126results about How to "Lower substrate cost" patented technology

A drainage system is provided for a synthetic grass turf assembly having a flexible and water permeable sheet backing for installation on a supporting soil substrate to provide a game playing surface. The draining system of the present invention prevents water from accumulating on the turf surface, which could cause the top-dressing layer to “float” and be moved by inundation. The draining system of the present invention includes a spacing grid disposed between the backing of the turf. The spacing grid is structured to permit water not only to be drained vertically through the spacing grid, but also to be drained horizontally through the spacing grid to the edges of the field. The spacing grid is made from one or more types of geotextile or plastics material with an adequate flexibility to improve the impact absorption capabilities and resilience of the synthetic grass turf assembly.

An electroluminescent display includes a display substrate, a plurality of patterned first electrodes formed over the display substrate, one or more layers of light-emitting material formed over the plurality of first electrodes, at least one second electrode formed over the one or more layers of light-emitting material, and a plurality of chiplets. Each chiplet is electrically connected to a first electrode. Each chiplet further includes a light detector and a light emitter separate from the one-or-more layers of light-emitting material connected to the chiplet circuitry. The chiplet circuitry includes a modulating circuit for modulating light emitted by the light emitter and a demodulating circuit for demodulating light detected by the light detector so that light emitted by the light emitter of a first chiplet is received by the light detector of a second chiplet.

Aspects of the present invention provide a high-voltage semiconductor device and a high voltage integrated circuit device while minimizing or eliminating the need for the addition of back surface steps. Aspects of the invention provide a high-voltage semiconductor device that achieves, low voltage driving and quick response by way of stable high voltage wiring and a low ON voltage. In some aspects of the invention, a high-voltage semiconductor device can include a semiconductor layer is formed on a support substrate interposing an embedded oxide film therebetween. A high potential side second stage transistor and a low potential side first stage transistor surrounding the second stage transistor are formed on the surface region of the semiconductor layer. The source electrode of the second stage transistor is connected to the drain electrode of the first stage transistor. A drain electrode of the second stage transistor is connected to a drain pad.

An optical semiconductor package comprises a substrate, a chip, a plurality of bonding wires, a window, a supporter, and an encapsulant. The chip is disposed on the substrate and has an optical element. The bonding wires are used for electrically connecting the chip to the substrate. The window is supported on the supporter and positioned over the optical element of the chip. The encapsulant is overmolded on the substrate for fixing the window and encapsulating the chip and the bonding wires.

A laminated substrate and the semiconductor package utilizing the substrate are revealed. The laminated substrate primarily comprises a core layer, a first metal layer and a first solder mask disposed on the bottom surface of the core layer, and a second metal layer and a second solder mask disposed on the top surface of the core layer. The two solder masks have different CTEs to compensate potential substrate warpage caused by thermal stresses. Therefore, the manufacturing cost of the substrate can be reduced without adding extra stiffeners nor changing thicknesses of semiconductor packages to suppress substrate warpage during packaging processes. Especially, a die-attaching layer partially covers the second solder mask by printing and is planar after pre-curing for zero-gap die-attaching.

Methods for fabricating solar cells without the need to perform gasification of metallurgical-grade silicon are disclosed. Consequently, the costs and health and environmental hazards involved in fabricating the solar or silicon grade silicon are being avoided. A solar cell structure comprises a metallurgical grade doped silicon substrate and a thin-film structure formed over the substrate to form a p-i-n junction with the substrate. The substrate may be doped p-type, and the thin film structure may be an intrinsic amorphous layer formed over the substrate and an n-type amorphous layer formed over the intrinsic layer.

