80results about How to "Ensure electrical connection reliability" patented technology

The present invention relates to an electronic cigarette case, includes a case body, a charging device disposed in the case body for charging electronic cigarettes. The charging device includes a charging base, a rechargeable battery, and a control circuit board integrated with a circuit processing unit. The charging base has an electrode support where first and second electrode elements, and a trigger element spaced apart from the second electrode element are all disposed on the electrode support. The second electrode element is flexibly deformable when one of the electronic cigarettes is inserted into the case body to create a charging circuit. The circuit processing unit automatically controls the rechargeable battery for charging the electronic cigarette being inserted until it is full of power, whereby the electronic cigarette case is readily to be assembled and to sue, and has a reliable electrical connection with an outer power source.

An electrical connector is mounted on a corrugated coaxial cable. An electrical connection with the outer conductor of the cable is formed by compressing an elastomer body surrounding the end of the cable and flowing the body inwardly against the cable to hold a conductive member in electrical connection with the outer conductor.

An electromechanical braking (EMB) connector for electrical communication between an interior of a brake caliper assembly and an exterior of the brake caliper assembly is disclosed. The EMB connector includes a body having a distal end for insertion into the interior of the brake caliper assembly and a proximal end for exposure on the exterior of the brake caliper assembly, with the distal end and the proximal end defining a body axis. The EMB connector also includes a load sensor connector for coupling with a load sensor disposed on the interior of the brake caliper assembly. The load sensor connector is compressible along a load sensor axis that is substantially perpendicular to the body axis. The EMB connector further includes a conductive component coupled to the load sensor connector. The conductive component enables electrical connection of the load sensor to the exterior of the brake caliper assembly.

Some embodiments of an infusion pump system can include a controller device that communicates with a pump device, the pump device having a memory device. The controller device can be configured to record controller-related data, such as user profile data on the memory device of the pump device. This user profile data that is stored in the memory of the pump device can serves as a data backup system that permits the user to program a new controller device in a situation where the original controller device is lost or damaged. In addition or in the alternative, the controller device can be configured to receive controller-related data, such as software update programs or backup controller data, from the memory device of the pump device.

The present invention provides a method for constructing a universal LED bulb, a snap ring structured LED bulb and a lamp. The constructing method comprises: supporting an optical engine core member of the LED bulb in the lens snap ring (8) using a lens snap ring (8) as a supporting main body, using an inner snap ring (81) provided on the inner side of a light distribution optical lens (7) in the optical engine core member as an auxiliary supporting structure, and further using the inner snap ring (81) as an installation base of an optical engine module (4) and a heat conductive bracket (3) or an installation base of an LED bulb radiator (103); the optical engine core member of the LED bulb is composed of the heat conductive bracket (3), the optical engine module (4), the inner snap ring (81) and the light distribution optical lens (7).

A junction box for a photovoltaic system includes a housing having a base and a cover removably attached thereto, and a plurality of guide channels extending from an exterior surface of the housing to an interior portion thereof. The guide channels are sized and shaped to receive a plurality of conductive foil strips from a solar panel array. When the strips are fed into the guide channels, they are guided to and properly positioned within corresponding receptacles. Each receptacle is sized and shaped to receive a buss bar, and each strip is connected to a corresponding buss bar by a low insertion connector. When the cover is fully engaged with the base, bosses extending from the cover press against the connectors, creating a spring tension and pinch and retain the associated strip. As a result, a reliable physical and electrical connection between the strips and the buss bars is achieved. A heat sink having a plurality of fins protrude outwardly from the housing to dissipate heat externally.

A through-substrate via (TSV) structure includes at least two electrically conductive via segments embedded in a substrate and separated from each other by an electrically conductive barrier layer therebetween. The length of each individual conductive via segment is typically equal to, or less than, the Blech length of the conductive material so that the stress-induced back flow force, generated by each conductive barrier layer, cancels the electromigration force in each conductive via segment. Consequently, the TSV structures are immune to electromigration, and provide reliable electrical connections among a chips stacked in 3 dimensions.

A photovoltaic module generates electrical power when installed on a roof. The module is constructed as a laminated sandwich having a transparent protective upper layer adhered to a photovoltaic layer. The photovoltaic layer is adhered to the top of a rigid layer, preferably formed from a fiber reinforced plastic. A tapered edge seal is disposed about the peripheral outer edge of the module, so that water and debris easily run off. Preferably, the tapered edge seal is disposed adjacent the photovoltaic layer, and above the rigid substrate layer. The tapered edge seal is thinner at the outer peripheral portion thereof than at a portion thereof adjacent the photovoltaic layer. The laminated module preferably has a layer of double stick tape on the bottom to adhere the module to the surface of a roof.

An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.

