397 results about "Land grid array" patented technology

A method of packaging an integrated circuit die (12) includes the steps of providing a foil sheet (30) and forming a layer of solder (32) on a first side of the foil sheet. A first side of the integrated circuit die is attached to the solder on the foil sheet. The first side of the die has a layer of metal (34) on it and a second, opposing side of the die includes bonding pads (14). The bonding pads are electrically connected to the solder on the foil sheet with wires (16). The die, the electrical connections, and the first side of the foil sheet are encapsulated with a mold compound (20). The foil sheet is separated from the die and the wires, which forms a packaged integrated circuit (10).

A land grid array socket is provided which includes an insulative housing (22) having a plurality of passageways (24) each accommodating an electrical terminal (1) therein. Contacting ends (134) of the terminal in a same row of the passageways all extend along a predetermined lateral direction, and because of bend of a bending portion (132) in the terminal, the contacting end of the terminal in one passageway does not overlap with another terminal in an adjacent passageway along a vertical direction so as to avoid short circuit risk therebetween.

A memory card comprising a substrate which has a plurality of contacts and a plurality of metal features. The contacts and the metal features are disposed in spaced relation to each other and each define opposed first and second surfaces. Mounted to the substrate is at least one electronic component which is electrically connected thereto. A body covers the electronic component and at least portions of the contacts and the metal features such that the second surfaces of the contacts and the metal features are exposed in a common exterior surface of the body.

According to the present invention, a plastic land-grid array package, a plastic ball-grid package, and a plastic leaded package for micromechanical components are fabricated by a molding process characterized by placing a sheet-like protector on the surface of the components during the molding phase, selectively encapsulating the bonding pads and coupling members of the chip while leaving empty space above the components, removing the protector and attaching a lid over the components. A molding method as well as a molding apparatus are provided compatible with the sensitivity of the micromechanical devices, yet flexible with regard to the technique used to assemble the chip and the substrate. Furthermore, the method disclosed is flexible with regard to the material and the properties of the substrate. The invention is applicable to a variety of different semiconductor micromechanical devices, for instance actuators, motors, sensors, spatial light modulators, and deformable mirror devices. In a key embodiment of the invention, the micromechanical components are micromirrors for a digital mirror device.

A land grid array socket (1) includes an insulative base (2) mounted on a printed circuit board, a metal clip (3) pivotably engaged on the base, and a lever (4) for fastening the clip onto the base. The clip (3) and the lever are respectively mounted on two opposite ends of the base to fasten an LGA package. A reinforcing plate (5) made of rigid material is insert molded into the base. The reinforcing plate is generally a rectangular frame, and it includes four integrated sides (51). A substantially rectangular opening (52) is defined among the sides. Therefore, the rigidity of the base is improved, and the deformation or warpage under the pulling forces on two opposite ends of the base is diminished, thereby ensuring steady electrical connection between the contacts pads of the LGA package and respective contacts of the base.