The invention discloses a method for culturing an orchid and a special bacterium thereof. The name of the bacterium of the invention is GDB181 the preservation number of which is CGMCCNo.2574. The method of the invention includes the steps for together culturing the bacterium of the invention and the orchid. The bacterium of the invention is applicable for the root culturing of an orchid bacteria and builds an epiphyte bacterium with excellent root which effectively coexists with the orchid. The method of the invention for culturing the orchid can better control the inoculation amount and can fix the inoculation position, thus fully ensuring the tissue culture seedling of the orchid to build the coexistence relation with the epiphyte bacterium with excellent root, simultaneously simplifying the inoculation steps and reducing the inoculation times. Permanent effect can be achieved by being inoculated for once, thus avoiding the dead seedling phenomenon caused by a plurality of manual inoculations, thereby improving the survival rate of transplanting and obtaining the root orchid seedling which grows strongly. Therefore, the method for culturing bacterium, the culture medium of the bacterium and the culture medium of the orchid of the invention has important economic values and is applicable for popularization and application.

A method for fabricating semiconductor packages is proposed. A plurality of substrates each having a chip thereon are prepared. Each substrate has similar length and width to the predetermined length and width of the semiconductor package. A carrier having a plurality of openings is prepared. Each opening is larger in length and width than the substrate. The substrates are positioned in the corresponding openings, and gaps between the substrates and the carrier are sealed. A molding process is performed to form an encapsulant over each opening to encapsulate the chip. An area on the carrier covered by the encapsulant is larger in length and width than the opening. After performing a mold-releasing process, a plurality of the semiconductor packages are formed by a singulation process to cut along substantially edges of each substrate according to the predetermined size of the semiconductor package. A waste of substrate material is avoided.

There is provided a semiconductor device including corundum crystal films of good quality. There is provided a semiconductor device including a base substrate, a semiconductor layer, and an insulating film each having a corundum crystal structure. Materials having a corundum crystal structure include many types of oxide films capable of functioning as an insulating film. Since all the base substrate, the semiconductor layer, and the insulating film have a corundum crystal structure, it is possible to achieve a semiconductor layer and an insulating film of good quality on the base substrate.

The invention discloses improved structures of light-processing (e.g. light-emitting and light-absorbing / sensing) devices, in particular Vertical Cavity Surface Emitting Lasers (VCSELs), such as may find use in telecommunications applications. The disclosed VSCAL devices and production methods provide for an active region having a quantum well structure grown on GaAs-containing substrates, thus providing processing compatibility for light having wavelength in the range 1.0 to 1.6 μm. The active region structure combines strain-compensating barriers with different band alignments in the quantum wells to achieve a long emission wavelength while at the same time decreasing the strain in the structure. The improved functioning of the devices disclosed results from building them with multicomponent alloy layers having a large number of constituents. The invention discloses as a key constituent in the proposed alloy layers for the active region a substance, such as nitrogen (N), suitable for reducing bandgap energy (i.e., increasing light wavelength) associated with the layers while at the same time lowering the lattice constant associated with the structure and hence lowering strain.

The invention discloses construction and application of a polygene knockout strain of Halomonas sp. TD01. The invention provides a recombinant strain which is obtained by inactivating one or more genes related to metabolic pathways of propionic acid in the Halomonas sp. TD01 used for producing polyhydroxyalkanoate (PHA). The one or more genes related to metabolic pathways of propionic acid are at least one selected from the group consisting of a coding gene for 2-methylcitrate synthetase, a coding gene for PHA digestive enzyme 1, a coding gene for PHA digestive enzyme 2 and a coding gene for PHA digestive enzyme 3. According to results of experiments in the invention, molecular modification is carried out on the Halomonas sp. TD01 to knock out 2-methylcitrate synthetase PrpC and three PHA digestive enzymes so as to obtain the novel recombinant strain, poly(3-hydroxybutyrate-co-3-hydroxyvalerate) (PHBV) with more excellent material performance can be highly efficiently produced by utilizing propionic acid, and the proportion of 3-hydroxyvaleric acid monomers in the produced PHBV and the conversion rate of the substrate propionic acid are substantially improved.