The present invention relates to an adhesive tape for electrically connecting semiconductor chips in a chip-on-chip type semiconductor device. The adhesive tape comprising: (A) 10 to 50 wt % of film forming resin; (B) 30 to 80 wt % of curable resin; and (C) 1 to 20 wt % of curing agent having flux activity.

The present invention relates to a bipolar battery. It is an object of the present invention to provide a bipolar battery having a good productivity and a high reliability of the electrical connection with an apparatus when the battery is attached to various apparatuses. A bipolar battery 1 of the present invention includes a positive electrode 10, a negative electrode 11, a bipolar electrode 12, an electrolyte-containing separator 13, and a sealing member 14. Current collectors 20, 22, and 24 of the positive electrode 10, the negative electrode 11, and the bipolar electrode 12 are respectively provided with at least two projections 20a to 20d, 22a to 22d, and 24a to 24d, and these projections project from peripheral portions of the current collectors.

An information recording medium and manufacturing method for high-speed and high density recording. An inorganic film is formed by sputtering while applying a bias voltage to shift the substrate voltage potential in the negative direction, or a laminated film is formed by applying energy after coating a substrate with an organic film, and the irregularities maintained even after the laminated film is formed, so that stable, high-capacity and high-speed recording can be attained by forming a multi-information-layer that still retains the irregularities.

A lamp socket includes a socket body, a power supplying member and a socket cover. The socket body has a connecting hole formed in the socket body. The connecting hole is opened. The power supplying member is disposed in the connecting hole and an electrode supporting terminal having a supporting groove, so that supports an electrode portion of a lamp disposed in the power supplying member. The socket cover is partially and separably insertable in the connecting hole, to fix the electrode portion of the lamp. A backlight assembly includes a receiving container, a plurality of lamps and lamp sockets.

An electrical contact assembly electrical contact assembly comprises upper contact having a lower mating end at a lower end thereof, a lower contact having a base portion and a pair of mating beams extending vertically from the base portion for a length respectively and for engaging with the lower mating end of the upper contact, and a spring located between the upper contact and the lower contact. A channel is defined between the mating beams and providing a space to allow movement of the lower mating end. The pair of mating end has unequal lengths for providing unequal torque on the lower mating end, thus ensuring reliable electrical connection between the upper contact and lower contact even under worse circumstance.

There are provided a semiconductor device and method for fabricating the device capable of achieving reliable electrical connection by securely directly bonding conductors to each other even though bonding surfaces are polished by a CMP method and solid-state-bonded to each other. By polishing according to the CMP method, a through hole conductor 5 and a grounding wiring layer 10, which are made of copper, become concave in a dish-like shape and lowered in level, causing a dishing portion 17 since they have a hardness lower than that of a through hole insulator 11 made of silicon nitride. The through hole insulator 11 is selectively etched by a reactive ion etching method until the through hole insulator 11 comes to have a height equal to the height of a bottom portion 19 of the dishing portion 17 of the through hole conductor 5. The through hole conductors 5 and 25 are aligned with each other, and the bonding surfaces 12 and 22 are bonded to each other in a solid state bonding manner.

A semiconductor device including: a semiconductor chip including a substrate, an outer-connection electrode, and a bump, wherein the bump has a first conductive layer and a second conductive layer provided on the first conductive layer, and the second conductive layer is made of copper; a wiring board having a land; and an insulating material dispersed with conductive particles, wherein the conductive particles connect between the bump and the land, wherein an electrical connection is established by the conductive particles having penetrated to both the second conductive layer and the land.

A power device package according to the one embodiment of the present invention includes an insulating substrate with an interconnection pattern disposed on the insulating substrate. The interconnection pattern comprises a single conductive layer comprising a first metal layer, and a multiple conductive layer comprising another first metal layer and a second metal layer disposed on the another first metal layer. A plurality of wires are attached to an upper surface of the single conductive layer and/or an upper surface of the second metal layer of the multiple conductive layer. Contact pads on a power control semiconductor chip and a low power semiconductor chip driving the power control semiconductor chip are electrically connected to the wires.

A circuit board according to the present invention includes a main surface, a back surface parallel to the main surface, a side surface positioned between edges of the main surface and the back surface, and first and second board terminals covering a portion of the main surface and a portion of the side surface, respectively. According to the present invention, because the board terminals are provided not only on the main surface but also on the side surface of the circuit board, the total number of board terminals can be increased while maintaining sufficient pitch and width of the board terminals.

A piezoelectric device is a fired body including a body part 10 and external electrodes 21 and 22. A surface of the side electrode 22 is comprised only of a material for the side electrode 22. On a surface of the surface electrode 21 or a surface of a connection portion where the surface electrode 21 and the side electrode 22 are connected to each other, a protrusion h extending along a direction along which the connection portion extends and sticking out in a thickness direction of the surface electrode 21 is provided. A region, on the surface of the surface electrode 21, farther from the connection portion than the protrusion h is interspersed with a plurality of exposed portions in each of which a surface of a ceramic material having lower solder wettability than a material for the surface electrode 21 is exposed.

