fully utilizes nutrient supply properties of the greening wastes, water-retaining and nutrient-retaining properties of the vermiculite and stability and root-fixing properties of the volcanic rock, provides good growth conditions for a plant in the aspects of water, nutrients, air and heat, and meets the needs of simple roof greening for plantation and growthof the plant; meanwhile, physical and chemical property indexes of the substrate all meet the requirements of simple roof greening; and the novel substrate provided by the invention replaces a grasscarbon substrate with urban greening wastes, so waste is turned into treasure; a novel way for treatment of the urban greening wastes is opened up; the usage amount of grass carbon resources is reduced; the cost of the substrate is lowered; and sustainable development of resources and the environment can be easily realized.