The invention reduces the pin terminal number of a controller that in parallel or simultaneously accesses a synchronous memory and an asynchronous memory. When a column address is latched to an SDRAM, immediately after that, access to FLASH is started, and a shared bus controller outputs the write / read address with respect to FLASH on the address bus. Then, after the end of data transfer on the data bus, either the shared bus controller outputs the write data, or FLASH can output the read data on the data bus by means of a strobe signal. Then, the input of address is established by FLASH, and, as the shared bus controller asserts a strobe signal, either FLASH fetches the write data on the data bus, or the shared bus controller fetches the read data on the data bus.

The invention discloses a preparation method of lactic acid, which takes lignocellulose as raw material, and is low in cost and high in efficiency, wherein the preparation method specifically comprises the following steps of: separating from lignocellulose to store pediococcus acidilactici, carrying out liquid culture on the pediococcus acidilactici to obtain cell bacteria taken as seeds, inoculating into a reactor with high lignocellulose content, adding cellulase, and synchronously carrying out saccharification and high-temperature fermentation to generate the lactic acid; or firstly saccharifying the cellulase of the lignocellulose to obtain sugar-containing hydrolysate, then carrying out high-temperature lactic acid fermentation by the hydrolysate to obtain the lactic acid; or uniformly blending the pediococcus acidilactici and the lignocellulose raw material, carrying out solid state cultivation, adding the pediococcus acidilactici-containing lignocellulose raw material into a fermentation tank, adding the cellulase, and synchronously carrying out saccharification and high-temperature fermentation to prepare the lactic acid. By adopting unique fermentation technology and microorganism, the preparation method is high in product concentration, simple in process, and low in cost; and particularly by taking the lignocellulose as raw material, the preparation method is wide in production space and development prospect.

A method for preparing a substrate with periodical structure, comprising the following steps: (A) providing a substrate and plural nano-sized balls, wherein the nano-sized balls are arranged on the surface of the substrate; (B) depositing a cladding layer on partial surface of the substrate and the gaps between the nano-sized balls; (C) removing the nano-sized balls; (D) etching the substrate by using the cladding layer as a mask; and (E) removing the mask to form a periodical structure on the surface of the substrate. In the present invention, the nano-sized balls are used as a template for forming the mask. Hence, compared with the lithography, when the method of the present invention is used to prepare a substrate with a periodical structure, the duration of the process and the manufacturing cost can be decreased.

Disclosed is a multi-chip memory package with a small substrate by using a die pad having an opening to substitute the chip-carrying function of a conventional substrate so that substrate dimension can be reduced. A substrate is attached under the die pad. A first chip is disposed on the substrate located inside the opening. A second chip is disposed on the die pad. An encapsulant encapsulates the top surface of the die pad, the top surface of the substrate, the first chip, and the second chip. The dimension of the substrate is smaller than the dimension of the encapsulant. In a preferred embodiment, a plurality of tie bars physically connect to the peripheries of the die pad and extend to the sidewalls of the encapsulant to have a plurality of insulated cut ends exposed from the encapsulant.

There are provided a substrate processing apparatus and a reaction tube for processing a substrate. The substrate processing apparatus comprises a process chamber configured to accommodate a substrate and process the substrate, a heater configured to heat the substrate, a gas supply part configured to supply a gas to an inside of the process chamber, a quartz reaction tube installed in the alloy reaction tube and a purge gas supply part configured to supply a purge gas to a gap formed between the alloy reaction tube and the quartz reaction tube. The process chamber comprises an alloy reaction tube made of a material comprising at least molybdenum (Mo) and cobalt (Co) and excluding aluminum (Al).

The invention relates to the technical field of seedling mediums, and relates to a tomato seedling medium prepared by using paper mud, mushroom residues and sand. The tomato seedling medium is composed by the following raw materials by volume: 20-30% of fermented paper mud, 20-30% of fermented mushroom residues and 40-60% of the sand. The compound medium provided by the invention can improve physical and chemical properties of the tomato seedling medium, reduces adverse effects of a single medium, cultivates the optimal tomato seedlings, promotes the growth of the tomato, can reduce production cost under the premise of guaranteeing the quality of the tomato seedling goods, realizes resource utilization of the paper mud, and has obvious social benefits, economic benefits and environmental and ecological benefits.