A battery wiring module to be mounted on a unit cell group formed by arranging a plurality of unit cells including positive and negative electrode terminals includes a terminal to be electrically connected to the electrode terminal, a detection wire for detecting a state of the unit cell by being electrically connected to the terminal, and a resin protector including a terminal accommodating portion for accommodating the terminal, a wire accommodation groove for accommodating the detection wire and a through groove allowing communication between the terminal accommodating portion and the wire accommodation groove and used to pull out the detection wire connected to the terminal into the wire accommodation groove. The detection wire is bent at least at two or more positions in the wire accommodation groove or the through groove and held in a bent state while being routed in the resin protector.

A battery pack having a battery in which a battery case and a cap of a sealing plate sealing an open end of the battery case serve as connection electrodes of opposite polarities, a terminal unit including external connection terminals respectively connected to these connection electrodes and an insulating cover integrally formed therewith, the terminal unit covering at least one end of the battery case, and a resilient member interposed between one end of the battery case and the terminal unit in a compressed state. In the manufacturing method of this battery pack, the dimension between the terminal unit and the other end of the battery case is controlled when fixing the terminal unit with the battery case. The battery pack thus has a simple and low cost configuration and yet exhibits high reliability in terms of the connection state of the external connection terminals when set in a portable electronic device.

The present invention discloses a method for constructing a universal LED bulb, a flange snap ring type LED bulb and a lamp. A heat conductive bracket (3) with a flange is used as a structure supporting main body of the bulb to establish an optical engine core member of the LED bulb. An inner snap ring (81) fixed to the heat conductive bracket (3) is used to support the optical engine core member in an auxiliary manner. The optical engine core member is composed of the heat conductive bracket (3), an optical engine module (4), the inner snap ring (81), an inner cover (6), an electric connector (11) and a light distribution optical lens (7). The optical engine module (4) is made up of an optical engine die plate, an LED chip and a relevant wiring by bonding and packaging, or is further integrated with a power supply drive chip.

A display apparatus includes a display panel on which a pad part is formed, a driving chip including bumps making contact with the pad part, and a non-conductive adhesive film disposed between the display panel and the driving chip attaching the driving chip to the pad part. Each of the bumps includes a step-difference portion including a non-conductive elastic polymer and a bump line formed on the step-difference portion. The bump line is provided with a fine pattern through which a portion of the step-difference portion is exposed, and the bump line makes contact with the pad part. Accordingly, the reliability of the electrical connection between the driving chip and the display panel may be increased.

A probe which is cleaning-free, of which rubbing operation can be precisely controlled, and can be used for narrow-pitch pads, is provided. The probe assembly includes: a Z-deforming portion elastically deformable at least in a vertical direction; a tip contact element which includes a contact portion having a curved section, the tip contact element being connected to and supported on an end of the Z-deforming portion via an arm member, the contact portion being made to contact with an electrode pad and is vertically displaceable and rotatable; and a stopper for restricting movement of the tip contact element. After the tip contact element is rotated, due to pushing force from the electrode pad, for a certain distance in a direction of rotation, the stopper controls the movement of the tip contact element to prevent further rotation and to allow vertical movement.

An illumination device for a cigar lighter or for a multifunction socket, comprising a single-piece component made from material at least partially transmitting light, the component comprising an illuminating ring and a housing for a printed circuit provided with at least one light-emitting diode and electrical connection means.

A display apparatus includes a first substrate and a second substrate. The first substrate includes a switching element and a pixel electrode electrically connected to the switching element. A display panel driver applies a driving signal to the display panel. The display panel driver includes a printed circuit board including a first bonding pad and a flexible substrate electrically connecting the printed circuit board with the display panel. The flexible substrate includes a second bonding pad. The second bonding pad is electrically connected to the first bonding pad of the printed circuit board. The first bonding pad overlaps the second bonding pad. At least a portion of the first bonding pad and at least a portion of the second bonding pad extend in a direction which is at an acute angle with respect to a first direction parallel with a relatively longer side of the display panel.

An outer conductor terminal (22) includes a body (28) surrounding an outer periphery of an inner conductor terminal (21) and having a rear opening and a lid (29) for closing the opening of the body (28). Body-side locks (43) are provided on side surfaces of the body (28). The lid (29) has side portions (52) for covering the side surfaces of the body (28). The side portions (52) are provided with front abutting portions (54) contacting the body-side locks (43) from the front. The lid (29) has rear abutting portions (56) contacting the body-side locks (43) from behind to sandwich the body-side lock portions (43) between the front abutting portions (54) and the rear abutting portions (56) and to hold the lid (29). The body-side locks (43) include contact portions (45) that contact the rear abutting portions (56) with resilient forces.