A substrate, a smart card module having the substrate and methods for fabricating the same are provided. A substrate having metal patterns formed on both sides and applicable to both wire bonding and flip chip bonding, a smart card module having the same and methods of fabricating the same are also provided. The substrate may include an insulating layer, an upper metal pattern, a bottom metal pattern, a first plating layer, a second plating layer and a substrate. The insulating layer may have a plurality of via holes. The upper metal pattern may be formed on the insulating layer and side surfaces of the plurality of via holes. The bottom metal pattern may be formed on the bottom of the insulating layer and electrically connected to the upper metal pattern. The first plating layer may be formed on the upper metal pattern and the upper surface of the bottom metal pattern. The second plating layer may be formed on the bottom of the bottom metal pattern. The substrate may include contact holes having side surfaces of the plurality of via holes covered by the upper metal pattern and the first plating layer. The bottom surface of the insulating layer may be supported by the bottom metal pattern and the first plating layer.

A semiconductor die package is disclosed. In one embodiment, the semiconductor die package has a substrate. It includes (i) a lead frame structure including a die attach region with a die attach surface and a lead having a lead surface, and (ii) a molding material. The die attach surface and the lead surface are exposed through the molding material. A semiconductor die is on the die attach region, and the semiconductor die is electrically coupled to the lead.

The invention discloses a novel substrate for simple roof greening by applying greening wastes and a preparation method thereof. The novel substrate for simple roof greening is prepared from greeningwaste decomposed compost, grass carbon, volcanic rock and vermiculite. The preparation method comprises the following steps: selecting the greening waste decomposed compost with a particle size of less than 5 mm, and mixing the greening waste decomposed compost with the grass carbon, the volcanic rock and the vermiculite according to a volume ratio of (40-70%): (0-25%): (18-36%): (12-24%). The novel substrate provided by the invention fully utilizes nutrient supply properties of the greening wastes, water-retaining and nutrient-retaining properties of the vermiculite and stability and root-fixing properties of the volcanic rock, provides good growth conditions for a plant in the aspects of water, nutrients, air and heat, and meets the needs of simple roof greening for plantation and growthof the plant; meanwhile, physical and chemical property indexes of the substrate all meet the requirements of simple roof greening; and the novel substrate provided by the invention replaces a grasscarbon substrate with urban greening wastes, so waste is turned into treasure; a novel way for treatment of the urban greening wastes is opened up; the usage amount of grass carbon resources is reduced; the cost of the substrate is lowered; and sustainable development of resources and the environment can be easily realized.

A method of manufacturing a semiconductor device is provided, wherein a laminate structure, comprising a sacrificial layer which is sandwiched between two etch stop layers (8,11) and separates a semiconductor membrane (9) from a bulk substrate (1), is used to provide an underetched structure. Access trenches (4) and support trenches (5) are formed in the layered structure through the thickness of the semiconductor layer (9) and through the upper etch stop layer (8). The support trenches extend deeper through the sacrificial layer (12) and the lower etch stop layer and are filled. The sacrificial layer is exposed and etched away selectively to the etch stop layers to form a cavity (30) and realizes a semiconductor membrane which is attached to the bulk substrate via a vertical support structure comprising the filled support trenches.

The invention relates to a method for producing citric acid by using a lignocellulose raw material. One method is by culturing Aspergillus niger M288 in liquid, and then inoculating to in an enzymatic hydrolysate of cellulose raw material, so as to convert the glucose in enzymatic hydrolysate into citric acid by Aspergillus niger. The other method is by first culturing Aspergillus niger M288 in liquid, and then inoculating Aspergillus niger into a lignocellulose fermenting tank containing a certain content of solid, and adding cellulase at the same time, so as to conduct enzymolysis on lignocellulose by cellulase and ferment the generated sugar into citric acid by Aspergillus niger at the same time. The method uses lignocellulose as raw material for the production of citric acid; the process is simple and low in cost; and especially, the usage of lignocellulose as raw material has broad application and development prospects.

The invention relates to a hole-tray vegetable cultivation substrate. The hole-tray vegetable cultivation substrate is characterized by comprising, by weight, 10%-20% of turf, 10%-20% of perlite, 10%-15% of vermiculite, 0.3% of compound fertilizer of potassium sulfate, 5% of rotten goat manure and the balance abandoned fermented tree branches. Due to the fact that the tree branches are taken as main raw materials of the hole-tray vegetable cultivation substrate, usage amount of the turf is decreased, environmental pollution brought by burning of the abandoned tree branches is reduced, waste is made profitable, environment is protected, the raw materials are abundant and easily available, and cost is low. Compared with a substrate taking the turf as main raw materials, the substrate mainly made of the abandoned tree branches is lowered by 40%-50% in cost, and balanced nutrients are favorable for vegetable growth and increase of production.

The invention belongs to the technical field of detergents, and concretely relates to a low-cost efficient clothing perfuming bead and a preparation method thereof. The clothing perfuming bead comprises, by weight, 50-60 parts of polyethylene glycol, 25-35 parts of calcium stearoyl lactylate, 10-20 parts of an inorganic salt, 0.3-1 part of an essence microcapsule and 1-3 parts of an essence. Whenthe clothing perfuming bead is mixed in a detergent to wash clothing, the essence in the bead is slowly released at a certain rate to prevent the essence from being massively discharged out of the washing machine in the washing and rinsing processes and make the essence effectively adhered to the clothing for a long time, so the fragrance holding time is long, the matrix cost of the perfuming beadis reduced, and the use amount of the essence is reduced, thereby the production cost is greatly reduced from many aspects on the premise of obtaining the same fragrance holding degree.

The invention reduces the pin terminal number of a controller that in parallel or simultaneously accesses a synchronous memory and an asynchronous memory. When a column address is latched to an SDRAM, immediately after that, access to FLASH is started, and a shared bus controller outputs the write / read address with respect to FLASH on the address bus. Then, after the end of data transfer on the data bus, either the shared bus controller outputs the write data, or FLASH can output the read data on the data bus by means of a strobe signal. Then, the input of address is established by FLASH, and, as the shared bus controller asserts a strobe signal, either FLASH fetches the write data on the data bus, or the shared bus controller fetches the read data on the data bus.

The present invention relates to a method for efficiently producing gluconic acid through bioconversion of lignocellulose by using Aspergillus niger. The method specifically comprises: inoculating cultured Aspergillus niger in a lignocellulose hydrolyzate to ferment so as to produce gluconic acid, wherein the gluconic acid concentration can achieve 80 g / L after fermentation for 96 h; or simultaneously adding Aspergillus niger being subjected to liquid culture, a lignocelluloses raw material, and cellulase into a reactor, and carrying out synchronous saccharification and fermentation so as to produce gluconic acid. According to the present invention, the method has characteristics of short time and high efficiency, the lignocellulose has the wide source and the low price, and the broad development space and the broad development prospects are provided.

The invention discloses a strawberry stratified cultivation matrix and a preparation method thereof. The matrix comprises a permeable layer, nutrient matrix layer and water retaining layer which are sequentially laminated; an anti-insect net is laid between the permeable layer and the nutrient matrix layer; the permeable layer is composed of ceramsites; the nutrient matrix layer is formed by mixing peat and perlite with a mass ratio of 6-7:3, the particle diameter of the peat is 0-6 millimeters, and the particle diameter of the perlite is 3-5 millimeters; the water retaining layer is composedof coconut bran particles. The method reduces the cost of the strawberry cultivation matrix, and reduces the cost by 38.5% compared with a prior compound matrix formula and the cost investment is reduced.